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Home Impedance Controlled PCB TU-883 Multi-layer HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

TU-883 Multi-layer HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

This is a type of low loss high performance multi-layer PCB built on TUC’s TU-883 core with 20 copper layers (20-layer PCB).


  • Item NO.:

    BIC-509-v85.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Brief Introduction


It’s also a type of HDI circuit boards (N+1+N) with 0.1mm laser drill. This is also a type of impedance controlled PCB, 90 Ohms and 50 Ohms are controlled on each signal layers with 10% tolerance. The copper foils are 1 oz and half oz used alternately between layers. The whole PCB is 3.0mm thick, with immersion gold on pads, green solder mask and white silkscreen.


Applications


Radio frequency

Backplane, High performance computing

Line cards, Storage

Servers, Telecom, Base station, Office Routers


TU-883 HDI PCB


Detailed Specifications


Item  Description  Actual Result
1. Laminate           Material Type TU-883 ACC
Tg 170℃ ACC
Supplier TUC ACC
Thickness 2.8-3.1mm ACC
2.Plating thickness       Hole Wall 26.51µm ACC
Outer copper 41.09µm ACC
Inner Copper 15µm / 31µm ACC
3.Solder mask                   Material Type TAIYO/ PSR-2000GT600D ACC
Color  Green ACC
Rigidity (Pencil Test) 5H ACC
S/M Thickness 20.11µm ACC
Location Both Sides ACC
4. Component Mark    Material Type IJR-4000 MW300 ACC
Color White ACC
Location C/S, S/S ACC
5. Peelable Solder Mask  Material Type /
Thickness /
Location /
6. Identification        UL Mark YES ACC
Date Code 2921 ACC
Mark Location Solder Side ACC
7. Surface Finish Method Immersion Gold ACC
Nickel Thickness 4.06µm ACC
Gold Thickness 0.056µm ACC
8. Normativeness RoHS Directive 2015/863/EU ACC
REACH Directive 1907 /2006 ACC
9.Annular Ring  Min. Line Width (mil) 4.8mil ACC
Min. Spacing (mil) 5.2mil ACC
10.V-groove  Angle /
Residual thickness /
11. Beveling  Angle /
Height /
12. Function                 Electrical Test 100% PASS ACC
13. Appearance     IPC Class Level IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 ACC
Warp and Twist 0.21% ACC
14. Reliability Test Tape Test No Peeling ACC
Solvent Test No Peeling ACC
Solderability Test 265 ±5℃ ACC
Thermal Stress Test 288 ±5℃ ACC
Ionic Contamination Test 0.56µg/c㎡ ACC


Stackup & Impedance Controlled


Stack up and Impedance Control


HDI vias


Holes, Via, Blind via, Buried via


MANUFACTURING PROCESS:


PCB MANUFACTURING PROCESS



BICHENG PCB WORKSHOP:



BICHENG PCB CERTIFICATE:



BICHENG MAIN COURIERS:


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