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Home Flexible Printed Circuit Rigid-Flex PCB Built on FR-4 Poyimide Immersion Gold 90ohm Impedance Control

Rigid-Flex PCB Built on FR-4 Poyimide Immersion Gold 90ohm Impedance Control

This is a type of rigid-flex PCB for the application of car tracker GPS. It’s a 6-layer build-up with 1.4mm thick, half ounces on inner layers and 1 ounce on out layers. 


  • Item NO.:

    BIC-267-v70.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$1.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rigid-Flex PCB Built on FR-4 and Poyimide With Immersion Gold and 90ohm Impedance Control

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)


General description:


It is also an impedance controlled design on outer layers and inner flexible circuit. Immersion gold is plated on pads for latter SMT. The base laminate is from Shengyi, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.


Parameter and data sheet:


Size of Flexible PCB 20.61 X 50.17mm
Number of Layers 6
Board Type Rigid flex PCB
Board Thickness 1.4mm
Board Material FR-4 / Polyimide
Board Material Supplier Shengyi
Tg Value of Board Material  130℃
PTH Cu thickness ≥20 µm
Inner Iayer Cu thicknes 18 µm
Surface Cu thickness 35 µm
Coverlay Colour Yellow coverlay / Green solder mask
Number of Coverlay 2
Thickness of Coverlay 25 µm
Stiffener Material N/A
Stiffener Thickness N/A
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90℃No peeling after Min. 3 times test
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
Thermal Shock Test Pass, -25℃±125℃, 1000 cycles. 
Thermal Stress Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function  100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2


6-Layer Stackup

Impedance

rigid flexible PCB


Features and benefits:


Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

The end can be whole soldered

Low cost

Continuity of processing

No minimum order quantity and low cost sample.

Make delivery on time. We keep higher than 98% on-time-delivery rate.


Applications:


Contact belt of inkjet printer, industrial surveying and mapping instrument, Tablet PC camera soft board


Flexible Inner Layers:


Inner layers are produced as single- or double-sided flexible circuits in the same way i.e., imaged, etched and covercoated, but not drilled and plated. Covercoating of the individual inner layer circuits requires an extra process, but the advantage is less risk of air entrapment.


The inner layers in the flexible section can also be bonded together . Although it is a simpler design that involves fewer process steps, the finished circuit has the disadvantage of being fairly rigid, and therefore difficult to bend. This is reflected in a rather limited number of bend cycles, e.g., maximum 25.


Another method is to avoid bonding of the flexible circuits in the flexible area. In the case of many inner layers, or when there is a short distance between the rigid sections of a flex/rigid circuit, a staggered build-up can be employed. This prevents buckling of the individual layers when the circuit is to be bent into its installed position, but the manufacture is somewhat more complicated.


Rigid Outer Layers:


In the case of flex/rigid circuits, rigid materials such as FR-4 are cut to size, and bonded to the circuit in the lamination process. It is possible to produce the flex/rigid circuit as a temporarily rigid board to facilitate handling during manufacture, assembly and soldering. This is achieved by extending the rigid layers across the flexible section. By covering both sides of the flexible section with release films, bonding of the rigid outer layers to the flexible section is prevented. The non-bonded sections of the rigid material can be removed by a snap-action, provided grooves are cut before lamination at the interfaces in both sides of each rigid outer

layer.


Processes:


A simplified flow diagram is shown below.

Process of Multilayer FPC


More Displays of rigid-flex PCB:


More rigid-flex PCB

 More rigid-flex PCB


More rigid-flex PCB

More rigid-flex PCB


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