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Home Flexible Printed Circuit Multilayer Flexible Printed Circuit (FPC) Multi-layer Flexible PCB Board

Multilayer Flexible Printed Circuit (FPC) Multi-layer Flexible PCB Board

This type of flexible circuit is 4-layer structure built on polyimide (PI) for the application of wireless router, 1oz copper each layer. 


  • Item NO.:

    BIC-265-v68.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$1.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Multilayer Flexible Printed Circuit (FPC) Multi-layer Flexible PCB Board

(FPC’s are custom-made products, the picture and parameters shown are just for reference)


General description:


The base laminate is from Shengyi. Coated by yellow covering layer, immersion gold is plated on pads. A connector is designed at both ends. It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.


Parameter and data sheet:


Size of Flexible PCB 300.5X 25.5mm
Number of Layers 4
Board Type Flexible circuits
Board Thickness 0.30mm
Board Material Polyimide (PI) 25µm
Board Material Supplier Shengyi
Tg Value of Board Material  60℃
PTH Cu thickness ≥20 µm
Inner Iayer Cu thicknes 35 µm
Surface Cu thickness 35 µm
Coverlay Colour Yellow
Number of Coverlay 2
Thickness of Coverlay 25 µm
Stiffener Material NO
Stiffener Thickness N/A
Type of Silkscreen Ink NO
Supplier of Silkscreen N/A
Color of Silkscreen N/A
Number of Silkscreen N/A
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90℃No peeling after Min. 3 times test
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
Thermal Shock Test Pass, -25℃±125℃, 1000 cycles. 
Thermal Stress Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function  100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2


4-layer Flexible Circuit


Features and benefits:


Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

Material optionality

Low cost

Continuity of processing

Diversified shipping method

Engineering design prevents problems from occurring in pre production.


Applications:


Laser head FPC, medical equipment controller, Tablet antenna soft board


Multilayer Flexible Circuits:


For the most part, manufacture of multilayer flexible circuits is based upon processes of single sided flexible PCB and double sided PTH flexible PCB. Both types evolve from the conventional covercoated double-sided flexible circuits that are bonded together. For a number of reasons, it is not recommended to combine too many flexible circuits into a multilayer flexible circuit.


Materials and Thicknesses of Multilayer FPC

It is common practice to use the materials listed below.


Dielectric Substrates

50 µm (2 mil) polyimide because of its higher stability and easier handling compared with 25 µm (1 mil) polyimide.


Copper Foil

35 µm (1 oz.) copper foil, provided this thickness is compatible with the current carrying requirements of the finished circuit.


Covercoat

25 µm (1 mil) polyimide for a 35 µm (1.4 mil) thick copper foil, since it ensures a better encapsulation of the conductors than a 50 µm (2 mil) polyimide.


25 µm (1 mil) acrylic adhesive for achieving a good encapsulation and a low-flow lamination. Too much acrylic adhesive leads to reliability problems, e.g. barrel cracks, foil cracks, and a too deep etchback.


Outer Layers

Outer layers should not be provided with any circuitry (conductors) on the bonding side because of the risk of air entrapment at the interface.


Bonding Materials

When using covercoated flexible circuits as inner layers, the circuits and the rigid parts are bonded together by means of sheet adhesives.


Processes:


A simplified flow diagram is shown below.

Process of Multilayer FPC


More Displays of Multi-layer FPC:


More Multilayer FPC More Multilayer FPC

More Multilayer FPC



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