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Home High Frequency PCB High Frequency PCB Built on Rogers IsoClad 917 non-woven fiberglass/PTFE Materials

High Frequency PCB Built on Rogers IsoClad 917 non-woven fiberglass/PTFE Materials


It is non-woven fiberglass reinforcement, less rigid than woven fiberglass, so it’s used in applications where the final PCB may be bent in shape, including conformal antennas or wrap-around antennas.




  • Item NO.:

    BIC-205-v163.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

High Frequency PCB Built on Rogers IsoClad 917 non-woven fiberglass/PTFE Materials

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Brief Introduction

Rogers IsoClad 917 laminates are non-woven fiberglass/PTFE composites using a low ratio of fiberglass/PTFE to achieve the lowest 2.17 or 2.20 dielectric constant and 0.0013 dissipation factor. Longer random fibers and proprietary process of IsoClad 917 provide greater dimensional stability and dielectric constant uniformity than competitors in similar classes.


Features

1.Low dielectric constant (Dk) of 2.17 or 2.20

2. Low dissipation factor of .0013 at 10GHz

3. Extremely low loss

4. Low moisture absorption

5. Highly Isotropic in X, Y and Z Directions


Typical Applications:

1.Conformal Antennas

2. Stripline and Microstrip Circuits

3. Guidance Systems

4. Radar Systems


isoClad 917 PCB_bichengpcb


Our PCB Capability (IsoClad 917)

PCB Capability (IsoClad 917) 
PCB Material: Non-woven Fiberglass / PTFE Composites
Designation: IsoClad 917
Dielectric constant: 2.17 or 2.20  (10 GHz)
Dissipation factor 0.0013 (10 GHz)
Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 20mil (0.508mm), 31mil (0.787mm),  62mil (1.575mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..


Our Advantages

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 19 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

     

We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We also actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.

     

Appendix: Typical Values of IsoClad 917


Typical Properties: IsoClad 917
Property IsoClad 917 Condition Test Method
Dielectric Constant @ 10 GHz 2.17, 2.20 C23/50 IPC TM-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0013 C23/50 IPC TM-650 2.5.5.5
Thermal Coefficient of Er (ppm/°C) -157 -10°C to +140°C IPC TM-650 2.5.5.5
Adapted
Peel Strength  (lbs.per inch) 10 After Thermal IPC TM-650 2.4.8
Volume Resistivity (MΩ-cm) 1.5 x 1010 C96/35/90 IPC TM-650 2.5.17.1
Surface Resistivity (MΩ) 1.0 x 109 C96/35/90 IPC TM-650 2.5.17.1
Arc Resistance (seconds) >180 D48/50 ASTM D-495
Tensile Modulus (kpsi) 133, 120 A, 23°C ASTM D-638
Tensile Strength (kpsi) 4.3, 3.8 A, 23°C ASTM D-882
Compressive Modulus (kpsi) 182 A, 23°C ASTM D-695
Flexural Modulus (kpsi) 213 A, 23°C ASTM D-790
Dielectric Breakdown (kv) >45 D48/50 ASTM D-149
Density (g/cm3) 2.23 A, 23°C ASTM D-792 Method A
Water Absorption (%) 0.04 E1/105 + D24/23 MIL-S-13949H 3.7.7
IPC TM-650 2.6.2.2
Coefficient of Thermal 0°C to 100°C IPC TM-650 2.4.24
Expansion (ppm/°C) Mettler 3000
X Axis 46 Thermomechanical
Y Axis 47 Analyzer
Z Axis 236
Thermal Conductivity (W/mK) 0.263 100°C ASTM E-1225
Outgassing 125°C, ≤10-6torr
Total Mass Loss (%) 0.02 Maximum 1.00%
Collected Volatile 0.00 Maximum 0.10%
Condensable Material (%)
Water Vapor Regain (%) 0.02
Visible Condensate (±) NO
Flammability Meets requirements of
UL94-V0
C48/23/50, E24/125 UL 94 Vertical Burn IPC TM-650 2.3.10


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