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Home Copper Clad Laminates Rogers IsoClad 933 DK2.33 Non-woven Fiberglass/PTFE IsoClad Series High Frequency Laminates

Rogers IsoClad 933 DK2.33 Non-woven Fiberglass/PTFE IsoClad Series High Frequency Laminates

IsoClad 933 laminates are part of Rogers Corporation's IsoCladlaminateSeries, which belongs to the nonwoven fiberglass/PTFE composite family specifically engineered for printed circuit board (PCB) substrates.

  • Item NO.:

    BIC-496-v582.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers IsoClad 933 DK2.33 Non-woven Fiberglass/PTFE IsoClad Series High FrequencyLaminates

 

Product Overview

IsoClad 933 laminates are part of Rogers Corporation's IsoClad laminate Series, which belongs to the nonwoven fiberglass/PTFE composite family specifically engineered for printed circuit board (PCB) substrates. This Rogers laminate variant is formulated with an optimized higher ratio of fiberglass to PTFE, a design choice that enhances its structural reinforcement. Compared to competitive nonwoven fiberglass/PTFE laminates with similar dielectric constants,RogersIsoClad 933 benefits from Rogers' proprietary manufacturing process and the use of longer random fibers. These features collectively deliver superior dimensional stability and more consistent dielectric constant performance, making it a reliable choice for demanding electronic applications.

 

Key Features


  • Reinforced with nonwoven fiberglass
  • Low dielectric constant (Er = 2.33)
  • Exceptionally low dissipation factor
  • Enhanced dimensional stability
  • Increased mechanical strength
  • Highly isotropic characteristics across X, Y, and Z axes
  • Less rigid compared to woven fiberglass-based laminates



IsoClad 933 laminates

 


Core Benefits

1)The nonwoven fiberglass reinforcement, combined with the optimized material ratio, ensures improved structural integrity and mechanical robustness, suitable for applications requiring durability.

 

2)Its isotropic nature guarantees consistent performance across all three spatial axes, eliminating directional variations in electrical and mechanical properties.

 

3)The lower rigidity relative to woven fiberglass laminates facilitates easier handling and processing, especially in scenarios where the final circuit needs to be bent or shaped.

 

4)Stable dielectric properties across a wide frequency range support reliable signal transmission, critical for high-frequency applications.

 

Typical Applications


  • Conformal (wrap-around) antennas
  • Stripline and microstrip circuits
  • Missile guidance systems
  • Radar systems
  • Electronic warfare systems


 

 

Typical Properties of IsoClad 933

 

Property

Test Method

Test Condition

Typical Value

Dielectric Constant @ 10 GHz

IPC TM-650 2.5.5.5

C23/50

2.33

Dissipation Factor @ 10 GHz

IPC TM-650 2.5.5.5

C23/50

0.0016

Thermal Coefficient of Er (ppm/°C)

IPC TM-650 2.5.5.5 Adapted

-10°C to +140°C

-132

Peel Strength (lbs. per inch)

IPC TM-650 2.4.8

After Thermal

10

Volume Resistivity (MΩ-cm)

IPC TM-650 2.5.17.1

C96/35/90

3.5 x 10⁸

Surface Resistivity (MΩ)

IPC TM-650 2.5.17.1

C96/35/90

1.0 x 10⁸

Arc Resistance (seconds)

ASTM D-495

D48/50

>180

Tensile Modulus (kpsi)

ASTM D-638

A, 23°C

173, 147

Tensile Strength (kpsi)

ASTM D-882

A, 23°C

6.8, 5.3

Compressive Modulus (kpsi)

ASTM D-695

A, 23°C

197

Flexural Modulus (kpsi)

ASTM D-790

A, 23°C

239

Dielectric Breakdown (kv)

ASTM D-149

D48/50

>45

Density (g/cm³)

ASTM D-792 Method A

A, 23°C

2.27

Water Absorption (%)

MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2

E1/105 + D24/23

0.05

Coefficient of Thermal Expansion (ppm/°C) - X Axis

IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer

0°C to 100°C

31

Coefficient of Thermal Expansion (ppm/°C) - Y Axis

IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer

0°C to 100°C

35

Coefficient of Thermal Expansion (ppm/°C) - Z Axis

IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer

0°C to 100°C

203

Thermal Conductivity (W/mK)

ASTM E-1225

100°C

0.263

Outgassing - Total Mass Loss (%)

-

125°C, ≤10⁻⁶ torr

0.03

Outgassing - Collected Volatile Condensable Material (%)

-

125°C, ≤10⁻⁶ torr

0

Outgassing - Water Vapor Regain (%)

-

125°C, ≤10⁻⁶ torr

0.02

Outgassing - Visible Condensate (±)

-

125°C, ≤10⁻⁶ torr

NO

Flammability

UL 94 Vertical Burn; IPC TM-650 2.3.10

 

 

 

 

Notes on Property Stability

The dielectric constant of IsoClad 933 maintains excellent stability across a broad frequency spectrum. This inherent robustness simplifies the design process for applications spanning the electromagnetic (EM) spectrum, enabling seamless design transitions and scalability.

The dissipation factor also remains stable across different frequencies, providing a reliable platform for high-frequency applications where signal integrity is paramount to overall performance.

 

Disclaimer

The information provided in this specification sheet is intended to support the design and selection of Rogers' circuit materials. It does not create any express or implied warranties, including but not limited to warranties of merchantability or fitness for a particular purpose. Users are responsible for verifying the suitability of IsoClad 933 DK2.33 substrates for their specific applications.

These commodities, technologies, and software are exported from the United States in compliance with Export Administration regulations. Diversion contrary to U.S. law is prohibited.

 

 


 



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