WL-CT Series High Frequency PCB Double-sided 1.6mmWL-CT338 aluminum-based boards
Introduction
The WL-CT series of organic polymer ceramic fiberglass cloth-covered copper boards is a thermosetting resin-based high-frequency material. The composition of the dielectric layer includes hydrocarbon resin, ceramics, and fiberglass cloth. It exhibits low loss performance, meeting the requirements for high-frequency designs. PCB processing can be carried out using techniques similar to FR4 materials, making it simpler compared to PTFE materials and ensuring better stability and consistency in circuitry. It can be used as a substitute for similar foreign products.
The combination of hydrocarbon resin and composite ceramics provides excellent low loss, high-temperature resistance, and temperature stability characteristics. The series of materials have a stable temperature coefficient of dielectric constant and loss, low thermal expansion coefficient, and a high TG value of above 280°C.
The series offers a selection of dielectric constants: 3.00, 3.30, 3.38, 3.48, 4.10, and 6.15.
These materials can be paired with standard ED copper foil or reverse-treated RTF copper foil. RTF copper foil offers excellent PIM (Passive Intermodulation) performance, reducing conductor loss and insertion loss. The back-treated RTF copper foil has an increased material thickness of 0.018mm (0.7mil), providing good adhesion.
The series can also be paired with aluminum-based substrates to create aluminum-based high-frequency materials.
The circuit boards can be processed using standard FR4 board fabrication techniques. The excellent mechanical and physical properties of the material allow for multiple lamination cycles, making it suitable for multi-layer, high-layer-count, and backplane processing. It exhibits excellent processability in dense hole and fine line routing.
Product Features
Ø Low dielectric constant tolerance and low loss.
Ø Thermosetting resin-based system with improved PCB processability and heat resistance.
Ø Excellent temperature coefficient of dielectric constant with minimal temperature variation.
Ø Thermal expansion coefficients in the X/Y directions equivalent to copper foil; low thermal expansion coefficient in the Z direction ensures dimensional stability and reliable copper connections in the holes.
Ø High TG value above 280°C, maintaining dimensional stability and copper quality even at high temperatures.
Ø High thermal conductivity, superior to thermoplastic materials of the same grade, suitable for high-power applications.
Ø Commercialized, mass-produced, cost-effective products.
Ø Excellent resistance to radiation, maintaining stable dielectric and physical properties even after exposure to radiation.
Ø Low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.
Product Models & Data Sheet
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Product Technical Parameters
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Product Models & Data Sheet
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Product Features
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Test Conditions
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Unit
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WL-CT300
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WL-CT330
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WL-CT330Z
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WL-CT338
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WL-CT350
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WL-CT440
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WL-CT615
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Dielectric Constant (Typical)
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10GHz
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/
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3.00
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3.30
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3.30
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3.38
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3.48
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4.10
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6.15
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Dielectric Constant (Design)
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10GHz
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/
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2.98
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3.45
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3.45
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3.55
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3.66
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4.38
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6.4
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Dielectric Constant Tolerance
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/
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/
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±0.05
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±0.06
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±0.06
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±0.05
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±0.05
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±0.08
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±0.15
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Loss Tangent (Typical)
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2GHz
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/
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0.0025
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0.0021
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0.0025
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0.0023
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0.0030
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0.0040
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0.0032
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10GHz
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/
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0.0030
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0.0026
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0.0030
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0.0029
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0.0039
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0.0050
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0.0040
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20GHz
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/
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0.0036
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0.0033
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0.0035
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0.0038
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0.0048
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/
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/
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Dielectric Constant Temperature Coefficient
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-55 º~150ºC
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PPM/℃
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27
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43
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43
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45
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52
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-21
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-122
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Peel Strength
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1 OZ RTF copper
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N/mm
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0.85
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1.0
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0.85
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1.0
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0.85
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1.0
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0.9
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1 OZ RTFcopper
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N/mm
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0.72
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0.72
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0.72
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0.72
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0.72
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Not compatible
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Not compatible
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Volume Resistivity
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Standard Condition
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MΩ.cm
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3×10^8
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5×10^9
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5×10^9
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6×10^9
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1×10^9
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1×10^9
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2×10^7
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Surface Resistivity
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Standard Condition
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MΩ
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2×10^8
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5×10^9
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5×10^9
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7×10^8
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4×10^9
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5×10^7
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5×10^6
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Electrical Strength (Z direction)
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5KW，500V/s
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KV/mm
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28
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22
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22
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31
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31
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27
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30
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Breakdown Voltage (XY direction)
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5KW，500V/s
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KV
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35
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22
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22
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30
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30
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25
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25
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Coefficientof Thermal Expansion (X, Y direction)
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-55 º~288ºC
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ppm/ºC
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15, 14
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15, 13
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15, 13
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14, 16
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11, 14
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14, 18
