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Home High Frequency PCB Rogers TC350 Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold

Rogers TC350 Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold

Rogers' TC350 is a woven fiberglass reinforced, ceramic filled, PTFE based composite for use as making printed circuit board.

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Rogers TC350Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold for Microwave Combiners

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Low moisture absorption, superior dimensional stability, and lower tangent and insertion loss are all characteristics of the new material. The TC350 Plus materials' low loss tangent and high thermal conductivity qualities contribute to the panels' increased dependability and lower operating temperatures. They come in a variety of sizes as well. We can employ them for a variety of purposes as a result. In addition, they are a popular option for high-power applications like telecommunications.

Rogers Electronics' RO4835 high-frequency laminates have a 3.48 dielectric constant and increased oxidation resistance. They have a low loss tangent at 10 GHz and work with lead-free processing techniques. They are suitable for demanding RF/microwave circuits due to their low loss tangent and excellent electrical stability. They are RoHS-compliant and have expansion coefficients that are comparable to copper's.

For applications with a wide range of mechanical, electrical, and mechanical requirements, high-frequency laminates are preferable. Low loss tangents are exhibited by Rogers TC350 Plus laminates, which lowers the price of a high-frequency board. When selecting the ideal material for your circuit boards, the loss factor, or Df, is a crucial component to take into account. It is a fundamental feature of a printed circuit board, and the material used to make it is the main deciding element. For instance, you will suffer greater losses if you employ FR-4 materials.

Features & Benefits:

1. The increased thermal conductivity of TC350 provides higher power handling, reduces hot-spots and improves device reliability. This results in reduced junction temperatures and extends the life of active components, which is critical for improving power amplifier reliability, extending MTBF and reducing warranty costs.

2. TC350 has excellent Dielectric Constant Stability across a wide temperature range. This helps Power Amplifier and Antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes.

3. TC350 enjoys a strong bond to copper, utilizing microwave grade, low profile copper. This results in even lower insertion loss due to skin effect losses of copper that are more obvious at higher RF and microwave frequencies.

Our PCB Capabilities (TC350)

Our PCB Capability (TC350) 
PCB Material: Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite
Designation: TC350
Dielectric constant: 3.5±0.05
Thermal Conductivity 0.72 W/m-K
Dissipation Factor Df .002@10 GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

Typical Applications:

1. Microwave Combiner and Power Dividers

2. Power Amplifiers, Filters and Couplers

3. Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)

4. Thermally Cycled Antennas sensitive to dielectric drift

Typical Properties of TC350:

Typical Properties:TC350
Property Units Value Test Merthod
1. Electrical Properties
Dielectric Constant (may vary by thickness)
                         @1 MHz 3.50 IPC TM-650
                         @1.8 GHz 3.50 RESONANT CAVITY
                         @10 GHz 3.50 IPC TM-650
                  Dissipation Factor
                        @1 MHz 0.0015 IPC TM-650
                        @1.8 GHz 0.0018 RESONANT CAVITY
                        @10 GHz 0.0020 IPC TM-650
Temperature Coefficient of Dielectric
            TC r @ 10 GHz (-40-150°C) ppm/ºC -9 IPC TM-650
Volume Resistivity
                    C96/35/90 MΩ-cm 7.4x106 IPC TM-650
                    E24/125 MΩ-cm 1.4x108
            Surface Resistivity
                   C96/35/90 3.2x107 IPC TM-650
                   E24/125 4.3x108 IPC TM-650
                   Electrical Strength Volts/mil (kV/mm) 780 (31) IPC TM-650
                  Dielectric Breakdown kV 40 IPC TM-650 2.5.6
                  Arc Resistance sec >240 IPC TM-650 2.5.1
2.Thermal Properties
Decomposition Temperature (Td)
Initial °C 520 IPC TM-650
5% °C 567 IPC TM-650
T260 min >60 IPC TM-650
T288 min >60 IPC TM-650
T300 min >60 IPC TM-650
Thermal Expansion, CTE (x,y) 50-150ºC ppm/ºC 7, 7 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/ºC 12 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) % 1.2 IPC TM-650 2.4.24
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
       After Thermal Stress lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
At Elevated Temperatures (150ºC) lb/in (N/mm) 9 (1.6) IPC TM-650
      After Process Solutions lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
Young’s Modulus kpsi (MPa) IPC TM-650
Flexural Strength (Machine/Cross) kpsi (MPa) 14/10 (97/69) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 11/8 (76/55) IPC TM-650
Compressive Modulus kpsi (MPa) ASTM D-3410
Poisson’s Ratio ASTM D-3039
4. Physical Properties
Water Absorption % 0.05 IPC TM-650
Density, ambient 23ºC g/cm3 2.30 ASTM D792 Method A
Thermal Conductivity W/mK 0.72 ASTMD5470
Specific Heat J/gK 0.90 ASTM D5470
Flammability class V0 UL-94
NASA Outgassing, 125ºC, ≤10- 6 torr
Total Mass Loss % 0.02 NASA SP-R-0022A
Collected Volatiles % 0.01 NASA SP-R-0022A
Water Vapor Recovered % 0.01 NASA SP-R-0022A




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