Rogers 4360High Frequency PCB 16mil Double Sided
RF PCB with Green Mask and Immersion Gold for Small Cell Transceivers
(PCB's are custom-made products, the picture
and parameters shown are just for reference)
RO4360G2
laminates of Rogers Corporation are 6.15 Dk, low loss, glass-reinforced,
hydrocarbon ceramic-filled thermoset materials that provide the ideal balance
of performance and processing ease. RO4360G2 laminates extend Rogers' portfolio
of high performance materials by providing customers with a product that is
lead-free process capable and offers better rigidity for improved
processability in multi-layer board constructions, while reducing material and
fabrication costs.
RO4360G2
laminates process similar to FR-4 and are automated assembly compatible. They
have a low Z-axis CTE for design flexibility and have the same high Tg as all
of the RO4000 product line. RO4360G2 laminates can be paired with RO4450F
prepreg and lower-Dk RO4000 laminate in multi-layer designs.
Things
that make up the RO4360 PCB Material：
Below
are the components used by the manufacturers in making rogers ro4360.
Copper
foil: These are traces found on the RO4360 PCB. They are conductive in nature.
Prepreg:
The prepreg is a sticky B stage material and ensures the bonding of different
foils or laminates.
Copper
Laminates (Core): This core is made up of copper coils and prepregs, which you
must cure and laminate.
Features
of the RO4360 PCB Material:
Features
of this material include:
-
6.15 Dk and a +/- 0.15
variation
-
It resists CAF
-
With low loss, it integrates
a high thermal conductivity
-
It provides a high Tg, which
is higher than 280 degrees centigrade TMA
-
Z-axis CTE is low and its
glass transition temperature is high
Some
Typical Applications:
1.
Base Station Power Amplifiers
2.
Small Cell Transceivers
3.
Patch antennas
4. Ground-based
Radar
PCB
Capability (RO4360G2)
|
PCB Capability (RO4360G2)
|
|
PCB Material:
|
Hydrocarbon Ceramic-filled Thermoset
Materials
|
|
Designation:
|
RO4360G2
|
|
Dielectric constant:
|
6.15 ±0.15
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
8mil (0.203mm), 12mil (0.705mm), 16mil
(0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare copper, HASL,
ENIG, OSP etc..
|
Data
Sheet of RO4360G2:
|
RO4360G2
Typical Value
|
|
Property
|
RO4360G2
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
6.15±0.15
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5
|
|
2.5 GHz/23℃
|
|
Dissipation Factor,tanδ
|
0.0038
|
Z
|
|
10
GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal
Conductivity
|
0.75
|
|
W/mK
|
50℃
|
ASTM D-5470
|
|
Volume Resistivity
|
4.0 X 1013
|
|
Ω.cm
|
Elevated T
|
IPC-TM-650 2.5.17.1
|
|
Surface Resistivity
|
9.0 X 1012
|
|
Ω
|
Elevated T
|
IPC-TM-650 2.5.17.1
|
|
Electrical Strength
|
784
|
Z
|
V/mil
|
|
IPC-TM-650 2.5.6.2
|
|
Tensile Strength
|
131
(19) 97(14)
|
X Y
|
MPa (kpsi)
|
40 hrs 50%RH/23
|
ASTM D638
|
|
Flexural Strength
|
213(31) 145(21)
|
X Y
|
Mpa (kpsi)
|
40 hrs 50%RH/23
|
IPC-TM-650, 2.4.4
|
Coefficient of Thermal Expansion
|
13 14 28
|
X Y Z
|
ppm/℃
|
-50℃to 288℃
After Replicated Heat Cycle
|
IPC-TM-650, 2.1.41
|
|
Tg
|
>280
|
|
℃ TMA
|
|
IPC-TM-650 2.4.24.3
|
|
Td
|
407
|
|
℃
|
|
ASTM D3850 using TGA
|
|
T288
|
>30
|
Z
|
min
|
30
min / 125℃Prebake
|
IPC-TM-650 2.2.24.1
|
|
Moisure Absorption
|
0.08
|
|
%
|
50℃/48hr
|
IPC-TM-650 2.6.2.1
ASTM D570
|
|
Thermal Coefficient of er
|
-131 @10 GHz
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650, 2.5.5.5
|
|
Density
|
2.16
|
|
gm/cm3
|
RT
|
ASTM D792
|
|
Copper Peel Stength
|
5.2 (0.91)
|
|
pli (N/mm)
|
Condtion B
|
IPC-TM-650 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94 File QMTS2.
E102765
|
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