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15, 17
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Coefficientof Thermal Expansion (Z direction)
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-55 º~288ºC
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ppm/ºC
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31
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39
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39
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50
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34
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35
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33
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Thermal Stress
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288℃, 10s，3 times
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/
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No Delamination
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No Delamination
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No Delamination
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No Delamination
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No Delamination
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No Delamination
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No Delamination
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Water Absorption
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20±2℃, 24 hours
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%
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0.15
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0.02
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0.05
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0.04
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0.05
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0.12
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0.08
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Density
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Room Temperature
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g/cm3
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1.57
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1.82
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1.78
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1.78
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1.90
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2.00
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2.18
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Long-Term Operating Temperature
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High-Low Temperature Chamber
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℃
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-55～+260
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-55～+260
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-55～+260
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-55～+260
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-55～+260
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-55～+260
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-55～+260
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Thermal Conductivity
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Z direction
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W/(M.K)
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0.41
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0.59
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0.59
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0.70
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0.70
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0.66
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0.72
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PIM
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Paired with RTF copper foil.
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dBc
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≤-158
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≤-157
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≤-157
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≤-158
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≤-157
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N/A
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N/A
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Flammability
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UL-94
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Grade
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V-0
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Non-flame retardant
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V-0
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Non-flame retardant
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V-0
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V-0
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V-0
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TG
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Standard
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℃
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>280℃
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>280℃
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>280℃
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>280℃
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>280℃
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>280℃
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>280℃
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TD
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Initial Value
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℃
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412
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421
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386
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421
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386
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402
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398
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Halogen
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Yes
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No
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Yes
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No
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Yes
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Yes
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No
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Material Composition
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Hydrocarbon + Ceramic + Fiberglass cloth
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Our PCB Capability (WL-CT)
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PCB Capability (WL-CT Series)
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PCB Material:
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Hydrocarbon resin, ceramic, and glass fiber cloth
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Designation (WL-CT Series)
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Designation
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DK
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DF
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WL-CT300
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3.0±0.05
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0.0030
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WL-CT330
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3.3±0.06
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0.0026
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WL-CT330Z
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3.3±0.06
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0.0030
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WL-CT338
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3.38±0.05
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0.0029
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WL-CT350
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3.48±0.05
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0.0039
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WL-CT440
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4.1±0.08
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0.0050
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WL-CT615
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6.15±0.15
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0.0040
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Layer count:
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Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
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Copper weight:
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1oz (35µm), 2oz (70µm)
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Dielectric thickness
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ED Copper
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TRF Copper
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4mil
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/
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8mil
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8.7mil
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12mil
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/
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16mil
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/
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20mil
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20.7mil
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28mil
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/
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32mil
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32.7mil
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40mil
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40.7mil
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60mil
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60.7mil
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80mil
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80.7mil
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PCB size:
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≤400mm X 500mm
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Solder mask:
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Green, Black, Blue, Yellow, Red etc.
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Surface finish:
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Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..
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A WL-CT PCB and Applications
Displayed on the screen is a double-sided 1.6mm WL-CT338 PCB with immersion gold coating specifically designed for filters. WL-CT high frequency PCBs are versatile and widely used in various applications, including:
Base station antennas and satellite antennas.
Automotive radar, sensors, and navigation systems.
Power amplifiers.
Satellite high-frequency heads.
RF devices and filters.
WIMAX antennas and distributed antennas.
Small-sized patch antennas.
Final (WL-CT series aluminum-based boards)
This series of laminates provides aluminum-based substrates, where one side of the dielectric layer is covered with copper foil, and the other side is covered with an aluminum-based layer. It serves for shielding or heat dissipation purposes. The model numbers are WL-CT350-AL. For instance, WL-CT350-AL represents WL-CT350 with an aluminum-based substrate.
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