AD255C High Frequency Antenna PCB 20mil
30mil 40mil 60mil Thickness With Immersion Gold, Immersion Silver
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
General description
Rogers' AD255C substrates are high performance, specialty materials that are
specifically engineered and manufactured to meet the demands of today's
wireless antenna markets. They are glass-reinforced, PTFE based composites that
provide controlled dielectric constant, low loss performance, and very good
passive intermodulation (PIM) performance.
PCB Capability (AD255C)
|
PCB Capability (AD255C)
|
|
PCB Material:
|
Glass-reinforced, PTFE based Composites
|
|
Designation:
|
AD255C
|
|
Dielectric constant:
|
2.55 (10 GHz)
|
|
Dissipation Factor
|
0.0013 (10 GHz)
|
|
Layer count:
|
Double Sided PCB, Multilayer PCB, Hybrid PCB
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|
Copper
weight:
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0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
Dielectric
thickness:
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20mil
(0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil
(3.175mm)
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|
PCB size:
|
≤400mm X 500mm
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|
Solder mask:
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Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare
copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated
etc..
|
Typical Applications
Automotive
telematics antenna systems
Cellular
infrastructure base station antenna
Commercial
satellite radio antenna
About Us
We
are an established high frequency PCB supplier and exporter in Shenzhen China,
severing cellular base station antenna, satellite, high frequency passive
components, microstrip line and band line circuit, millimeter wave equipment,
radar systems, digital radio frequency antenna and other fields worldwide for 19
years. Our high frequency PCBs are mainly built on 3 high frequency material
brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges
from 2.2 to 10.2 etc.
Our advantages
1.Powerful PCB capabilities support your
research and development, sales and marketing;
2.PCB Products and Manufacturing are
certified by authorized organizations;
3.16000㎡workshop with 30000㎡output capability and 8000 types of PCB's per month;
4.Quick CADCAM checking and free PCB
quotation;
5.No minimum order quantity. 1 piece is
available;
6.A Team with passion, discipline,
responsibility and honesty;
7.More than 19+ years of high frequency
PCB experience;
8.Prototype PCB capability to Volume
Production capability;
9.Delivery on time: >98%, Customer
complaint rate: <1%
10.IPC Class 2 / IPC Class 3;
Appendix: Typical Value of AD255C
|
Electrical
Properties
|
AD255C
|
Units
|
Test
Conditions
|
Test Method
|
|
PIM (30mil/60mil)
|
-159/-163
|
dBc
|
Reflected
43 dBm swept tones at 1900 MHz, S1/S1
|
Rogers
Internal 50 ohm
|
|
Dielectric Constant (process)
|
2.55
|
-
|
23°C
@ 50% RH
|
10
GHz
|
IPC
TM-650 2.5.5.5
(IPC TM-650 2.5.5.3)
|
|
Dielectric Constant (design)
|
2.60
|
-
|
C-24/23/50
|
10
GHz
|
Microstrip
Differential Phase Length
|
|
Dissipation Factor (process)
|
0.0013
|
-
|
23°C
@ 50% RH
|
10
GHz
|
IPC
TM-650 2.5.5.5
|
|
Thermal Coefficient of Dielectric Constant
|
-110
|
ppm/ºC
|
0°C
to 100°C
|
10
GHz
|
IPC
TM-650 2.5.5.5
|
|
Volume Resistivity
|
7.4
x 108
|
Mohm-cm
|
C-96/35/90
|
-
|
IPC
TM-650 2.5.17.1
|
|
Surface Resistivity
|
3.6
x 107
|
Mohm
|
C-96/35/90
|
-
|
IPC
TM-650 2.5.17.1
|
|
Electrical Strength (dielectric strength)
|
911
|
V/mil
|
-
|
-
|
IPC
TM-650 2.5.6.2
|
|
Dielectric Breakdown
|
>40
|
kV
|
D-48/50
|
X/Y
direction
|
IPC
TM-650 2.5.6
|
|
Thermal
Properties
|
|
Decomposition Temperature (Td)
|
>500
|
˚C
|
2hrs
@ 105˚C
|
5%
Weight Loss
|
IPC
TM-650 2.3.40
|
|
Coefficient of Thermal Expansion - x
|
34
|
ppm/˚C
|
-
|
-55˚C
to 288˚C
|
IPC
TM-650 2.4.41
|
|
Coefficient of Thermal Expansion - y
|
26
|
ppm/˚C
|
-
|
-55˚C
to 288˚C
|
IPC
TM-650 2.4.41
|
|
Coefficient of Thermal Expansion - z
|
196
|
ppm/˚C
|
-
|
-55˚C
to 288˚C
|
IPC
TM-650 2.4.41
|
|
Thermal Conductivity
|
0.35
|
W/mK
|
-
|
z
direction
|
ASTM
D5470
|
|
Time to Delamination
|
>60
|
minutes
|
as-received
|
288˚C
|
IPC
TM-650 2.4.24.1
|
|
Mechanical
Properties
|
|
Copper Peel Strength after Thermal Stress
|
2.4
(13.6)
|
N/mm
(lbs/in)
|
10s
@288˚C
|
35
μm foil
|
IPC
TM-650 2.4.8
|
|
Flexural Strength (MD/CMD)
|
8.8/6.4
(60.7/44.1)
|
MPa
(ksi )
|
25°C
± 3°C
|
-
|
ASTM
D790
|
|
Tensile Strength (MD/CMD)
|
8.1/6.6
(55.8/45.5)
|
MPa
(ksi )
|
23°C/50%
RH
|
-
|
ASTM
D3039/D3039-14
|
|
Flex Modulus (MD/CMD)
|
930/818
(6,412/5,640)
|
MPa
(ksi )
|
25°C
± 3°C
|
-
|
IPC-TM-650
Test Method 2.4.4
|
|
Dimensional Stability (MD/CMD)
|
0.03/0.07
|
mils/inch
|
after
etch + bake
|
-
|
IPC-TM-650
2.4.39a
|
|
Physical
Properties
|
|
Flammability
|
V-0
|
-
|
-
|
-
|
UL-94
|
|
Moisture Absorption
|
0.03
|
%
|
E1/105
+D48/50
|
-
|
IPC
TM-650 2.6.2.1
|
|
Density
|
2.28
|
g/cm3
|
C-24/23/50
|
-
|
ASTM
D792
|
|
Specific Heat Capacity
|
0.813
|
J/g°K
|
2
hours at 105°C
|
-
|
ASTM
E2716
|
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