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Home PCB Prototype Fast PCB Quick Turn Prototype 4-layer Circuit Board FR-4 With 2oz and Immersion Gold

Fast PCB Quick Turn Prototype 4-layer Circuit Board FR-4 With 2oz and Immersion Gold

This is a type of fast lead time required multilayer PCB built on FR-4 substrate with Tg 150°C for the application of Power Supply Switch.




  • Item NO.:

    BIC-457-v92.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Fast PCB Quick Turn Prototype 4-layer Circuit Board Built On FR-4 With 2oz and Immersion Gold

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)


1.1 General description


It's standard 1.60 mm thick, white silkscreen over green solder mask covers both sides. This is a power board, each layer true 2oz applied and thicker gold 4 micro inches are plated on the pads. The base material is used from ITEQ IT-158, entire board supplying 1 up PCB. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.


1.2 Features and benefits    

 

1. Middle Tg PCB Shows outstanding thermal resistance and suitable for lead-free process;

2. Very Low Moisture Absorption and better CAF resistance;

3. Gold has good oxidation resistance and good heat dissipation;

4. Gold has long storage time, it can be stored for more than 1 year in vacuum bag;

5. Competitive price and On-time service;

6. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;

7. More than 18+ years of PCB experience;

8. Customer complaint rate: <1%

9. Door to door shipment service;


Fast PCB


1.3 PCB Specifications


PCB SIZE 78 x 65mm=1PCS
BOARD TYPE Multilayer PCB
Number of Layers 4 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 70um(2oz)+plate TOP layer
Prepreg 7628 0.195mm
copper ------- 70um(2oz) MidLayer 1
FR-4 0.2mm
copper ------- 70um(1oz) MidLayer 2
Prepreg 7628 0.195mm
copper ------- 70um(2oz)+plate BOT layer
TECHNOLOGY
Minimum Trace and Space: 11.81 mil / 7.8 mil
Minimum / Maximum Holes: 0.5 mm / 3.5 mm
Number of Different Holes: 7
Number of Drill Holes: 125
Number of Milled Slots: NO
Number of Internal Cutouts: NO
Impedance Control: NO
Number of Gold finger: NO
BOARD MATERIAL
Glass Epoxy:  FR-4 Tg150℃, er<5.4.IT-158,  ITEQ Supplied
Final foil external:  2 oz
Final foil internal:  2 oz
Final height of PCB:  1.6 mm ±0.16
PLATING AND COATING
Surface Finish Immersion gold (32.1% ) 0.1µm over 3µm nickel
Solder Mask Apply To:  TOP and Bottom, 14 micron Minimum
Solder Mask Color:  Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.5 mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


1.4 Applications


Radar Detector   

Multiplexer   

Embedded System

Wireless Alarm    

5G Booster

Peripheral Device

Mobile Modem    

RF Amplifiers

Balanced Mixer

Relays (automotive and industrial)


Fast PCB Board


1.5 Capability of Fast Delivery


Types Normal Lead time (≦1㎡) Fast Lead Time (≦1㎡)
2L 5 Days 1 Day
4L 5 Days 2 Days
6L 6 Days 3 Days
8L 7 Days 4 Days
10L 9 Days 6 Days
12L 10 Days 6 Days
14L 13 Days 7 Days
16L 14 Days 7 Days
18L 15 Days 9 Days
20L 16 Days 10 Days
22L 17 Days 11 Days
24L 18 Days 12 Days
26L 19 Days 13 Days
28L 20 Days 14 Days
30L 21 Days 15 Days
32L 22 Days 16 Days
>32 Layers Pending Pending
Note:
1.The lead time is for new order
2.Exclude Sunday, holidays
3.There's Order limitation every day.
4.Exclude shipping time
5.Exclude special technics, such as heavy copper, peelable mask, blind/buried via etc.
6.Exclude communications for engineering questions.


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