F4BME233 Wangling F4B DK2.33 F4BME Series Copper Clad Laminate

F4BME233 Wangling F4B DK2.33F4BME Series Copper Clad Laminate 

1. Product Overview

Wangling F4BME233 is a PTFE fiberglass cloth copper-clad laminate developed by Taizhou Wangling Insulation Material Factory. It is manufactured through scientific formulation and strict process pressing, utilizing high-quality fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film as core raw materials. Compared with conventional F4B laminates, this product offers enhanced electrical performance, featuring a wider dielectric constant range, lower dielectric loss, higher insulation resistance, and superior performance stability. It serves as a reliable alternative to equivalent foreign products in various high-performance applications.

A key distinction of the F4BME PCB substrate series, including F4BME233, lies in its copper foil configuration. It is paired with reversed RTF copper foil, which endows the laminate with excellent Passive Intermodulation (PIM) performance, more precise circuit control capabilities, and reduced conductor loss. This makes F4BME DK2.33 Wangling laminate particularly suitable for scenarios requiring strict PIM index compliance.

The dielectric constant of F4BME233 material is precisely calibrated by optimizing the ratio of PTFE to fiberglass cloth. This meticulous adjustment achieves a balance between low loss characteristics and enhanced dimensional stability. Specifically, the laminate maintains low dielectric loss while exhibiting improved dimensional consistency, a lower coefficient of thermal expansion, and better temperature drift performance—attributes that are closely linked to its optimized fiberglass content.

2. Core Product Features

• Dielectric constant (DK): Typical value of 2.33 (tested at 10GHz) with a tight tolerance of±0.04
• Low loss factor: 0.0011 at 10GHz and 0.0015 at 20GHz, ensuring efficient signal transmission
• Excellent PIM performance:≤-159 dBc, ideal for high-frequency communication systems
• Reliable peel strength: >1.6 N/mm (for 1 OZ copper foil), guaranteeing strong copper-clad adhesion
• Superior thermal stability: Operates within a wide temperature range of -55℃to +260℃without delamination
• High insulation performance: Volume resistivity≥6×10⁶MΩ.cm and surface resistivity≥1×10⁶MΩ(under normal conditions)
• Flame-retardant: Complies with UL-94 V-0 standard for enhanced safety
• Anti-radiation and low outgassing properties, suitable for harsh environmental applications
• Customizable dimensions and cost-effective bulk supply

3. Typical Applications

• Microwave, radio frequency (RF), and radar systems
• Phase shifters and passive components
• Power dividers, couplers, and combiners
• Feeding networks and phased array antennas
• Satellite communication equipment and base station antennas

4. F4BME233 Technical Specifications Table

Test Method Notes:

1.Dielectric constant (typical value) is tested in the Z-direction of the material, following GB/T 12636-1990 or IPC-TM650 2.5.5.5 stripline method.

2.Other performance tests are conducted in accordance with or with reference to IPC-TM-650 or GBT4722-2017 test methods.

3.All data provided are typical measured values for material selection reference only, not constituting any express or implied warranties. Customers are responsible for verifying the suitability of the material for specific applications.

5. Copper Foil Options

6. Dimension Options

Standard Sizes (mm)

460×610

500×600

850×1200

914×1220

1000×1200

Customizable Non-Standard Sizes (mm)

300×250

350×380

500×500

840×840

1000×1500

Note: For thickness≥4.0mm or≤0.2mm, the maximum size is limited to 500×610mm.

7. Thickness & Tolerance

Special Note: For dielectric constant≤2.65, the minimum available dielectric thickness is 0.1mm; for dielectric constant 2.7～3.0, the minimum available dielectric thickness is 0.2mm.