TFA615 PCB 2-layer 0.508mm 20mil Thick DK6.15 ENIG TFA Series Substrates

TFA615 PCB 2-layer 0.508mm 20mil Thick DK6.15 ENIG TFA Series Substrates

Introduction to TFA Series Substrates:

The TFA series PCB substrate represents a paradigm shift in dielectric substrate technology, built on a Polytetrafluoroethylene (PTFE) ceramic composite that abandons traditional manufacturing methods. Unlike conventional substrates produced by impregnating glass fiber cloth with resin, TFA substrates utilize an innovative process: prefabricated sheets are created through a proprietary technique and then pressed using a specialized lamination process. This breakthrough eliminates the limitations of glass fiber-based materials, positioning TFA as an aerospace-grade, high-frequency, and high-reliability alternative to comparable foreign products.

A key distinction of the TFA series PCB is the absence of glass fiber cloth. Instead, it incorporates a high concentration of uniformly dispersed special nano-ceramics blended with resin, which eliminates the "fiberglass effect"—a common source of electromagnetic wave propagation distortion in traditional PCBs. This results in exceptional frequency stability and minimal dielectric loss, outperforming materials in its class. Additionally, the TFA series minimizes X/Y/Z anisotropy, features a low thermal expansion coefficient (CTE) matching that of copper foil, and maintains stable dielectric properties across temperature fluctuations.

The TFA series offers four dielectric constant (Dk) options to suit diverse application needs: 

2.94 (TFA294), 3.0 (TFA300), 6.15 (TFA615), and 10.2 (TFA1020).

Product Overview: TFA615 2-Layer 20mil PCB

Leveraging the advanced TFA 615 PCB substrate (Dk 6.15), this 2-layer PCB is engineered for high-frequency, mission-critical systems where performance, reliability, and environmental resilience are non-negotiable. It combines the material advantages of the TFA series with precision manufacturing to deliver a solution that excels in aerospace, defense, and satellite communication applications.

1. PCB Construction Details

The following table outlines the core construction specifications, each optimized to maximize the DK6.15 TFA PCB substrate’s performance and ensure compatibility with rigorous industry standards.

2.PCB Stackup

The 2-layer stackup is designed to complement the TFA615 substrate’s properties, ensuring efficient signal transmission and thermal management.

3. PCB Statistics

These metrics reflect the PCB’s capability to support dense component integration, critical for high-frequency modules and rugged applications.

Key Features of TFA615 Substrate

• Dielectric Constant (Dk): 6.15±0.12 at 10GHz (stable across frequencies)
• Dissipation Factor: 0.0015 at 10GHz, 0.0017 at 20GHz (minimal signal loss)
• CTE: 16 ppm/°C (x/y-axis), 29 ppm/°C (z-axis) (-55°C to 288°C) (matches copper foil)
• Thermal Conductivity: 0.8 W/mk (efficient heat dissipation)
• Moisture Absorption: 0.06% (resists environmental degradation)
• UL 94-V0 (flame retardant)
• Td (Decomposition Temperature): 503°C (survives extreme heat)

Typical Applications

The TFA615 20 mil PCB is purpose-built for industries where performance and reliability are non-negotiable: 

• - Aerospace equipment, space, in-cabin equipment, aircraft;
• - Microwaves, antennas, phase-sensitive antennas;
• - Early warning radars, airborne radars, etc.;
• - Phased array antennas, beamforming networks;
• - Satellite communications, navigation;
• - Power amplifiers.

Quality & Availability

• Quality Standard: IPC-Class 2 (meets global reliability requirements)
• Artwork Compatibility: Gerber RS-274-X (industry-standard format)
• Global Availability: Distributed worldwide for timely delivery of prototypes and production runs

Conclusion

For engineers and buyers seeking a high-performance, cost-effective alternative to foreign aerospace-grade PCBs, the TFA615 2-Layer 20 mil PCB delivers unmatched value—combining technical excellence, global availability, and the durability to thrive in the world’s harshest environments.