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RO4003C hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication.
Item NO.:
BIC-006-v183.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers 4003 32mil 0.813mm PCB RO4003C Double Sided RF High Frequency PCB for Filters
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
The Rogers RO4003 material can be removed with conventional nylon brushes. There is no specific preparation needed prior to copper plating without electricity. The plate needs to be processed using customary epoxy/glass techniques. Because the high TG resin system (280 ° C + [536 ° F]) is not susceptible to discoloration during drilling, it is typically not necessary to remove drilled holes. If the stain is the product of aggressive drilling techniques, the resin can be removed using a conventional CF4/O2 plasma cycle or a double pass through an alkaline permanganate process.
The surfaces of the plates can be mechanically and/or chemically prepared for photoprotection. It is advised to use common aqueous or semi-aqueous photoresists. You can utilize any of the copper wipers that are offered for sale. The surface of Rogers RO4003 accepts any filterable or photographic solder masks that are typically used in epoxy/glass laminates quite well. The best bonding should be prevented by mechanically wiping the exposed dielectric surface before applying the solder mask and a selected "registered" surface.
HASL and REFLOW:
The baking requirements of RO4000 materials are comparable to those of epoxy/glass. In general, RO4003 plates do not need to be baked on equipment that does not bake epoxy/glass plates. For installations that typically create epoxy/bake glass, we advise cooking at 300 °F and 250 °F (121 °C and 149 °C) for one to two hours. There are no flame retardants in RO4003. It is known that plates running at extremely slow transport speeds or inside an infrared (IR) unit can attain temperatures of more than 700 °F (371 °C). At this high temperatures, RO4003 may begin to burn. Systems that still employ IR reflow units or other components capable of operating at this high temperatures should take the required safety measures to eliminate any potential dangers.
life itself:
High-frequency laminates can be kept indefinitely at standard room conditions of humidity and temperature (55–85 °F, 13–30 °C). The dielectric materials are inert at high humidity when at room temperature. But when exposed to excessive humidity, metal coatings like copper can oxidize. Corrosion from materials that have been properly stored can be removed with ease by doing a standard PWB pre-cleaning.
ROUTE:
The RO4003 material can be machined using standard epoxy/glass machining equipment and hard metal conditions. In order to avoid smearing, the copper foil must be taken out of the guiding channels.
PCB Specifications:
PCB SIZE | 98 x 72mm=1PCS |
BOARD TYPE | |
Number of Layers | Double sided PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 35um(1oz)+PLATE |
RO4003C 32 mil 0.813mm | |
copper ------- 35um(1oz)+PLATE | |
TECHNOLOGY | |
Minimum Trace and Space: | 6.98mil/6.28mil |
Minimum / Maximum Holes: | 0.3/1.2mm |
Number of Different Holes: | 5 |
Number of Drill Holes: | 481 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 1 |
Impedance Control | no |
BOARD MATERIAL | |
Glass Epoxy: | RO4003C 32 mil (0.813mm), Tg 288℃ |
Final foil external: | 1.5oz |
Final foil internal: | 0oz |
Final height of PCB: | 0.9 mm ±0.1 |
PLATING AND COATING | |
Surface Finish | Immersion Gold |
Solder Mask Apply To: | NO |
Solder Mask Color: | NO |
Solder Mask Type: | N/A |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | NO |
Colour of Component Legend | NO |
Manufacturer Name or Logo: | N/A |
VIA | Plated Through Hole(PTH) |
FLAMIBILITY RATING | N/A |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Typical applications are as follows:
Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID
Data Sheet of Rogers 4003C (RO4003C)
RO4003C Typical Value | |||||
Property | RO4003C | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
Dissipation Factortan,δ |
0.0027 0.0021 |
Z |
10
GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
Tensile Modulus |
19,650(2,850) 19,450(2,821) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Tensile Strength |
139(20.2) 100(14.5) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Flexural Strength |
276 (40) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.3 | X,Y |
mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion |
11 14 46 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
Tg | >280 | ℃TMA | A | IPC-TM-650 2.4.24.3 | |
Td | 425 | ℃TGA | ASTM D 3850 | ||
Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
Moisture Absorption | 0.06 | % |
48hrs
immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength |
1.05 (6.0) |
N/mm (pli) |
after
solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
Flammability | N/A | UL 94 | |||
Lead-free Process Compatible | Yes |
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