Rogers CLTE-MW PCB 2.9mil 2-layer Immersion Gold No Solder Mask Black Silkscreen

Rogers CLTE-MW PCB 2.9mil 2-layer Immersion Gold No Solder Mask Black Silkscreen

Product Overview

This high-performance 2-layer rigid printed circuit board is engineered on Rogers CLTE-MW ultra-thin laminate with a finished thickness of 0.15 mm and immersion gold surface finish, purpose-built for 5G millimeter-wave, satellite communications, aerospace electronics, and high-reliability passive RF modules. It delivers ultra-stable dielectric properties, minimal high-frequency signal loss, excellent thermal reliability, and superior mechanical dimensional stability, making it ideal for compact, low-profile, high-frequency circuit designs constrained by strict thickness and electrical performance limits.

This CLTE-MW PCB is manufactured in strict compliance with IPC-Class-2 standards, supported by full Gerber RS-274-X artwork, 100% electrical testing before shipment, and worldwide availability. It balances premium electrical performance, manufacturing maturity, and cost efficiency, serving as a robust foundation for high-volume commercial and mission-critical aerospace and defense applications.

1. PCB Construction Details

This section summarizes the mechanical, electrical, and surface finishing specifications that define the board’s structural integrity and manufacturability.

2. PCB Stackup

This stackup defines the layer structure and material thicknesses that determine impedance, loss, and thermal behavior.

3. PCB Statistics

This section quantifies circuit complexity, interconnect count, and routing density for design verification and assembly planning.

4. Product Features & Performance Advantages

4.1 Ultra-Thin, High-Frequency-Optimized Structure

With a total board thickness of only 0.15 mm and a CLTE-MW core of ~2.99 mil, this Rogers CLTE-MW PCB enables ideal signal-to-ground spacing for millimeter-wave systems. The thin-profile design reduces parasitic inductance and capacitance, supporting clean high-frequency transmission up to 100 GHz and beyond. The absence of solder masks on both sides preserves dielectric consistency and minimizes insertion loss at mmWave frequencies, a critical advantage over standard FR-4 or masked high-frequency boards.

4.2 Exceptional Electrical Performance

CLTE-MW laminate provides a tightly controlled dielectric constant (Dk) of 2.94–3.02 (process, 10 GHz) and an ultra-low dissipation factor (Df) of 0.0015 at 10 GHz, ensuring minimal signal attenuation and stable impedance control. The spread glass reinforcement and high ceramic filler loading significantly reduce glass-weave effects that degrade phase consistency and signal integrity at high frequencies. Combined with 1-oz outer copper and uniform 20-μm via plating, the board maintains low conductor loss and reliable electrical continuity across thermal cycles.

4.3 Superior Thermal & Mechanical Reliability

The Z-axis CTE of 30 ppm/°C closely matches copper, delivering exceptional plated through-hole (PTH) reliability under thermal shock and repeated cycling. Thermal conductivity of 0.42 W/(m·K) supports efficient heat dissipation in power-sensitive passive components such as filters, couplers, and baluns. The board exhibits excellent dimensional stability (0.22 mil/inch after etch and bake), supporting fine 6/7-mil line/space capability and high registration accuracy during manufacturing. It carries a UL94 V-0 flammability rating and low moisture absorption of 0.03%, ensuring stable performance in humid, high-temperature, and harsh operating environments.

4.4 Immersion Gold Surface Finish for High-Reliability Assembly

The immersion gold (ENIG) finish provides a flat, oxidation-resistant surface with excellent solderability, fine-pitch compatibility, and long shelf life. It supports reliable assembly of small SMT devices and ensures stable contact resistance for RF signal paths. The absence of solder masks preserves surface flatness and electrical purity, which is critical for microwave and mmWave performance.

5. Typical Applications

• 5G and millimeter-wave communication systems
• Satellite communication terminals and phased-array antennas
• Military and aerospace avionics
• Microwave feed networks and phase-sensitive circuits
• High-performance passive components: couplers, filters, baluns
• Compact, low-profile RF modules and high-frequency sensors

Part 2: In-Depth CCL Knowledge–Rogers CLTE-MW Laminate

Introduction to CLTE-MW Copper Clad Laminate

CLTE-MW is a ceramic-filled, spread-glass reinforced PTFE composite Rogers laminate developed by Rogers Corporation for high-frequency, thin-profile, and cost-sensitive millimeter-wave designs. It addresses the critical challenges of signal integrity, thermal stability, and dimensional control in ultra-thin 5G, aerospace, and satcom circuits. Unlike standard PTFE materials, CLTE-MW substrate uses spread glass and high filler loading to minimize glass-weave effects, stabilize Dk over frequency and temperature, and improve mechanical robustness.

Full Standard Properties Table (From Official Datasheet)

*Below is the complete list of electrical, thermal, mechanical, and physical properties as measured by IPC-TM-650 and ASTM standards. These values represent typical performance at 23°C and 50% RH unless otherwise noted.*

CLTE-MW Dielectric Constant vs Thickness

*The design Dk varies slightly with core thickness due to glass/filler ratios. For this 2.9mil (0.076mm) PCB, the correct Process Dk is 2.94, and Design Dk is 3.10.*

Standard Offerings

Key Advantages of CLTE-MW CCL

1)Ultra-Low Loss at mmWave Frequencies

Df = 0.0015 @ 10 GHz enables low insertion loss in 5G, satcom, and radar circuits.

2)Stable Dielectric Performance

Tight Dk tolerance and low thermal coefficient ensure consistent impedance across temperature and frequency.

3)Minimized Glass-Weave Effects

Spread glass and high ceramic filler reduce signal skew and phase distortion.

4)Excellent PTH Reliability

Z-axis CTE of 30 ppm/°C matches copper, improving reliability under thermal cycling.

5)Good Thermal Management

Thermal conductivity of 0.42 W/(m·K) supports heat dissipation in compact designs.

6)High Dimensional Stability

Low shrinkage and stable registration support fine lines and high-density routing.

7)Harsh Environment Compatibility

Low moisture absorption, V-0 flammability, and low outgassing for aerospace and space applications.

Why CLTE-MW Stands Out

CLTE-MW PCB material fills a unique gap between high-cost PTFE materials and standard FR-4. It delivers performance close to premium microwave laminates at a more competitive cost, with seven thickness options from 3 to 10 mil to support thin-profile mmWave designs. It is fully compatible with standard PCB manufacturing processes, making it suitable for both prototyping and high-volume production.

Conclusion

This 2-layer CLTE-MW 2.9mil immersion gold PCB integrates Rogers’ industry-leadinghigh-frequency laminate technology with precision manufacturing, delivering unmatched electrical performance, thermal stability, and mechanical reliability for next-generation 5G, satellite, aerospace, and defense systems. The ultra-thin structure, low loss, stable Dk, and immersion gold finish make it a superior choice for engineers seeking consistent, high-yield, and long-lifespan high-frequency circuit solutions.