High Tg PCB Made on S1000-2M and 90 Ohm Impedance Control

This is a type of high Tg PCB with differential impedance on layer 3 at 6mil/7mil, 6mil/10mil.

Item NO.:
BIC-505-v81.0
Order(MOQ):
1-10
Payment:
T/T
Price Range:1 - 50/$2.9
Price Range:1 - 50/$99
Product Origin:
China
Shipping Port:
Shenzhen
Lead Time:
7-10 days

Product Detail

High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

This is layer 4 at 7mil/7mil and 6mil/7mil track/gap. It is made on high performance and low CTE FR-4 S1000-2M. It’s 6-layer board with 1 oz copper each layer, coating with hot air soldering level (HASL) and green solder mask. It’s supplied by individual board with V-cut. 25 boards are packed for shipment.

Applications

Computers

Communications

Automotive electronics etc.

6layer S1000-2M PCB

PCB Parameters

Item	Description	Requirement	Actual	Result
1. Laminate	Material Type	FR-4 S1000-2M	FR-4 S1000-2M	ACC
	Tg	170℃	170℃	ACC
	Supplier	SHENGYI	SHENGYI	ACC
	Thickness	1.6±10% mm	1.63-1.68mm	ACC
2.Plating thickness	Hole Wall	≥25µm	30.17µm	ACC
	Outer copper	35µm	41.09µm	ACC
	Inner Copper	30µm	33.69µm	ACC
3.Solder mask	Material Type	TAIYO/ PSR-2000GT600D	TAIYO/ PSR-2000GT600D	ACC
	Color	Green	Green	ACC
	Rigidity (Pencil Test)	≥4H or above	5H	ACC
	S/M Thickness	≥10 µm	20.11µm	ACC
	Location	Both Sides	Both Sides	ACC
4. Component Mark	Material Type	TAIYO/ IJR-4000 MW300	IJR-4000 MW300	ACC
	Color	White	White	ACC
	Location	C/S	C/S	ACC
5. Peelable Solder Mask	Material Type
	Thickness
	Location
6. Identification	UL Mark	YES	YES	ACC
	Date Code	WWYY	0421	ACC
	Mark Location	Solder Side	Solder Side	ACC
7. Surface Finish	Method	HASL Lead Free	HASL Lead Free	ACC
	Tin Thickness	3-6µm	4.06µm	ACC
	Nickel Thickness
	Gold Thickness
8. Normativeness	RoHS	Directive 2015/863/EU	OK	ACC
8. Normativeness	REACH	Directive 1907 /2006	OK	ACC
9.Annular Ring	Min. Line Width (mil)	6mil	5.8mil	ACC
9.Annular Ring	Min. Spacing (mil)	5mil	5.2mil	ACC
10.V-groove	Angle
10.V-groove	Residual thickness
11. Beveling	Angle
11. Beveling	Height
12. Function	Electrical Test	100% PASS	100% PASS	ACC
13. Appearance	IPC Class Level	IPC-A-600J &6012D Class 2	IPC-A-600J &6012D Class 2	ACC
	Visual Inspection	IPC-A-600J &6012D Class 2	IPC-A-600J &6012D Class 2	ACC
	Warp and Twist	≦0.7%	0.21%	ACC
14. Reliability Test	Tape Test	No Peeling	OK	ACC
	Solvent Test	No Peeling	OK	ACC
	Solderability Test	265 ±5℃	OK	ACC
	Thermal Stress Test	288 ±5℃	OK	ACC
	Ionic Contamination Test	≦1.56µg/c㎡	0.56µg/c㎡	ACC

Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05

Hole Code	PTH	Required	Actual value				Result
1	Y	0.375	0.375	0.400	0.400	0.375	ACC
2	Y	0.500	0.500	0.550	0.525	0.525	ACC
3	Y	0.7*2.4	0.7*2.4	0.7*2.41	0.69*2.4	0.7*2.4	ACC
4	Y	0.625	0.625	0.600	0.625	0.600	ACC
5	Y	0.725	0.725	0.725	0.750	0.725	ACC
6	Y	0.900	0.925	0.900	0.900	0.900	ACC
7	Y	1.000	1.000	0.950	0.975	1.000	ACC
8	N	1.050	1.050	1.050	1.075	1.050	ACC
9	Y	1.300	1.300	1.300	1.325	1.325	ACC
10	Y	1.350	1.350	1.325	1.350	1.325	ACC
11	Y	1.575	1.575	1.600	1.600	1.575	ACC
12	Y	1.650	1.650	1.700	1.675	1.675	ACC
13	Y	1.700	1.700	1.750	1.725	1.725	ACC
14	Y	3.250	3.250	3.250	3.275	3.250	ACC
15	Y	3.450	3.450	3.400	3.425	3.450	ACC
16	Y	0.7*2.6	0.7*259	0.7*2.61	0.69*2.6	0.7*2.59	ACC

Impedance Test Report

Sample NO.	Layer	Line Width（mil)±10%	Line Space（mil)±10%	Impedance Type		Required Value (ohm)	Tolerance	Actual Value	Result
Sample NO.	Layer	Line Width（mil)±10%	Line Space（mil)±10%	Single End	Differential	Required Value (ohm)	Tolerance	Actual Value	Result
1	L3	6.000	7.000		V	90.00	±10%	93.59	ACC
	L3	6.000	10.000		V	100.00	±10%	102.33	ACC
	L4	7.000	7.000		V	90.00	±10%	88.99	ACC
	L4	6.000	7.000		V	90.00	±10%	90.76	ACC

BICHENG PCB WORKSHOP:

BICHENG PCB CERTIFICATE:

BICHENG MAIN COURIERS:

Hot Tags :

S1000-2M Impedance Control PCB High Tg Impedance Control PCB Impedance Control ENIG PCB FR-4 90 Ohm Impedance Control PCB FR-4 High Tg Printed Circuit Board FR-4 Immersion Gold PCB

Leave A Message

If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

Subject : High Tg PCB Made on S1000-2M and 90 Ohm Impedance Control

Categories

New Products

Related Products

90 Ohm Impedance Controlled | Single End Differential Impedance Printed PCB Board

This is a type of 10-layer PCB circuit board built on FR-4 substrate with Tg 180°C for the application of signal generator.

TU-883 Multi-layer HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

This is a type of low loss high performance multi-layer PCB built on TUC’s TU-883 core with 20 copper layers (20-layer PCB).

Aluminum Screen Printing Framed SMT Laser Cut PCB Stencil

SMT stencil in our house, framed or frameless are 100% laser cut. The thickness of stainless steel foil ranges from 0.05mm to 0.4mm, with size 300mm x 300mm to 600mm x 600mm.

Wangling F4BTME350 10mil DK3.5 High Frequency Substrate PCB 2-Layer Immersion Gold

The F4BTME350 2-layer ENIG PCB combines high-frequency electrical performance, mechanical stability, and manufacturing quality.

Taconic RF-35 PCB 2-layer 10mil 0.254mm Immersion silver High Frequency Board

The RF-35 2-layer 10mil PCB is a high-performance, cost-effective solution for RF and microwave applications, leveraging Taconic’s advanced laminate technology.

Customized High Frequency PCB Rogers 10mil 0.254mm RO4350B Double Sided RF PCB

RO4350B can use standard epoxy/glass cloth processing, while providing a tightly controlled dielectric constant and loss, at a fraction of the price of traditional microwave materials.

Wangling 2-Layer F4BTMS300 PCB 0.127mm DK3.0 Laminate ENIG Surface Finish

The 2-layer F4BTMS300 ENIG PCB with a 0.127 mm core represents a purpose-built solution for high-frequency applications demanding uncompromising signal integrity and thermal stability.

3 Layer High Frequency PCB Built On 60mil RO4350B 6.6mil ENIG

Multilayer high frequency PCBs are made from all high frequency material inclusive of prepreg adhesive.