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Home High Frequency PCB AD255C High Frequency Antenna PCB 20mil 30mil 40mil 60mil Thickness With Immersion Gold, Immersion Silver

AD255C High Frequency Antenna PCB 20mil 30mil 40mil 60mil Thickness With Immersion Gold, Immersion Silver


AD255C has dielectric constant of 2.55, dissipation factor of 0.0013 at 10 GHz with ED copper and reverse treat copper. They are available from 20 mils to 125 mils.



  • Item NO.:

    BIC-197-v143.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

AD255C High Frequency Antenna PCB 20mil 30mil 40mil 60mil Thickness With Immersion Gold, Immersion Silver

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General description

Rogers' AD255C substrates are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of today's wireless antenna markets. They are glass-reinforced, PTFE based composites that provide controlled dielectric constant, low loss performance, and very good passive intermodulation (PIM) performance. 


PCB Capability (AD255C)

PCB Capability (AD255C) 
PCB Material:  Glass-reinforced, PTFE based Composites
Designation: AD255C
Dielectric constant: 2.55  (10 GHz)
Dissipation Factor 0.0013 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness: 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..


Typical Applications

Automotive telematics antenna systems

Cellular infrastructure base station antenna

Commercial satellite radio antenna


Rogers AD255C Antenna PCB Low DK Low Loss


About Us

We are an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 19 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.


Our advantages

1.Powerful PCB capabilities support your research and development, sales and marketing;

2.PCB Products and Manufacturing are certified by authorized organizations;

3.16000㎡workshop with 30000㎡output capability and 8000 types of PCB's per month;

4.Quick CADCAM checking and free PCB quotation;

5.No minimum order quantity. 1 piece is available;

6.A Team with passion, discipline, responsibility and honesty;

7.More than 19+ years of high frequency PCB experience;

8.Prototype PCB capability to Volume Production capability;

9.Delivery on time: >98%, Customer complaint rate: <1%

10.IPC Class 2 / IPC Class 3;


Appendix: Typical Value of AD255C

Electrical Properties AD255C Units Test Conditions Test Method
PIM (30mil/60mil) -159/-163 dBc Reflected 43 dBm swept tones at 1900 MHz, S1/S1 Rogers Internal 50 ohm
Dielectric Constant (process) 2.55 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
(IPC TM-650 2.5.5.3)
Dielectric Constant (design) 2.60 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Dissipation Factor (process) 0.0013 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant -110 ppm/ºC 0°C to 100°C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 7.4 x 108 Mohm-cm C-96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 3.6 x 107 Mohm C-96/35/90 - IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength) 911 V/mil - - IPC TM-650 2.5.6.2
Dielectric Breakdown >40 kV D-48/50 X/Y direction IPC TM-650 2.5.6
Thermal Properties
Decomposition Temperature (Td) >500 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x 34 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 26 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 196 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Thermal Conductivity 0.35 W/mK - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288˚C IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress 2.4
(13.6)
N/mm (lbs/in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD/CMD) 8.8/6.4 (60.7/44.1) MPa (ksi ) 25°C ± 3°C - ASTM D790
Tensile Strength (MD/CMD) 8.1/6.6 (55.8/45.5) MPa (ksi ) 23°C/50% RH - ASTM D3039/D3039-14
Flex Modulus (MD/CMD) 930/818 (6,412/5,640) MPa (ksi ) 25°C ± 3°C - IPC-TM-650 Test Method 2.4.4
Dimensional Stability (MD/CMD) 0.03/0.07 mils/inch after etch + bake - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - - UL-94
Moisture Absorption 0.03 % E1/105 +D48/50 - IPC TM-650 2.6.2.1
Density 2.28 g/cm3 C-24/23/50 - ASTM D792
Specific Heat Capacity 0.813 J/g°K 2 hours at 105°C - ASTM E2716



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