Rogers RO3210
High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin
and Immersion Silver
(PCB's are custom-made products, the picture
and parameters shown are just for reference)
Hello Everyone,
Today we’re talking about RO3210 high frequency
PCBs.
RO3210 material was
designed as an extension of the RO3000 series high frequency circuit materials
with one distinguishing characteristic-- improved mechanical stability.
Features and
benefits are as follows:
1. Woven glass
reinforcement, improves rigidity for easier handling.
2, Uniform
electrical and mechanical performance, is ideal for complex multi-layer high
frequency structure.
3. Low in-plane
expansion coefficient matches to copper, which is reliable for surface mounted
assemblies; which is suitable for use with epoxy multi-layer board hybrid
designs.
4. Excellent
dimensional stability, results in high production yields.
5. Surface
smoothness, allows for finer line etching tolerance.
Our PCB Capability (RO3210):
|
PCB Material:
|
Ceramic-filled
Laminates
|
|
Designation:
|
RO3210
|
|
Dielectric
constant:
|
10.2 ±0.5
(process)
|
|
10.8 (design)
|
|
Layer count:
|
2 Layer, Multilayer,
Hybrid PCB
|
|
Copper weight:
|
0.5oz (17 µm),
1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
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25mil (0.635mm),
50mil (1.27mm)
|
|
PCB size:
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≤400mm X 500mm
|
|
Solder mask:
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Green, Black,
Blue, Yellow, Red etc.
|
|
Surface finish:
|
Bare copper,
HASL, ENIG, OSP etc..
|
|
|
|
Double layer
RO3210 high frequency PCBs are available with 0.5oz to 2oz finished copper,
0.7mm and 1.3mm thick, maximum size 400mm by 500mm, surface finish with bare
copper, hot air leveling, immersion gold etc.
Typical applications:
1. Automotive
collision avoidance systems.
2. Automotive
global positions satellite antennas
3. Base station
infrastructure
4. Datalink on
cable systems
5. Direct
broadcast satellite
6. LMDS and
wireless broadband
7. Microstrip
patch antennas for wireless communications
8. Power
backplanes
9. Remote meter
readers
10. Wireless
telecommunications systems
The basic colour of RO3210 PCB is white.
The manufacturing process of RO3210 high
frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume
manufacturing process winning advantageous market.
Should you have any questions, please feel free
to contact us.
Thank you for your reading.
Appendix:Data
sheet of RO3210:
|
RO3210 Typical
Value
|
|
Property
|
RO3210
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant, ε Process
|
10.2±0.5
|
Z
|
|
10 GHz 23℃
|
IPC-TM-650
2.5.5.5 Clamped Stripline
|
|
Dielectric
Constant, ε Design
|
10.8
|
Z
|
|
8GHz to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation
Factor, tanδ
|
0.0027
|
Z
|
|
10 GHz 23℃
|
IPC-TM-650
2.5.5.5
|
|
Thermal
Coefficient of ε
|
-459
|
Z
|
ppm/℃
|
10 GHz 0℃to 100℃
|
IPC-TM-650
2.5.5.5
|
|
Dimensional
Stability
|
0.8
|
X, Y
|
mm/m
|
COND A
|
ASTM D257
|
|
Volume
Resistivity
|
103
|
|
MΩ.cm
|
COND A
|
IPC 2.5.17.1
|
|
Surface
Resistivity
|
103
|
|
MΩ
|
COND A
|
IPC 2.5.17.1
|
|
Tensile Modulus
|
579
517
|
MD
CMD
|
kpsi
|
23℃
|
ASTM D 638
|
|
Water Absorption
|
＜0.1
|
-
|
%
|
D24/23
|
IPC-TM-650
2.6.2.1
|
|
Specific Heat
|
0.79
|
|
j/g/k
|
|
Calculated
|
|
Thermal
Conductivity
|
0.81
|
|
W/M/K
|
80℃
|
ASTM C518
|
|
Coefficient of
Thermal Expansion
(-55 to 288℃)
|
13
34
|
X,Y
Z
|
ppm/℃
|
23℃/50% RH
|
IPC-TM-650
2.4.4.1
|
|
Td
|
500
|
|
℃
|
TGA
|
ASTM D3850
|
|
Density
|
3
|
|
gm/cm3
|
|
|
|
Copper Peel
Strength
|
11
|
|
pli
|
1oz,EDC After
Solder Float
|
IPC-TM 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94
|
|
Lead-free
Process Compatible
|
Yes
|
|
|
|
|
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