Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm

Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm

Hybrid PCB Introduction

Introducing the Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm, a cutting-edge solution that combines the benefits ofTg170 FR-4 and20mil RO4003C materials. This hybrid PCB offers unparalleled performance and versatility, making it ideal for a wide range of applications. By integrating different materials into specific sections of the board, this hybrid PCB achieves exceptional mixed-signal compatibility, high-frequency performance, thermal management capabilities, design flexibility, cost optimization, and compatibility with standard fabrication processes.

Features (Tg170 FR-4 and 20mil RO4003C Combined)

The Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm combines Tg170 FR-4 and 20mil RO4003C materials to deliver a host of remarkable features and benefits.

2.1 Mixed-Signal Compatibility

The hybrid PCB is designed to accommodate both analog and digital signals. The Tg170 FR-4 portion provides a suitable substrate for standard circuitry, ensuring optimal performance for digital signals. Simultaneously, the RO4003C section delivers excellent high-frequency performance, enabling efficient transmission of RF/microwave signals. This combination makes the hybrid PCB versatile and adaptable to a wide range of signal requirements.

2.2 High-Frequency Performance

One of the standout features of the Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm is its exceptional high-frequency performance. The RO4003C material boasts low dielectric loss and excellent signal integrity properties. These characteristics enable the efficient transmission of high-frequency signals, minimizing signal loss and distortion. Whether it's for radar systems, satellite communications, avionics, or spectrum analyzers, this hybrid PCB ensures optimum performance in demanding high-frequency applications.

2.3 Thermal Management

Effective thermal management is crucial for electronic devices that generate significant heat during operation. The FR-4 material integrated into the hybrid PCB offers excellent thermal conductivity, aiding in the dissipation of heat generated by components. By efficiently managing heat, this PCB ensures reliable and stable performance, making it suitable for applications where temperature control is critical.

2.4 Design Flexibility

With its hybrid design, the PCB enables designers to achieve greater flexibility in their product development process. The integration of different technologies and materials allows for optimized layouts and material selection tailored to the specific requirements of each section of the PCB. Designers can harness the benefits of both Tg170 FR-4 and RO4003C materials, ensuring the best performance and functionality for their applications.

2.5 Cost Optimization

The Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm offers a cost-effective solution without compromising performance. By selectively using the high-performance RO4003C material in sections that require it, costs can be optimized. The more readily available and cost-effective FR-4 material is used in other areas of the board. This approach strikes a balance between performance and cost, making the hybrid PCB a cost-efficient alternative to using high-frequency materials throughout the entire board.

2.6 Compatibility

Both Tg170 FR-4 and RO4003C materials used in the hybrid PCB are compatible with standard PCB fabrication processes. This compatibility ensures ease of manufacturing and assembly, allowing for seamless integration into existing production workflows. The hybrid PCB can be readily adopted without requiring significant changes to manufacturing processes or equipment.

PCB Stackup: 6-layer Rigid PCB

The Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm features a well-designed stackup that ensures optimal performance and reliability. The stackup configuration is as follows:

 This carefully engineered stackup ensures signal integrity, thermal management, and mechanical stability, providing a solid foundation for various applications.

Hybrid PCB Construction Details

The Hybrid PCB RO4003C High Tg FR-4  is meticulously constructed to meet the highest quality standards. The following construction details highlight the reliability and performance of this PCB:

These construction details ensure precise and reliable connections, excellent thermal management, and durable protection for the PCB.

Hybrid PCB Statistics

The 6-layer Hybrid PCB boasts impressive statistics that further demonstrate its capabilities:

These statistics showcase the versatility and compatibility of the hybrid PCB, making it suitable for complex designs and a wide range of applications.

Artwork and Quality Standard

The Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm is supplied with Gerber RS-274-X artwork, ensuring accurate reproduction of the design during manufacturing. The PCB adheres to the IPC-Class-2 quality standard, guaranteeing consistent and reliable performance.

Worldwide Availability

The Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm is available worldwide, making it accessible to customers across the globe. Whether you're in North America, Europe, Asia, or any other region, you can take advantage of this advanced PCB solution for your applications.

Some Typical Applications

TheHybridprinted circuit board finds its applications in various industries and sectors. Some typical applications include:

1.Telecommunications

2.Radar Systems, Satellite Communications, Avionics

3.Vehicle Communication Modules 

4.Patient Monitoring Systems

5.Industrial Automation Systems

6.Spectrum Analyzers, Network Analyzers, and Signal Generators

Conclusion:

In conclusion, the Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm brings together the advantages of Tg170 FR-4 and 20mil RO4003C materials, offering exceptional mixed-signal compatibility, high-frequency performance, thermal management capabilities, design flexibility, cost optimization, and compatibility with standard fabrication processes. With its reliable construction, precise dimensions, and worldwide availability, this hybrid PCB is the ideal solution for a wide range of applications, including telecommunications, radar systems, vehicle communication modules, patient monitoring systems, industrial automation systems, and test and measurement equipment. Experience the power of the Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm and unlock new possibilities for your electronic designs.