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Home High Frequency PCB Rogers RO4835 High Frequency PCB 10mil 20mil 30mil ED Copper 10.7mil 20.7mil 30.7mil LoPro Copper

Rogers RO4835 High Frequency PCB 10mil 20mil 30mil ED Copper 10.7mil 20.7mil 30.7mil LoPro Copper


RO4835 laminates are designed to offer superior high frequency performance and low cost circuit fabrication.




  • Item NO.:

    BIC-199-v145.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers RO4835 High Frequency PCB 10mil 20mil 30mil ED Copper 10.7mil 20.7mil 30.7mil LoPro Copper

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description:


Rogers RO4835 substrates are hydrocarbon ceramic laminates, a type of antioxidative high frequency materials for applications demanding greater stability at elevated temperatures. It is significantly more resistant to oxidation than other hydrocarbon based materials. RO4835 material provides nearly identical electrical and mechanical properties to RO4350B laminates, which customers have used successfully for many years.


Oxidation affects all thermoset laminate materials over time and temperature. In the long term, oxidation can lead to small increases in dielectric constant and dissipation factor of the circuit substrate.


RO4835 PCB bichengpcb


Features and Benefits:


1. Significantly improved oxidation resistance compared to typical thermoset microwave materials, which are designed for performance sensitive, high volume applications.

2. Low loss exhibits excellent electrical performance allowing application with higher operating frequencies, especially ideal for automotive applications.

3. Tight dielectric constant tolerance results in controlled impedance transmission lines

4. Lead-free process compatible results in no blistering or delamination

5. Low Z-axis expansion results in reliable plated through holes

6. Low in-plane expansion coefficient remains stable over an entire range of circuit processing temperatures

7. CAF resistant


Our PCB Capability (RO4835):


PCB Capability (RO4835) 
PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4835
Dielectric constant: 3.48  (10 GHz)
Dissipation Factor 0.0037 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness       (ED copper) 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm),  60mil (1.524mm)
Dielectric thickness (LoPro copper) 4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..


Typical Applications:


1. Automotive Radar and Sensors

2. Point-to point Microwave

3. Power Amplifiers

4. Phased - Array Radar

5. RF Components


Appendix: Typical Values of RO4835:


Property RO4835 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z - 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -100℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 5 x 108 MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 7 x108 COND A IPC-TM-650 2.5.17.1
Electrical Strength 30.2(755) Z Kv/mm(v/mil) IPC-TM-650 2.5.6.2
Tensile Modulus 7780(1128) Y MPa(ksi) RT ASTM D 638
Tensile Strength 136(19.7) Y MPa(ksi) RT ASTM D 638
Flexural Strength 186 (27) Mpa (kpsi) IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mils/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
31
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280 ℃TMA A IPC-TM-650 2.4.24.3
Td 390 ℃TGA ASTM D 3850
Thermal Conductivity 0.66 W/m/oK 80℃ ASTM C518
Moisture Absorption 0.05 % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.92 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88 (5.0) N/mm (pli) after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes



BICHNEG PCB WORKSHOP:


BICHNEG PCB WORKSHOP


BICHNEG PCB CERTIFICATION: 


BICHNEG PCB CERTIFICATION


BICHENG PCB MAIN COURIERS:


BICHENG PCB MAIN COURIERS



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