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TUC TU-768 PCB series delivers advanced features and outstanding performance, making it the ultimate choice for high-quality circuit board applications.
Item NO.:
BIC-299-v371.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
TU-768 PCB 2-Layer 1.6mmThick TG180 High Temperature Circuit Board with HASL
Introduction
TUC is proud to present its latest innovation in PCB technology: the TU-768 laminate and prepreg. Manufactured using premium woven E-glass coated with an epoxy resin system, the TU-768 series offers exceptional performance and reliability. These laminates are specifically designed to meet the demanding requirements of modern electronic circuit boards that need to endure severe thermal cycles and extensive assembly processes. With outstanding properties such as superior chemical resistance, thermal stability, anti-CAF characteristics, and UV-block capabilities,TU-768substratesare a perfect choice for cutting-edge applications.
Typical Properties
2.1 Glass Transition Temperature (Tg):
The TU-768 series features a remarkable Tg of 180°C, as measured by DSC (Differential Scanning Calorimetry). This high Tg ensures the PCB's stability and integrity even in harsh operating conditions.
2.2 Lead-Free Process Compatibility:
In compliance with industry standards, TU-768 laminates are fully compatible with lead-free manufacturing processes, ensuring environmental sustainability and meeting regulatory requirements.
2.3 Excellent Coefficient of Thermal Expansion (CTE):
With a low CTE of 11-15 ppm/°C in both the X and Y axes, TU-768 laminates minimize the potential for stress-induced issues, ensuring reliable performance and enhanced durability.
2.4 Time to Delaminate:
TU-768 laminates exhibit exceptional resistance to delamination. With a T260 of 60 minutes and a T288 of 15 minutes (as measured by TMA after copper removal), these laminates withstand high temperatures without compromising structural integrity.
2.5 Impressive Permittivity and Loss Tangent:
The TU-768 series boasts an impressive dielectric constant (DK) of 4.3 at 5 GHz and 10 GHz, and 4.3-4.4 at 1 GHz. Additionally, the loss tangent (Df) values are equally impressive: 0.023 at 10 GHz, 0.021 at 5 GHz, and 0.019-0.018 at 1 GHz. These properties ensure reliable signal transmission and minimize signal loss, making TU-768 an ideal choice for high-frequency applications.
2.6 Anti-CAF Property:
TU-768 laminates offer exceptional resistance to Conductive Anodic Filamentation (CAF). The unique composition of the laminate prevents the formation of conductive paths, ensuring reliable performance and extending the lifespan of the PCB.
2.7 Superior Chemical and Thermal Resistance:
Designed to withstand aggressive chemical environments, TU-768 laminates demonstrate excellent resistance to a wide range of chemicals. Additionally, these laminates exhibit exceptional thermal stability, ensuring reliable operation over a broad temperature range.
2.8 Fluorescence for Automated Optical Inspection (AOI):
To streamline quality control processes, TU-768 laminates feature fluorescence, allowing for easy detection during automated optical inspection. This feature enhances manufacturing efficiency and reduces the risk of defects.
2.9 Moisture Resistance:
TU-768 laminates exhibit outstanding moisture resistance, with a moisture absorption level of only 0.18%. This property ensures the long-term reliability of the PCB in humid or damp environments.
2.10 UL94-V0 Flammability Rating:
For enhanced safety, TU-768 laminates have been tested and certified with a UL94-V0 flammability rating, ensuring optimal fire resistance for both the laminate and laminated prepreg.
PCB Stack-up: 2-layer Rigid PCB
Copper Layer 1: 35μm
TU-768 Core: 1.5 mm (60 mil)
Copper Layer 2: 35μm
PCB Construction Details
The 60mil TU-768 PCB features robust construction to meet stringent quality standards:
Parameter |
Details |
Board Dimensions |
110mm x 197 mm = 1PCS, ±0.15mm |
Minimum Trace/Space |
4/4 mils |
Minimum Hole Size |
0.3mm |
Blind Vias |
No |
Finished Board Thickness |
1.6mm |
Finished Cu Weight |
1oz (1.4 mils) outer layers |
Via Plating Thickness |
20 μm |
Surface Finish |
Hot Air Soldering Level (HASL) |
Top Silkscreen |
White |
Bottom Silkscreen |
No |
Top Solder Mask |
Green |
Bottom Solder Mask |
Green |
Pre - Shipment Test |
100% Electrical test |
PCB Statistics
PCB Statistic |
Value |
Components |
41 |
Total Pads |
152 |
Thru Hole Pads |
97 |
Top SMT Pads |
45 |
Bottom SMT Pads |
0 |
Vias |
51 |
Nets |
2 |
Type of Artwork Supplied: Gerber RS-274-X
For ease of manufacturing and compatibility with industry-standard PCB fabrication processes, the TU-768 PCB material utilizes Gerber RS-274-X artwork files, ensuring seamless integration into production workflows.
Quality Standard: IPC-Class-2
TU-768 high temperature PCBs adhere to the IPC-Class-2 quality standard, guaranteeing consistent and reliable performance. This ensures that the product meets the demands of a wide range of applications while delivering the highest level of quality and durability.
Availability
TU-768 PCBs are available worldwide, allowing engineers and developers to access this cutting-edge technology regardless of their location. TUC's vast network of distributors guarantees prompt delivery and technical support, ensuring a smooth and efficient integration process.
Applications for TU-768 PCBs
- Consumer Electronics
- Server, workstation
- Automotive
Conclusion
TUC TU-768 PCB series delivers advanced features and outstanding performance, making it the ultimate choice for high-quality circuit board applications. With its exceptional properties, robust construction, and compliance with industry standards,TU-768 high TG PCB sets a new standard in PCB technology. Trust TU-768 for enhanced reliability, increased design flexibility, and the utmost confidence in your electronic systems. Experience the excellence of TU-768 and unlock the full potential of your electronic innovations.
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