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Home Copper Clad Laminates Taconic TLX-0 DK2.45 High-volume Fiberglass-reinforced Microwave Substrate

Taconic TLX-0 DK2.45 High-volume Fiberglass-reinforced Microwave Substrate

Taconic TLX-0 is a high-volume fiberglass-reinforced microwave substrate belonging to AGC TLX product line, engineered to deliver reliable performance across a broad spectrum of RF and microwave applications. 

  • Item NO.:

    BIC-498-v584.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Taconic TLX-0 DK2.45 High-volume Fiberglass-reinforced Microwave Substrate

 

Taconic TLX-0 is a high-volume fiberglass-reinforced microwave substrate belonging to AGC TLX product line, engineered to deliver reliable performance across a broad spectrum of RF and microwave applications. As a PTFE fiberglass laminate, it stands out for its exceptional versatility, making it a preferred choice for low-layer-count microwave designs. The TLX-0 PCB material’s unique combination of mechanical reinforcement from fiberglass and advanced PTFE properties allows it to thrive in severe operating environments, including those involving high vibration, extreme temperatures, radiation exposure, and harsh marine conditions.

 

Ideal for fabricating critical components such as couplers, splitters, combiners, amplifiers, and antennas, TLX-0 DK2.45 substrate offers a balanced set of characteristics that meet the demanding requirements of modern RF systems. It maintains excellent passive intermodulation (PIM) values, stable dielectric performance, low moisture absorption, and strong dimensional stability—all while complying with UL 94 V-0 flammability standards. With a long-standing heritage in space applications (recognized for low outgassing per NASA’s specifications), TLX-0 copper clad laminate is trusted for use in radar systems, mobile communications equipment, microwave test devices, and warship antennas, among other high-reliability applications.

 

 TLX-0 PCB material


TLX-0 Core Parameter Tables

 

1. Dielectric Constant & Dissipation Factor

 

Property

Test Method

Value

Dielectric Constant (Dk) @ 10 GHz

IPC-650 2.5.5.3

2.45

Dissipation Factor (Df) @ 1.9 GHz

IPC-650 2.5.5.5.1

0.0009

Dissipation Factor (Df) @ 10 GHz

IPC-650 2.5.5.5.1

0.0012

 

 

2. Outgassing Properties (NASA-Reported)

 

Property

Test Method

Test Conditions

Value

Total Mass Loss (TML)

ASTM E 595

24 hrs @ 257 °F (125 °C), ≤ 5 x 10⁻⁵ Torr

0.06%

Collected Volatile Condensable Materials (CVCM)

ASTM E 595

24 hrs @ 257 °F (125 °C), ≤ 5 x 10⁻⁵ Torr

0.00%

Water Vapor Regain (WVR)

ASTM E 595

24 hrs @ 257 °F (125 °C), ≤ 5 x 10⁻⁵ Torr

0.00%

 

 

3. Dimensional & Thickness Specifications

 

Designation

Dielectric Constant (Dk)

Dielectric Thickness (Inches)

Dielectric Thickness (mm)

TLX-0

2.45 ± 0.04

0.0050 - 0.250

0.127 - 6.35

 


 


 



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