F4BTM300 Wangling PCB 40mil High-Frequency Circuitry Immersion gold

F4BTM300 Wangling PCB 40mil High-Frequency Circuitry Immersion gold 

Introduction

Stepping into the realm ofhigh-frequency circuitry,Wangling F4BTM300 PCB emerges as a beacon of technological prowess, meticulously crafted to redefine standards in electronic engineering. Combining a blend of fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin through precise pressing processes, this series embodies a new era of innovation. Built upon the robust F4BM dielectric layer, enhanced with high dielectric and low-loss nano-ceramics, the F4BTM300 PTFE F4B PCB offers a higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, elevated insulation resistance, and superior thermal conductivity, all while maintaining minimal loss characteristics.

Unveiling F4BTM300 and F4BTME300

Distinguishing itself within the series, the F4BTM300 and F4BTME300 share a common dielectric layer but diverge in their copper foils. The F4BTM300 features ED copper foil, ideal for applications not requiring PIM considerations. In contrast, the F4BTME300 is paired with reverse-treated (RTF) copper foil, guaranteeing exceptional PIM performance, precise line control, and reduced conductor loss, catering to even the most demanding applications.

Key Features of F4BTM300

1)Dielectric Constant (Dk):

A remarkable Dk of 3.0 at 10GHz ensures stable and efficient signal propagation.

2)Dissipation Factor:

With a dissipation factor of 0.0018 at 10GHz, the F4BTM300 minimizes signal loss.

3)Coefficient of Thermal Expansion (CTE): 

Across the x-axis, y-axis, and z-axis, the CTE values of 15 ppm/°C, 16 ppm/°C, and 78 ppm/°C, respectively, ensure thermal stability from -55°C to 288°C.

4)Low Thermal Coefficient of Dk:

A low thermal coefficient of Dk at -78 ppm/°C between -55°C to 150°C guarantees consistent performance under varying temperatures.

5)Moisture Absorption:

With a moisture absorption rate of ≤0.05%, the PCB maintains its integrity even in humid conditions.

6)Flammability:

The UL-94 V0 rating underscores the PCB's flame-retardant properties, ensuring safety and reliability.

PCB Stackup and Construction Details

The F4BTM300 PCB is structured as a 2 layer circuit board, comprising:

Copper Layer 1: 35 μm

F4BTM300 Core: 1.016 mm (40mil)

Copper Layer 2: 35 μm

Construction Specifications:

PCB Statistics

Type of Artwork: Gerber RS-274-X, ensuring compatibility with industry standards

Quality Standard:IPC-Class-2, reflecting adherence to stringent quality benchmarks

Availability: Worldwide, catering to a global clientele

Applications

The versatility of the F4BTM300 40mil F4B substrate PCB extends to various high-frequency applications, including:

Microwave, RF, and Radar Systems

Phase Shifters

Power Dividers, Couplers, Combiners

Feed Networks

Phase-sensitive Antennas, Phased Array Antennas

Satellite Communications

Base Station Antennas

Conclusion

In conclusion, the F4BTM300 high frequency PCB 40mil stands as a pinnacle of innovation, offering unparalleled performance and reliability in high-frequency circuit design. With a focus on precision, quality, and technological advancement, this PCB series sets a new standard in electronic engineering. Explore the possibilities, elevate your projects, and embrace the future of high-frequency applications with Wangling's F4BTM300 PCB. Redefine excellence, redefine performance—experience the difference with F4BTM300.