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Home High Frequency PCB Rogers 4360 High Frequency PCB 16mil Double Sided substrate RF Green Mask Immersion Gold

Rogers 4360 High Frequency PCB 16mil Double Sided substrate RF Green Mask Immersion Gold

RO4360G2 laminates, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit dimensions in applications where size and cost are critical.

  • Item NO.:

    BIC-115-v176.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Rogers 4360High Frequency PCB 16mil Double Sided RF PCB with Green Mask and Immersion Gold for Small Cell Transceivers

(PCB's are custom-made products, the picture and parameters shown are just for reference)


RO4360G2 laminates of Rogers Corporation are 6.15 Dk, low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing ease. RO4360G2 laminates extend Rogers' portfolio of high performance materials by providing customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.


RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low Z-axis CTE for design flexibility and have the same high Tg as all of the RO4000 product line. RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.



Things that make up the RO4360 PCB Material:


Below are the components used by the manufacturers in making rogers ro4360.


Copper foil: These are traces found on the RO4360 PCB. They are conductive in nature.


Prepreg: The prepreg is a sticky B stage material and ensures the bonding of different foils or laminates.


Copper Laminates (Core): This core is made up of copper coils and prepregs, which you must cure and laminate.


Features of the RO4360 PCB Material:

Features of this material include:


  • 6.15 Dk and a +/- 0.15 variation
  • It resists CAF
  • With low loss, it integrates a high thermal conductivity
  • It provides a high Tg, which is higher than 280 degrees centigrade TMA
  • Z-axis CTE is low and its glass transition temperature is high



Some Typical Applications:

1. Base Station Power Amplifiers

2. Small Cell Transceivers

3. Patch antennas

4. Ground-based Radar


\RO4360G2 16mil PCB


PCB Capability (RO4360G2)


PCB Capability (RO4360G2) 
PCB Material: Hydrocarbon Ceramic-filled Thermoset Materials
Designation: RO4360G2
Dielectric constant: 6.15 ±0.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..


Data Sheet of RO4360G2:

RO4360G2 Typical Value
Property RO4360G2 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
2.5 GHz/23℃
Dissipation Factor,tanδ 0.0038 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.75 W/mK 50℃ ASTM D-5470
Volume Resistivity 4.0 X 1013 Ω.cm Elevated T IPC-TM-650  2.5.17.1
Surface Resistivity 9.0 X 1012 Ω Elevated T IPC-TM-650  2.5.17.1
Electrical Strength 784 Z V/mil IPC-TM-650  2.5.6.2
Tensile Strength 131 (19)     97(14) X                 Y MPa (kpsi) 40 hrs 50%RH/23 ASTM D638
Flexural Strength 213(31)     145(21) X                 Y Mpa (kpsi) 40 hrs 50%RH/23 IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion
13                     14                              28 X                      Y                         Z ppm/℃ -50℃to 288℃  After Replicated Heat Cycle IPC-TM-650, 2.1.41
Tg >280 ℃ TMA IPC-TM-650 2.4.24.3
Td 407 ASTM D3850 using TGA
T288 >30 Z min 30 min / 125℃Prebake IPC-TM-650 2.2.24.1
Moisure Absorption 0.08 % 50℃/48hr IPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er -131 @10 GHz Z ppm/℃ -50℃to 150℃  IPC-TM-650, 2.5.5.5
Density 2.16 gm/cm3 RT ASTM D792
Copper Peel Stength 5.2 (0.91) pli (N/mm) Condtion B IPC-TM-650 2.4.8
Flammability V-0 UL 94 File QMTS2. E102765



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