6-Layer Rogers RO4350B PCB RO4450F Bondply 1.8mm Thick ENIG Blind Via Multilayer Board

6-Layer Rogers RO4350B PCB RO4450F Bondply 1.8mm Thick ENIG Blind Via Multilayer Board

Product Overview

The 6-Layer RO4350B PCB is a high-frequency, high-reliability printed circuit board designed for demanding RF and microwave applications. Engineered with Rogers RO4350B core material and RO4450F bondply, this PCB offers superior signal integrity, thermal stability, and low-loss performance. The multilayer board features blind vias, immersion gold (ENIG) surface finish, and a 1.8mm thickness, making it ideal for advanced wireless communication, automotive radar, and aerospace systems.

With strict impedance control, low dielectric loss, and excellent thermal management, this PCB ensures optimal performance in high-frequency environments. Manufactured to IPC-Class-2 standards, it undergoes 100% electrical testing before shipment, guaranteeing reliability for mission-critical applications.

1. PCB Construction details

The fundamental characteristics of this PCB are as follows:

2. PCB Stackup Structure

This 6-layer PCB utilizes ahybrid stackup with RO4350B cores and RO4450F bondply for optimal RF performance:

3. PCB Statistics

With a focus on functionality and versatility, this 6 layer PCB stack up accommodates a variety of components and connections:

4. RO4350B Core and RO4450F Bondply Introduction

The integration of RO4350B core material and RO4450F bondplys showcases a synergistic blend of advanced technologies:

RO4350B materials offer precise control over dielectric constant (Dk) while maintaining low loss characteristics. These laminates deliver exceptional electrical performance similar to PTFE/woven glass setups, at a fraction of the cost. Their UL 94 V-0 rating ensures compatibility with active devices and high-power RF designs.

RO4450F bondplys complement multi-layer configurations withRO4000 laminates, enabling sequential laminations with ease. With high postcure Tg and enhanced lateral flow capabilities, RO4450F bondplys stand as a preferred choice for intricate designs and challenging fill requirements.

5. Key Features of RO4350B and RO4450F

RO4350B:

• Dielectric Constant (DK): 3.48 +/-0.05 at 10GHz/23°C
• Dissipation Factor: 0.0037 at 10GHz/23°C
• Thermal Conductivity: 0.69 W/m/°K
• CTE Values: X axis 10 ppm/°C, Y axis 12 ppm/°C, Z axis 32 ppm/°C
• High Tg Value: >280°C
• Low Water Absorption: 0.06%

RO4450F:

• Dielectric Constant (DK): 3.52 +/-0.05 at 10GHz/23°C
• Dissipation Factor: 0.004 at 10GHz/23°C
• Thermal Conductivity: 0.65 W/m/°K
• CTE Values: X axis 19 ppm/°C, Y axis 17 ppm/°C, Z axis 50 ppm/°C

6. Typical Applications

The versatility of the 6-layer RO4350B RO4450F PCB makes it ideal for various high-performance applications, including but not limited to:

• Cellular Base Station Antennas and Power Amplifiers
• RF Identification Tags
• Automotive Radar and Sensors
• LNB's for Direct Broadcast Satellites

Conclusion

Our 6-Layer RO4350B PCB is a high-performance solution for RF and microwave applications, combining low-loss Rogers materials, blind vias, and ENIG surface finish for optimal electrical and thermal performance. Whether for 5G infrastructure, automotive radar, or satellite systems, this high frequency PCB delivers reliability, precision, and efficiency.

Request a quote today and experience next-level RF PCB performance!