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Home High Frequency PCB Rogers 4003 32mil 0.813mm Material PCB RO4003C Double Sided RF High Frequency PCB

Rogers 4003 32mil 0.813mm Material PCB RO4003C Double Sided RF High Frequency PCB

RO4003C hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. 

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Rogers 4003 32mil 0.813mm PCB RO4003C Double Sided RF High Frequency PCB for Filters

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

The Rogers RO4003 material can be removed with conventional nylon brushes. There is no specific preparation needed prior to copper plating without electricity. The plate needs to be processed using customary epoxy/glass techniques. Because the high TG resin system (280 ° C + [536 ° F]) is not susceptible to discoloration during drilling, it is typically not necessary to remove drilled holes. If the stain is the product of aggressive drilling techniques, the resin can be removed using a conventional CF4/O2 plasma cycle or a double pass through an alkaline permanganate process.

The surfaces of the plates can be mechanically and/or chemically prepared for photoprotection. It is advised to use common aqueous or semi-aqueous photoresists. You can utilize any of the copper wipers that are offered for sale. The surface of Rogers RO4003 accepts any filterable or photographic solder masks that are typically used in epoxy/glass laminates quite well. The best bonding should be prevented by mechanically wiping the exposed dielectric surface before applying the solder mask and a selected "registered" surface.


The baking requirements of RO4000 materials are comparable to those of epoxy/glass. In general, RO4003 plates do not need to be baked on equipment that does not bake epoxy/glass plates. For installations that typically create epoxy/bake glass, we advise cooking at 300 °F and 250 °F (121 °C and 149 °C) for one to two hours. There are no flame retardants in RO4003. It is known that plates running at extremely slow transport speeds or inside an infrared (IR) unit can attain temperatures of more than 700 °F (371 °C). At this high temperatures, RO4003 may begin to burn. Systems that still employ IR reflow units or other components capable of operating at this high temperatures should take the required safety measures to eliminate any potential dangers.

life itself:

High-frequency laminates can be kept indefinitely at standard room conditions of humidity and temperature (55–85 °F, 13–30 °C). The dielectric materials are inert at high humidity when at room temperature. But when exposed to excessive humidity, metal coatings like copper can oxidize. Corrosion from materials that have been properly stored can be removed with ease by doing a standard PWB pre-cleaning.


The RO4003 material can be machined using standard epoxy/glass machining equipment and hard metal conditions. In order to avoid smearing, the copper foil must be taken out of the guiding channels.

PCB Specifications:

PCB SIZE 98 x 72mm=1PCS
Number of Layers Double sided PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35um(1oz)+PLATE
RO4003C 32 mil 0.813mm
copper ------- 35um(1oz)+PLATE
Minimum Trace and Space: 6.98mil/6.28mil
Minimum / Maximum Holes: 0.3/1.2mm
Number of Different Holes: 5
Number of Drill Holes: 481
Number of Milled Slots: 0
Number of Internal Cutouts: 1
Impedance Control no
Glass Epoxy:  RO4003C 32 mil (0.813mm), Tg 288℃
Final foil external:  1.5oz
Final foil internal:  0oz
Final height of PCB:  0.9 mm ±0.1
Surface Finish Immersion Gold
Solder Mask Apply To:  NO
Solder Mask Color:  NO
Solder Mask Type: N/A
Side of Component Legend NO
Colour of Component Legend NO
Manufacturer Name or Logo:  N/A
VIA Plated Through Hole(PTH)
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Typical applications are as follows:

Automotive Radar and Sensors

Cellular Base Station Antennas

Direct Broadcast Satellites

Low Noise Block

Power amplifiers


High Frequency PCB

Data Sheet of Rogers 4003C (RO4003C)

RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z 10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
Z 10 GHz/23℃
2.5 GHz/23℃
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650
Volume Resistivity 1.7 x 1010 MΩ.cm COND A IPC-TM-650
Surface Resistivity 4.2 x 109 COND A IPC-TM-650
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650
Tensile Modulus 19,650(2,850)
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
MPa(ksi) RT ASTM D 638
Flexural Strength 276
IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280 ℃TMA A IPC-TM-650
Td 425 ℃TGA ASTM D 3850
Thermal Conductivity 0.71 W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06 % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A UL 94
Lead-free Process Compatible Yes




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