1.524mm 60mil Rogers RO4534 Material PCB 2-layer Rigid High Frequency board for Automotive, aerospace
The recently arrived PCB is a 2-layer rigid board constructed of 60mil RO4534 material that can operate in a wide temperature range of -40°C to +85°C. It is made up of a stackup of 60 mil RO4534 dielectric (1.524mm) sandwiched between two layers of finished copper 35um, with a total finished copper weight of 1 ounce (1.4 mils) on all levels.
Construction details:
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Construction Details
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Specifications
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Board Dimensions
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170.66mm x 70.33mm
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+/- 0.15mm
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Minimum Trace/Space
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4/4 mils
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Minimum Hole Size
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0.4mm
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Blind/Buried Vias
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No
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Finished Board Thickness
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1.6mm
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Finished Cu Weight
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1 oz (1.4 mils)
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Via Plating Thickness
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1 mil
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Surface Finish
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Immersion Gold
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Top Silkscreen
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No
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Bottom Silkscreen
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No
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Top Solder Mask
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Green
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Bottom Solder Mask
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Green
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Silkscreen on Solder Pads
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No
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Electrical Test
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100%
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Via Filling
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Resin
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Capped (IPC-4761)
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PCB Statistics:
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PCB Statistics
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Total
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Components
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173
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Total Pads
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200
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Thru Hole Pads
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121
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Top SMT Pads
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79
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Bottom SMT Pads
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0
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Vias
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161
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Nets
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23
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Application:
The Rogers 4534 PCB is well-suited for a wide range of applications. Its dependable and sturdy architecture makes it ideal for high-temperature electronics, such as those used in the automotive, aerospace, and defense industries. Because of its high thermal conductivity and dimensional stability, the RO4534 PCB is an ideal choice for power electronics, telecommunications, and RF/microwave applications.
In summary, the Rogers 4534 PCB's high-quality construction and components make it a robust and reliable solution for a diverse range of applications. With its ability to operate in a wide temperature range and its dependable design features, this 60mil Rogers RO4534 high frequency PCB is a solid choice for any project requiring a durable and high-performance board.
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Property
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RO4534
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Direction
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Units
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Condition
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Test Method
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Dielectric Constant, er Process
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3.4 ± 0.08
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Z
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-
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10 GHz/23℃ 2.5 GHz
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IPC-TM-650,2.5.5.5
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Dissipation Factor
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0.0022
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Z
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-
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2.5 GHz/23℃
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IPC-TM-650, 2.5.5.5
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0.0027
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10 GHz/23℃
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PIM (Typical)
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-157
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-
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dBc
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Reflected 43 dBm swept tones
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Summitek 1900b PIM Analyzer
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Dielectric Strength
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>500
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Z
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V/mil
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0.51 mm
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IPC-TM-650, 2.5.6.2
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Dimensional Stability
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<0.3
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X,Y
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mm/m (mils/inch)
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after etch
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IPC-TM-650, 2.4.39A
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Coefficient of Thermal Expansion
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11
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X
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ppm/℃
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-55 to 288℃
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IPC-TM-650, 2.4.41
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14
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Y
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46
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Z
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Thermal Conductivity
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0.6
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-
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W/(m.K)
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80℃
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ASTM C518
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Moisture Absorption
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0.06
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-
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%
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D48/50
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IPC-TM-650, 2.6.2.1 ASTM D570
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Tg
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>280
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-
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℃ TMA
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A
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IPC-TM-650, 2.4.24.3
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Density
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1.8
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-
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gm/cm3
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-
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ASTM D792
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Copper Peel Strength
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6.3 （1.1）
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-
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lbs/in (N/mm)
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1 oz. EDC post solder float
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IPC-TM-650, 2.4.8
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Flammability
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NON FR
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-
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-
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-
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UL 94
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Lead-Free Process Compatible
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Yes
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-
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-
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-
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-
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