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TLX-8 31mil Taconic PCB Materials combines premium materials, precise manufacturing, and extreme environment resilience to deliver consistent, high-performance results.
Item NO.:
BIC-444-v527.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
TLX-8 PCB 2-layer 31mil 0.787mm Immersion Gold Taconic High Frequency PCB
The TLX-8 2-layer 31 mil PCB is a cutting-edge solution tailored for high-reliability RF and microwave applications, leveraging premium PTFE fiberglass laminate to deliver exceptional performance in extreme conditions. Designed to meet the demands of aerospace, defense, telecom, and industrial sectors, this Taconic TLX-8 PCB combines tight dimensional control, low dielectric loss, and robust mechanical properties—making it the ideal choice for low-layer-count microwave designs that require stability across wide temperature ranges, vibration, and radiation exposure. Below is a comprehensive breakdown of its core specifications, followed by insights into its material advantages and real-world applications.
PCB Construction Details
The following table outlines the critical manufacturing and dimensional specifications of the 31 mil TLX-8 PCB, ensuring transparency on build quality and performance-critical parameters:
|
Parameter |
Specification |
|
Base Material |
TLX-8 (PTFE Fiberglass Laminate) |
|
Layer Count |
2 Layers |
|
Board Dimensions |
25mm x 71mm (1PCS) ± 0.15mm |
|
Minimum Trace/Space |
4/6 mils |
|
Minimum Hole Size |
0.3mm |
|
Blind Vias |
None |
|
Finished Board Thickness |
0.8mm |
|
Finished Cu Weight (Outer Layers) |
1oz (1.4 mils) |
|
Via Plating Thickness |
20 μm |
|
Surface Finish |
Immersion Gold |
|
Top Silkscreen |
White |
|
Bottom Silkscreen |
No |
|
Top Solder Mask |
No |
|
Bottom Solder Mask |
No |
|
Quality Control |
100% Electrical Test Prior to Shipment |
PCB Stackup
Engineered for optimal RF performance and mechanical rigidity, the 2-layer stackup features precisely calibrated layer thicknesses to minimize signal loss:
|
Layer |
Material/Component |
Thickness |
|
Copper Layer 1 |
Outer Conductive Layer |
35 μm |
|
Core |
Taconic TLX-8 |
0.787mm (31mil) |
|
Copper Layer 2 |
Outer Conductive Layer |
35 μm |
PCB Statistics
Key layout and connectivity metrics reflecting the Taconic RF PCB Circuit Board’s design efficiency and component compatibility:
|
Metric |
Value |
|
Total Components |
11 |
|
Total Pads |
34 |
|
Thru Hole Pads |
19 |
|
Top SMT Pads |
15 |
|
Bottom SMT Pads |
0 |
|
Vias |
27 |
|
Nets |
2 |
Core Material: TLX-8 PTFE Fiberglass Laminate
At the heart of this Taconic Immersion Gold PCB is TLX-8, a high-volume antenna-grade material renowned for its versatility and resilience in extreme environments. As a PTFE-based laminate, it excels in low-layer count microwave designs, offering mechanical reinforcement where substrates face severe conditions—including vibration during space launches, high-temperature exposure in engine modules, radiation resistance for space applications (compliant with NASA’s low outgassing standards), saltwater resistance for warship antennas, and wide temperature tolerance for flight altimeters. Its availability in diverse thicknesses and copper cladding options makes it a flexible choice for specialized RF needs.
Key Benefits
The TLX-8 Taconic PCB Substrate delivers industry-leading performance through a suite of critical advantages:
1) Exceptional PIM values (≤-160 dBc*), ensuring minimal signal interference in high-power RF systems
2) Superior mechanical and thermal stability, withstanding extreme temperature fluctuations and physical stress
3) Low and stable dielectric constant (Dk = 2.55±0.04 at 10GHz) for consistent signal propagation
4) Tight dimensional stability (≤0.10 mm/M after thermal stress) to maintain precision in assembled systems
5) Ultra-low moisture absorption (0.02%), preventing performance degradation in humid environments
6) Low dissipation factor (DF = 0.0018 at 10GHz) for minimal signal loss in high-frequency applications
7) UL 94 V0 flammability rating, enhancing safety in critical systems
Main Technical Properties
The TLX-8 PTFE Laminate PCB’s performance is validated by rigorous testing to IPC-650 and ASTM standards:
1) Electrical Performance: Surface resistivity (6.605 x 10⁸Mohm at elevated temperatures) and volume resistivity (1.110 x 10¹⁰Mohm/cm) ensure reliable insulation, while dielectric breakdown (> 45 Kv) guarantees robustness.
2) Thermal Stability: Decomposition temperature (Td) of 535°C (2% weight loss) and 553°C (5% weight loss) enables operation in high-heat environments.
3) Dimensional & Mechanical Integrity: Coefficient of thermal expansion (CTE) of 21-23 ppm/°C (X/Y axes) minimizes warpage, while excellent chemical resistance ensures longevity in harsh atmospheres.
Quality & Compatibility
Manufactured to IPC-Class-2 standards, the PCB undergoes 100% electrical testing before shipment, guaranteeing functional reliability.
It supports Gerber RS-274-X artwork files, ensuring seamless integration with standard PCB design workflows. With worldwide availability, it enables global manufacturers to access consistent, high-quality components for their projects.
Typical Applications
This TLX-8 Taconic Substrate PCB is engineered for use in:
Whether you’re designing for space, defense, telecom, or industrial use, the TLX-8 31mil Taconic PCB Materials combines premium materials, precise manufacturing, and extreme environment resilience to deliver consistent, high-performance results. Its balance of electrical, mechanical, and thermal properties makes it a standout choice for engineers seeking reliability in mission-critical RF and microwave systems.
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