TU-883 Multi-layer Impedance Controlled PCB

TU-883 Multi-layer HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

This is a type of low loss high performance multi-layer PCB built on TUC’s TU-883 core with 20 copper layers (20-layer PCB).

Item NO.:
BIC-509-v85.0
Order(MOQ):
1-10
Payment:
T/T
Price Range:1 - 50/$2.9
Price Range:1 - 50/$99
Product Origin:
China
Shipping Port:
Shenzhen
Lead Time:
7-10 days

Product Detail

TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

It’s also a type of HDI circuit boards (N+1+N) with 0.1mm laser drill. This is also a type of impedance controlled PCB, 90 Ohms and 50 Ohms are controlled on each signal layers with 10% tolerance. The copper foils are 1 oz and half oz used alternately between layers. The whole PCB is 3.0mm thick, with immersion gold on pads, green solder mask and white silkscreen.

Applications

Radio frequency

Backplane, High performance computing

Line cards, Storage

Servers, Telecom, Base station, Office Routers

TU-883 HDI PCB

Detailed Specifications

Item	Description	Actual	Result
1. Laminate	Material Type	TU-883	ACC
	Tg	170℃	ACC
	Supplier	TUC	ACC
	Thickness	2.8-3.1mm	ACC
2.Plating thickness	Hole Wall	26.51µm	ACC
	Outer copper	41.09µm	ACC
	Inner Copper	15µm / 31µm	ACC
3.Solder mask	Material Type	TAIYO/ PSR-2000GT600D	ACC
	Color	Green	ACC
	Rigidity (Pencil Test)	5H	ACC
	S/M Thickness	20.11µm	ACC
	Location	Both Sides	ACC
4. Component Mark	Material Type	IJR-4000 MW300	ACC
	Color	White	ACC
	Location	C/S, S/S	ACC
5. Peelable Solder Mask	Material Type	/
	Thickness	/
	Location	/
6. Identification	UL Mark	YES	ACC
	Date Code	2921	ACC
	Mark Location	Solder Side	ACC
7. Surface Finish	Method	Immersion Gold	ACC
	Nickel Thickness	4.06µm	ACC
	Gold Thickness	0.056µm	ACC
8. Normativeness	RoHS	Directive 2015/863/EU	ACC
8. Normativeness	REACH	Directive 1907 /2006	ACC
9.Annular Ring	Min. Line Width (mil)	4.8mil	ACC
9.Annular Ring	Min. Spacing (mil)	5.2mil	ACC
10.V-groove	Angle	/
10.V-groove	Residual thickness	/
11. Beveling	Angle	/
11. Beveling	Height	/
12. Function	Electrical Test	100% PASS	ACC
13. Appearance	IPC Class Level	IPC-A-600J &6012D Class 2	ACC
	Visual Inspection	IPC-A-600J &6012D Class 2	ACC
	Warp and Twist	0.21%	ACC
14. Reliability Test	Tape Test	No Peeling	ACC
	Solvent Test	No Peeling	ACC
	Solderability Test	265 ±5℃	ACC
	Thermal Stress Test	288 ±5℃	ACC
	Ionic Contamination Test	0.56µg/c㎡	ACC

Stackup & Impedance Controlled

Stack up and Impedance Control

HDI vias

Holes, Via, Blind via, Buried via

MANUFACTURING PROCESS:

PCB MANUFACTURING PROCESS

BICHENG PCB WORKSHOP:

BICHENG PCB CERTIFICATE:

BICHENG MAIN COURIERS:

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TU-883 Impedance Controlled PCB TU-883 HDI PCB Multi-layer High Temperature PCB Multi-layer 90 Ohm Impedance Controlled PCB HDI Impedance Controlled PCB Low Loss Impedance Controlled PCB

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