Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
Taconic TLX-0 is a high-volume fiberglass-reinforced microwave substrate belonging to AGC TLX product line, engineered to deliver reliable performance across a broad spectrum of RF and microwave applications.
Item NO.:
BIC-498-v584.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Taconic TLX-0 DK2.45 High-volume Fiberglass-reinforced Microwave Substrate
Taconic TLX-0 is a high-volume fiberglass-reinforced microwave substrate belonging to AGC TLX product line, engineered to deliver reliable performance across a broad spectrum of RF and microwave applications. As a PTFE fiberglass laminate, it stands out for its exceptional versatility, making it a preferred choice for low-layer-count microwave designs. The TLX-0 PCB material’s unique combination of mechanical reinforcement from fiberglass and advanced PTFE properties allows it to thrive in severe operating environments, including those involving high vibration, extreme temperatures, radiation exposure, and harsh marine conditions.
Ideal for fabricating critical components such as couplers, splitters, combiners, amplifiers, and antennas, TLX-0 DK2.45 substrate offers a balanced set of characteristics that meet the demanding requirements of modern RF systems. It maintains excellent passive intermodulation (PIM) values, stable dielectric performance, low moisture absorption, and strong dimensional stability—all while complying with UL 94 V-0 flammability standards. With a long-standing heritage in space applications (recognized for low outgassing per NASA’s specifications), TLX-0 copper clad laminate is trusted for use in radar systems, mobile communications equipment, microwave test devices, and warship antennas, among other high-reliability applications.
TLX-0 Core Parameter Tables
1. Dielectric Constant & Dissipation Factor
|
Property |
Test Method |
Value |
|
Dielectric Constant (Dk) @ 10 GHz |
IPC-650 2.5.5.3 |
2.45 |
|
Dissipation Factor (Df) @ 1.9 GHz |
IPC-650 2.5.5.5.1 |
0.0009 |
|
Dissipation Factor (Df) @ 10 GHz |
IPC-650 2.5.5.5.1 |
0.0012 |
2. Outgassing Properties (NASA-Reported)
|
Property |
Test Method |
Test Conditions |
Value |
|
Total Mass Loss (TML) |
ASTM E 595 |
24 hrs @ 257 °F (125 °C), ≤ 5 x 10⁻⁵ Torr |
0.06% |
|
Collected Volatile Condensable Materials (CVCM) |
ASTM E 595 |
24 hrs @ 257 °F (125 °C), ≤ 5 x 10⁻⁵ Torr |
0.00% |
|
Water Vapor Regain (WVR) |
ASTM E 595 |
24 hrs @ 257 °F (125 °C), ≤ 5 x 10⁻⁵ Torr |
0.00% |
3. Dimensional & Thickness Specifications
|
Designation |
Dielectric Constant (Dk) |
Dielectric Thickness (Inches) |
Dielectric Thickness (mm) |
|
TLX-0 |
2.45 ± 0.04 |
0.0050 - 0.250 |
0.127 - 6.35 |
Previous:
Rogers RT/duroid 5870 DK2.33 High Frequency LaminateNext:
Taconic TLY-3 DK2.33 Avionics & Aerospace Grade Low DK Base MaterialIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Taconic TLY-3 DK2.33 Avionics & Aerospace Grade Low DK Base Material
Taconic TLX-0 DK2.45 High-volume Fiberglass-reinforced Microwave Substrate
Rogers IsoClad 933 DK2.33 Non-woven Fiberglass/PTFE IsoClad Series High Frequency Laminates
F4BTMS233 F4BTMS CCL Series Ultra-Fine Glass Fiber Reinforced PTFE Ceramic-Filled Substrate
F4BME233 Wangling F4B DK2.33 F4BME Series Copper Clad Laminate
F4BTMS233 F4BTMS CCL Series Ultra-Fine Glass Fiber Reinforced PTFE Ceramic-Filled Substrate
Wangling F4BM233 DK2.33 PTFE Glass Fiber Cloth Copper Clad Laminates
© Copyright: 2026 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported