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Home Newly Shipped RF PCB RO4003C LoPro PCB 60.7mil Rogers 4003C Low Profile with Immersion Gold Printed Circuit Board

RO4003C LoPro PCB 60.7mil Rogers 4003C Low Profile with Immersion Gold Printed Circuit Board

The RO4003C LoPro PCB 60.7mil is a cutting-edge printed circuit board that combines advanced technology with superior performance. 


  • Item NO.:

    BIC-N37-v288.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

 

RO4003C LoPro PCB 60.7mil Rogers 4003CLow Profile with Immersion Gold Printed Circuit Board

 

Introduction:

The RO4003C LoPro PCB is a cutting-edge printed circuit board that combines advanced technology with superior performance. Designed using the proprietary Rogers' technology, this PCB features a unique reverse treated foil bonded to the standardLow ProfileRO4003Cdielectric, resulting in a laminate with remarkably low conductor loss. This innovative design enhances insertion loss and signal integrity while retaining the desirable characteristics of the standard RO4003C laminate system.

 

High-Frequency Performance and Cost-Effective Circuit Fabrication:

The RO4003C LoPro laminates are engineered to deliver exceptional high-frequency performance while enabling cost-effective circuit fabrication. The hydrocarbon ceramic laminates offer a low loss material with a dielectric constant of 3.38+/- 0.05 at 10 GHz/23°C, ensuring optimal signal transmission. With a dissipation factor of 0.0027 at 10 GHz/23°C, this PCB minimizes energy loss, resulting in improved efficiency.

 

Impressive Thermal Performance and Durability:

This advanced PCB boasts remarkable thermal performance attributes. With a Td greater than 425°C and a high glass transition temperature (Tg) exceeding 280°C TMA, it excels in high-temperature environments, ensuring reliable operation under demanding conditions. Moreover, the high thermal conductivity of 0.64 W/mK facilitates efficient heat dissipation, protecting sensitive components and enhancing overall system performance.

 

The 60.7mil RO4003C LoPro PCB features a low Z-axis coefficient of thermal expansion at 46 ppm/°C, providing excellent dimensional stability and reducing the possibility of mechanical failure. The copper-matched coefficient of thermal expansion further enhances reliability, with X-axis and Y-axis values of 11 ppm/°C and 14 ppm/°C, respectively. These attributes make it an ideal choice for applications requiring stability across a wide temperature range (-55 to 288 °C).

 

Design Flexibility and Versatility:

This 2-layer rigid RO4003C LoPro PCB offers exceptional design flexibility, enabling engineers to develop intricate circuit layouts with ease. With a finished board thickness of 1.6mm and a copper weight of 1 oz (1.4 mils) on the outer layers, it strikes a balance between durability and compactness.

 

RO4003C LoPro PCB


PCB Construction details:

Parameter

Value

Board Dimensions

86.6mm x 90.8mm

Number of Boards

16

Minimum Trace/Space

4/4 mils

Minimum Hole Size

0.4mm

Blind Vias

No

Finished Board Thickness

1.6mm

Finished Cu Weight

1 oz (1.4 mils) outer layers

Via Plating Thickness

20 μm

Surface Finish

Immersion Gold

Top Silkscreen

No

Bottom Silkscreen

No

Top Solder Mask

Green

Bottom Solder Mask

No

Electrical Test

100% Electrical test used prior to shipment

 

 

 

PCB Statistics:

Parameter

Value

Components

9

Total Pads

33

Thru Hole Pads

21

Top SMT Pads

12

Bottom SMT Pads

0

Vias

11

Nets

2

 

 Low profile RO4003C PCB

 

Reliable Manufacturing and Quality Assurance:

To guarantee the highest level of quality, each Rogers RO4003C LoPro PCB undergoes rigorous testing. A 100% electrical test is conducted prior to shipment, ensuring that the board meets the specified performance criteria.

 

Compliance with Industry Standards:

The LoPro RO4003C PCB conforms to the IPC-Class-2 standard, which ensures consistent quality and reliability. Adhering to this widely recognized standard demonstrates our commitment to delivering products of the highest caliber.

 

Applications Across Various Industries:

The Low profile RO4003C LoPro PCB finds applications in a diverse range of industries, including:

 

1. Digital Applications

This PCB is well-suited for digital applications such as servers, routers, and high-speed backplanes. Its low insertion loss enables reliable signal transmission even at frequencies exceeding 40 GHz, making it ideal for high-frequency data transfer.

 

2. Cellular Base Station Antennas and Power Amplifiers

The reduced passive inter-modulation (PIM) characteristic of this PCB makes it an excellent choice for base station antennas and power amplifiers. It ensures excellent signal integrity and minimizes interference, enabling optimal performance in cellular communication systems.

 

3. LNBs for Direct Broadcast Satellites

The RO4003C LoPro PCB is a reliable choice for low-noise block downconverters (LNBs) used in direct broadcast satellites. Its high-frequency performance and low conductor loss contribute to signal accuracy and superior overall system performance.

 

4. RF Identification Tags

This PCB is well-suited for RF identification tags, offering efficient signal transmission and reliable operation, even in challenging environments.

 

In conclusion, the RO4003C Low Profile PCB represents a significant advancement in high-frequency circuit fabrication. Its low conductor loss, high thermal performance, and design flexibility make it an excellent choice for demanding applications across various industries. With a commitment to quality and compliance with industry standards, this PCB offers a reliable solution for your circuit needs. Experience the next level of performance with the Rogers RO4003C LoPro PCB. Contact us today to learn more or place an order.





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