Shenzhen Bicheng
Electronics Technology Co., Ltd

# Call Us Now ! Tel : +86 755 27374946

# Order Online Now ! Email : info@bichengpcb.com

Hybrid PCB
Hybrid PCB
Products
Home Impedance Controlled PCB TU-883 Multi-layer HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

TU-883 Multi-layer HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

This is a type of low loss high performance multi-layer PCB built on TUC’s TU-883 core with 20 copper layers (20-layer PCB).


  • Item NO.:

    BIC-509-v85.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Brief Introduction


It’s also a type of HDI circuit boards (N+1+N) with 0.1mm laser drill. This is also a type of impedance controlled PCB, 90 Ohms and 50 Ohms are controlled on each signal layers with 10% tolerance. The copper foils are 1 oz and half oz used alternately between layers. The whole PCB is 3.0mm thick, with immersion gold on pads, green solder mask and white silkscreen.


Applications


Radio frequency

Backplane, High performance computing

Line cards, Storage

Servers, Telecom, Base station, Office Routers


TU-883 HDI PCB


Detailed Specifications


Item  Description  Actual Result
1. Laminate           Material Type TU-883 ACC
Tg 170℃ ACC
Supplier TUC ACC
Thickness 2.8-3.1mm ACC
2.Plating thickness       Hole Wall 26.51µm ACC
Outer copper 41.09µm ACC
Inner Copper 15µm / 31µm ACC
3.Solder mask                   Material Type TAIYO/ PSR-2000GT600D ACC
Color  Green ACC
Rigidity (Pencil Test) 5H ACC
S/M Thickness 20.11µm ACC
Location Both Sides ACC
4. Component Mark    Material Type IJR-4000 MW300 ACC
Color White ACC
Location C/S, S/S ACC
5. Peelable Solder Mask  Material Type /
Thickness /
Location /
6. Identification        UL Mark YES ACC
Date Code 2921 ACC
Mark Location Solder Side ACC
7. Surface Finish Method Immersion Gold ACC
Nickel Thickness 4.06µm ACC
Gold Thickness 0.056µm ACC
8. Normativeness RoHS Directive 2015/863/EU ACC
REACH Directive 1907 /2006 ACC
9.Annular Ring  Min. Line Width (mil) 4.8mil ACC
Min. Spacing (mil) 5.2mil ACC
10.V-groove  Angle /
Residual thickness /
11. Beveling  Angle /
Height /
12. Function                 Electrical Test 100% PASS ACC
13. Appearance     IPC Class Level IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 ACC
Warp and Twist 0.21% ACC
14. Reliability Test Tape Test No Peeling ACC
Solvent Test No Peeling ACC
Solderability Test 265 ±5℃ ACC
Thermal Stress Test 288 ±5℃ ACC
Ionic Contamination Test 0.56µg/c㎡ ACC


Stackup & Impedance Controlled


Stack up and Impedance Control


HDI vias


Holes, Via, Blind via, Buried via


MANUFACTURING PROCESS:


PCB MANUFACTURING PROCESS



BICHENG PCB WORKSHOP:



BICHENG PCB CERTIFICATE:



BICHENG MAIN COURIERS:


Leave A Message

If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

Related Products
 Impedance Controlled PCB Board
90 Ohm Impedance Controlled | Single End Differential Impedance Printed PCB Board

This is a type of 10-layer PCB circuit board built on FR-4 substrate with Tg 180°C for the application of signal generator.

High Tg 90 Ohm Impedance Control PCB
High Tg PCB Made on S1000-2M and 90 Ohm Impedance Control

This is a type of high Tg PCB with differential impedance on layer 3 at 6mil/7mil, 6mil/10mil.

Multilayer Flexible Printed Circuit
Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper

This type of flexible circuit is for the application of AC power systems.

High Density Interconnect FR-4 PCB
High Density Interconnect (HDI) PCB Circuit Board 14-Layer FR-4 Tg170℃ With Immersion Gold

This is a type of 14-layer HDI printed circuit board built on FR-4 Tg170 substrate for the application of codec equipment. 

RO4535 High Frequency PCB
RO4535 High Frequency PCB Rogers 4535 30mil 0.762mm Antenna Circuit Board 2-Layer

This is a type of antenna PCB made on Rogers RO4535 with 30mil substrate, starting 0.5oz copper, finished 1oz copper.

Rogers 15mil TMM10 PCB
Rogers 15mil TMM10 High Frequency PCB With Green Solder Mask

Rogers’ TMM10 thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications.

Hybrid RF High Frequency PCB
Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin

The board is designed as a 4-layer structure, because 4-layer PCB is relatively simple and inexpensive

FPC Polyimide 90ohm Impedance Controlled
Flexible Printed Circuit FPC on Polyimide with 90ohm Impedance Controlled

This is a type of flexible PCB built on polyimide 76 micron substrate with 90 ohm impedance controlled on 0.15mm/0.3mm track and gap for the application of USB Connector.

© Copyright: 2022 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.

IPv6 network supported

IPv6 network supported

top

Leave A Message

Leave A Message

    If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

  • #
  • #
  • #