RO3003 PCB 2-layer 10mil 0.254mm Rogers 3003ENIG Finish High-Frequency RF Board
Introduction
Our newly shipped RO3003 2-layer PCB is a high-frequency, high-performance printed circuit board designed for demanding RF and microwave applications. Engineered with Rogers RO3003 ceramic-filled PTFE laminate, this 10mil RO3003 PCB offers exceptional electrical stability, low signal loss, and reliable thermal performance. With a 10mil substrate thickness and 1 oz copper weight, this board is optimized for applications such as automotive radar (77 GHz), 5G infrastructure, and advanced wireless communications.
This product description provides a comprehensive breakdown of the Rogers RO3003 PCB’s construction, stackup, material properties, and key benefits, ensuring engineers and procurement specialists have all necessary technical details for integration into high-frequency systems.
PCB Construction Details
The following table summarizes the RO3003 PCB construction specifications, ensuring compliance with IPC-Class-2 standards and suitability for high-frequency applications.
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Parameter
|
Specification
|
|
Base Material
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Rogers RO3003 (Ceramic-filled PTFE)
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|
Layer Count
|
2 layers
|
|
Board Dimensions
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45mm x 44.5mm (1 PC)
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|
Minimum Trace/Space
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4/4 mils
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|
Minimum Hole Size
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0.3mm
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|
Blind/Buried Vias
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No
|
|
Finished Board Thickness
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0.3mm
|
|
Finished Cu Weight
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1 oz (35μm) outer layers
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|
Via Plating Thickness
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20 μm
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Surface Finish
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Immersion Gold (ENIG)
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Top Silkscreen
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Black
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|
Bottom Silkscreen
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No
|
|
Top Solder Mask
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No
|
|
Bottom Solder Mask
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No
|
|
Electrical Testing
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100% tested prior to shipment
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PCB Stackup: 2-Layer Rigid PCB
The stackup configuration ensures optimal signal integrity and thermal performance for high-frequency applications.
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Layer
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Material/Thickness
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|
Top Layer (L1)
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Copper - 35μm (1 oz)
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|
Core Substrate
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Rogers RO3003 - 10mil (0.254mm)
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|
Bottom Layer (L2)
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Copper - 35μm (1 oz)
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PCB Statistics
The following table outlines the component and connectivity details of the 0.254 mm RO3003 PCB.
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Parameter
|
Value
|
|
Components
|
22
|
|
Total Pads
|
65
|
|
Thru-Hole Pads
|
41
|
|
Top SMT Pads
|
24
|
|
Bottom SMT Pads
|
0
|
|
Vias
|
43
|
|
Nets
|
2
|
Additional Specifications
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Artwork Format: Gerber RS-274-X
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Accepted Standard: IPC-Class-2
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Availability: Worldwide
RO3003 Material Overview
Rogers 3003 is a ceramic-filled PTFE composite engineered for high-frequency applications up to 77 GHz and beyond. Its key advantages include:
Key Features
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Dielectric Constant (Dk): 3.00±0.04 @ 10 GHz/23°C
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Dissipation Factor (Df): 0.001 @ 10 GHz/23°C
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Thermal Decomposition (Td): > 500°C
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Thermal Conductivity: 0.5 W/mK
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Moisture Absorption: 0.04%
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CTE (Coefficient of Thermal Expansion):
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X/Y-axis: 17/16 ppm/°C
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Z-axis: 25 ppm/°C
Benefits of RO3003
✔Low dielectric loss–Ideal for mmWave (5G, automotive radar)
✔Stable Dk vs. temperature/frequency–Ensures consistent RF performance
✔Low Z-axis CTE–Reduces risk of via cracking in thermal cycling
✔Excellent dimensional stability–Critical for high-frequency circuits
✔Compatible with hybrid multilayer designs–Can be mixed with FR4
Typical Applications
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Automotive Radar (77 GHz ADAS systems)
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5G mmWave Base Stations & Antennas
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Satellite Communication (GPS, DBS)
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RF Power Amplifiers & Patch Antennas
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Military/Aerospace RF Systems
Conclusion
This RO3003 2-layer 10mil PCB is a high-reliability, high-frequency solution for advanced RF and microwave applications. With precision manufacturing, strict IPC-Class-2 compliance, and Rogers’superior material properties, this RO3003 high frequency PCB is an excellent choice for engineers working on automotive radar, 5G, and satellite communications.
For worldwide availability and customization options, contact our sales team for further details.
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