Call Us Now ! Tel : +86 755 27374946
Order Online Now ! Email : info@bichengpcb.com
The RO3006 high frequency PCB with its high-performance features, exceptional mechanical and electrical properties, and versatile applications is an ideal choice for demanding electronic circuits that require reliability, stability, and precise signal transmission.
Item NO.:
BIC-273-v339.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RO3006 PCB 25mil Rogers 3006 2 Layer Circuit Board Immersion Gold
Introduction
The RO3006 PCB is a cutting-edge circuit board built with Rogers 3006 laminates, which are ceramic-filled PTFE composites renowned for their exceptional electrical and mechanical stability. These advanced circuit materials offer a stable dielectric constant (Dk) across a wide range of temperatures, eliminating the step change in Dk typically experienced by PTFE glass materials near room temperature.
Features
1)Rogers RO3006 Ceramic-Filled PTFE Composites:
The Rogers RO3006 PCB utilizes Rogers RO3006 ceramic-filled PTFE composites, ensuring superior performance and reliability. These materials are carefully designed to provide exceptional electrical properties and mechanical stability.
2)Stable Dielectric Constant:
With a dielectric constant of 6.15 +/- 0.15 at 10 GHz and 23°C, the RO3006 PCB guarantees consistent signal integrity, making it suitable for high-frequency applications that demand precision and reliability.
3)Low Dissipation Factor:
The RO3006 PCB boasts an impressively low dissipation factor of 0.002 at 10 GHz and 23°C. This attribute minimizes signal loss and ensures efficient transmission of high-frequency signals.
4)High Thermal Stability:
With a glass transition temperature (Td) above 500°C, the RO3006 PCB can endure extreme operating conditions. It retains its structural integrity and electrical performance even under high-temperature environments.
5)Efficient Thermal Conductivity:
The PCB exhibits a thermal conductivity of 0.79 W/mK, enabling effective heat dissipation and thermal management. It is particularly advantageous for applications that require efficient heat transfer and thermal stability.
6)Minimal Moisture Absorption:
The RO3006 PCB has a moisture absorption rate of only 0.02%. This exceptional property enhances the reliability and longevity of the board, minimizing potential damage caused by moisture or humidity.
7)CTE Compatibility with Copper:
The PCB has a low in-plane coefficient of thermal expansion (CTE) that matches that of copper, ensuring reliable surface-mounted assemblies. This feature is highly beneficial for applications sensitive to temperature changes and guarantees excellent dimensional stability.
Benefits
1)Uniform Mechanical Properties:
The RO3006 PCB offers uniform mechanical properties across a range of dielectric constants. It is an ideal choice for multi-layer board designs that require different dielectric constants, enabling greater flexibility in circuit design and implementation.
2)Versatility in Hybrid Designs:
It is suitable for use with epoxy glass multi-layer board hybrid designs, further expanding its applicability and facilitating diverse circuit configurations.
3)Economical Laminate Pricing:
The volume manufacturing process used for the RO3006 PCB results in an economical laminate pricing, making it a cost-effective solution for various applications demanding high-performance circuitry.
PCB Specifications
The RO3006 PCB is a 2 layer circuit board designed to deliver exceptional performance and reliability. Here are the key construction details:
Parameter |
Value |
Board Dimensions |
51.31mm x 111.92mm = 2PCS |
Minimum Trace/Space |
5/4 mils |
Minimum Hole Size |
0.4mm |
Blind Vias |
No |
Finished Board Thickness |
0.76mm |
Finished Cu Weight |
1 oz (1.4 mils) outer layers |
Via Plating Thickness |
20 μm |
Surface Finish |
Immersion Gold |
Top Silkscreen |
White |
Bottom Silkscreen |
No |
Top Solder Mask |
Green |
Bottom Solder Mask |
No |
Electrical Test |
100% Electrical test used prior to shipment |
PCB Statistics
The 25mil RO3006 PCB consists of the following components:
Statistic |
Value |
Components |
16 |
Total Pads |
42 |
Thru Hole Pads |
27 |
Top SMT Pads |
15 |
Bottom SMT Pads |
0 |
Vias |
23 |
Nets |
2 |
Artwork and Standards
The RO3006 PCB uses Gerber RS-274-X artwork files and complies with the IPC-Class-2 standard, ensuring stringent quality control and adherence to industry-leading specifications.
Availability
The RO3006 Rogers PCB material is available worldwide, making it easily accessible for customers across different regions.
Typical Applications
The RO3006 Rogers PCB is suitable for a wide range of high-performance applications, including:
-Automotive radar applications
-Global positioning satellite antennas
-Cellular telecommunications systems - power amplifiers and antennas
-Patch antenna for wireless communications
-Direct broadcast satellites
-Datalink on cable systems
-Remote meter readers
-Power backplanes
Conclusion
In summary, the RO3006 high frequency PCB with its high-performance features, exceptional mechanical and electrical properties, and versatile applications is an ideal choice for demanding electronic circuits that require reliability, stability, and precise signal transmission. Its cost-effective pricing and wide availability make it an excellent option for various industries.
Previous:
Hybrid PCB of RT/duroid 5880 and RO4003C 4-layer 1.33mm Thick Hybrid Multilayer Circuit BoardNext:
RO4350B PCB 6.5mm Thick Rogers 4350B 2 Layer Circuit Board RO4450F Bondply ENIGIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Rogers RT/duroid 5880LZ PCB 20mil 2-layer High Frequency Circuit Board
RT/duroid 5880 PCB 3-layer Rogers 5880 1.2mm Thick with Immersion Tin
RO4350B PCB 6.5mm Thick Rogers 4350B 2 Layer Circuit Board RO4450F Bondply ENIG
Hybrid PCB of RT/duroid 5880 and RO4003C 4-layer 1.33mm Thick Hybrid Multilayer Circuit Board
Hybrid PCB of RO4003C and FR-4 6 Layer PCB Stackup 1.1mm Thick Multilayer Circuit Board
Hybrid PCB RO3210 and RO3003 3-Layer 3mm Thick Hybrid Circuit Materials
Rogers TMM4 PCB 30mil 0.762mm 2-layer High Frequency Circuit Board
© Copyright: 2024 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported