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IsoClad 933 laminates are part of Rogers Corporation's IsoCladlaminateSeries, which belongs to the nonwoven fiberglass/PTFE composite family specifically engineered for printed circuit board (PCB) substrates.
Item NO.:
BIC-496-v582.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers IsoClad 933 DK2.33 Non-woven Fiberglass/PTFE IsoClad Series High FrequencyLaminates
Product Overview
IsoClad 933 laminates are part of Rogers Corporation's IsoClad laminate Series, which belongs to the nonwoven fiberglass/PTFE composite family specifically engineered for printed circuit board (PCB) substrates. This Rogers laminate variant is formulated with an optimized higher ratio of fiberglass to PTFE, a design choice that enhances its structural reinforcement. Compared to competitive nonwoven fiberglass/PTFE laminates with similar dielectric constants,RogersIsoClad 933 benefits from Rogers' proprietary manufacturing process and the use of longer random fibers. These features collectively deliver superior dimensional stability and more consistent dielectric constant performance, making it a reliable choice for demanding electronic applications.
Key Features
Core Benefits
1)The nonwoven fiberglass reinforcement, combined with the optimized material ratio, ensures improved structural integrity and mechanical robustness, suitable for applications requiring durability.
2)Its isotropic nature guarantees consistent performance across all three spatial axes, eliminating directional variations in electrical and mechanical properties.
3)The lower rigidity relative to woven fiberglass laminates facilitates easier handling and processing, especially in scenarios where the final circuit needs to be bent or shaped.
4)Stable dielectric properties across a wide frequency range support reliable signal transmission, critical for high-frequency applications.
Typical Applications
Typical Properties of IsoClad 933
|
Property |
Test Method |
Test Condition |
Typical Value |
|
Dielectric Constant @ 10 GHz |
IPC TM-650 2.5.5.5 |
C23/50 |
2.33 |
|
Dissipation Factor @ 10 GHz |
IPC TM-650 2.5.5.5 |
C23/50 |
0.0016 |
|
Thermal Coefficient of Er (ppm/°C) |
IPC TM-650 2.5.5.5 Adapted |
-10°C to +140°C |
-132 |
|
Peel Strength (lbs. per inch) |
IPC TM-650 2.4.8 |
After Thermal |
10 |
|
Volume Resistivity (MΩ-cm) |
IPC TM-650 2.5.17.1 |
C96/35/90 |
3.5 x 10⁸ |
|
Surface Resistivity (MΩ) |
IPC TM-650 2.5.17.1 |
C96/35/90 |
1.0 x 10⁸ |
|
Arc Resistance (seconds) |
ASTM D-495 |
D48/50 |
>180 |
|
Tensile Modulus (kpsi) |
ASTM D-638 |
A, 23°C |
173, 147 |
|
Tensile Strength (kpsi) |
ASTM D-882 |
A, 23°C |
6.8, 5.3 |
|
Compressive Modulus (kpsi) |
ASTM D-695 |
A, 23°C |
197 |
|
Flexural Modulus (kpsi) |
ASTM D-790 |
A, 23°C |
239 |
|
Dielectric Breakdown (kv) |
ASTM D-149 |
D48/50 |
>45 |
|
Density (g/cm³) |
ASTM D-792 Method A |
A, 23°C |
2.27 |
|
Water Absorption (%) |
MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2 |
E1/105 + D24/23 |
0.05 |
|
Coefficient of Thermal Expansion (ppm/°C) - X Axis |
IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer |
0°C to 100°C |
31 |
|
Coefficient of Thermal Expansion (ppm/°C) - Y Axis |
IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer |
0°C to 100°C |
35 |
|
Coefficient of Thermal Expansion (ppm/°C) - Z Axis |
IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer |
0°C to 100°C |
203 |
|
Thermal Conductivity (W/mK) |
ASTM E-1225 |
100°C |
0.263 |
|
Outgassing - Total Mass Loss (%) |
- |
125°C, ≤10⁻⁶ torr |
0.03 |
|
Outgassing - Collected Volatile Condensable Material (%) |
- |
125°C, ≤10⁻⁶ torr |
0 |
|
Outgassing - Water Vapor Regain (%) |
- |
125°C, ≤10⁻⁶ torr |
0.02 |
|
Outgassing - Visible Condensate (±) |
- |
125°C, ≤10⁻⁶ torr |
NO |
|
Flammability |
UL 94 Vertical Burn; IPC TM-650 2.3.10 |
|
|
Notes on Property Stability
The dielectric constant of IsoClad 933 maintains excellent stability across a broad frequency spectrum. This inherent robustness simplifies the design process for applications spanning the electromagnetic (EM) spectrum, enabling seamless design transitions and scalability.
The dissipation factor also remains stable across different frequencies, providing a reliable platform for high-frequency applications where signal integrity is paramount to overall performance.
Disclaimer
The information provided in this specification sheet is intended to support the design and selection of Rogers' circuit materials. It does not create any express or implied warranties, including but not limited to warranties of merchantability or fitness for a particular purpose. Users are responsible for verifying the suitability of IsoClad 933 DK2.33 substrates for their specific applications.
These commodities, technologies, and software are exported from the United States in compliance with Export Administration regulations. Diversion contrary to U.S. law is prohibited.
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