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AD250C PCBs are becoming increasingly popular in industries that require high-frequency performance, low signal loss, and superior thermal stability. This article aims to provide a comprehensive overview of the electrical and thermal properties of this cutting-edge PCB material.
Item NO.:
BIC-N10-v216.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
2-layers Rogers Arlon 60mil AD250C Material PCB High Frequency Board
This 60mil AD250C woven glass reinforced PTFE material used in the PCB is a high-performance dielectric material known for its excellent thermal stability, low loss tangent, and high breakdown voltage. This makes it ideal for use in applications that require high-frequency performance and low signal loss.
The lead-free process used in the manufacture of the Arlon AD250C PCB ensures that it is environmentally friendly and complies with RoHS (Restriction of Hazardous Substances) regulations.
The 60mil AD250C PCB has a 2-layer stackup design with copper layers on both sides of the AD250C 60mil dielectric(1.524mm). The finished copper weight is 70um, and the finished board thickness is 1.6mm.
Construction details:
Construction Details |
Specifications |
Board Dimensions |
171mm x 76mm |
Board Dimensions Tolerance |
+/- 0.15mm |
Minimum Trace/Space |
4/4 mils |
Minimum Hole Size |
0.35mm |
Blind/Buried Vias |
No |
Finished Board Thickness |
1.6mm |
Finished Cu Weight |
2 oz (2.8 mils) all layers |
Via Plating Thickness |
1 mil |
Surface Finish |
Immersion Gold |
Top Silkscreen |
No |
Bottom Silkscreen |
No |
Top Solder Mask |
Green |
Bottom Solder Mask |
No |
Silkscreen on Solder Pads |
No |
Electrical Test |
100% |
PCB Statistics:
PCB Statistics |
Quantity |
Components |
167 |
Total Pads |
211 |
Thru Hole Pads |
122 |
Top SMT Pads |
89 |
Bottom SMT Pads |
0 |
Vias |
97 |
Nets |
6 |
Applications of AD250C PCBs
Rogers AD250C PCBs are suitable for a wide range of applications, including industrial control systems, medical devices, and consumer electronics. They are also environmentally friendly and compliant with RoHS regulations.
Conclusion:
AD250C woven glass reinforced PTFE PCBs offer a range of advantages over other PCB materials, including superior electrical and thermal properties, low signal loss, and high breakdown voltage.
They are also environmentally friendly and compliant with RoHS regulations. With their small form factor, excellent electrical conductivity, and clean and professional look, they are ideal for a wide range of applications in industries such as industrial control systems, medical devices, and consumer electronics. We provide our artwork in Gerber RS-274-X format and adhere to the IPC-Class-2 standard.
AD250C PCB Data sheet:
Electrical Properties |
AD250C |
Units |
Test Conditions |
Test Method |
|
|
PIM (30mil/60mil) |
-159/-163 |
dBc |
Reflected 43 dBm swept tones at 1900 MHz, S1/S1 |
Rogers Internal 50 ohm |
|
|
Dielectric Constant (process) |
2.52 |
- |
23°C @ 50% RH |
10 GHz |
IPC TM-650 2.5.5.5 |
|
Dielectric Constant (design) |
2.50 |
- |
C-24/23/50 |
10 GHz |
Microstrip Differential Phase Length |
|
Dissipation Factor (process) |
0.0013 |
- |
23°C @ 50% RH |
10 GHz |
IPC TM-650 2.5.5.5 |
|
Thermal Coefficient of Dielectric Constant |
-117 |
ppm/ºC |
0°C to 100°C |
10 GHz |
IPC TM-650 2.5.5.5 |
|
Volume Resistivity |
4.8 x 108 |
Mohm-cm |
C-96/35/90 |
- |
IPC TM-650 2.5.17.1 |
|
Surface Resistivity |
4.1 x 107 |
Mohm |
C-96/35/90 |
- |
IPC TM-650 2.5.17.1 |
|
Electrical Strength (dielectric strength) |
979 |
V/mil |
- |
- |
IPC TM-650 2.5.6.2 |
|
Dielectric Breakdown |
>40 |
kV |
D-48/50 |
X/Y direction |
IPC TM-650 2.5.6 |
|
Thermal Properties |
|
|||||
Decomposition Temperature (Td) |
>500 |
˚C |
2hrs @ 105˚C |
5% Weight Loss |
IPC TM-650 2.3.40 |
|
Coefficient of Thermal Expansion - x |
47 |
ppm/˚C |
- |
-55˚C to 288˚C |
IPC TM-650 2.4.41 |
|
Coefficient of Thermal Expansion - y |
29 |
ppm/˚C |
- |
-55˚C to 288˚C |
IPC TM-650 2.4.41 |
|
Coefficient of Thermal Expansion - z |
196 |
ppm/˚C |
- |
-55˚C to 288˚C |
IPC TM-650 2.4.41 |
|
Thermal Conductivity |
0.33 |
W/mK |
- |
z direction |
ASTM D5470 |
|
Time to Delamination |
>60 |
minutes |
as-received |
288˚C |
IPC TM-650 2.4.24.1 |
|
Mechanical Properties |
|
|||||
Copper Peel Strength after Thermal Stress |
2.6 |
N/mm (lbs/in) |
10s @288˚C |
35 μm foil |
IPC TM-650 2.4.8 |
|
Flexural Strength (MD/CMD) |
8.8/6.4 (60.7/44.1) |
MPa (ksi ) |
25°C ± 3°C |
- |
ASTM D790 |
|
Tensile Strength (MD/CMD) |
6.0/5.6 (41.4/38.6) |
MPa (ksi ) |
23°C/50% RH |
- |
ASTM D3039/D3039-14 |
|
Flex Modulus (MD/CMD) |
885/778 (6,102/5,364) |
MPa (ksi ) |
25°C ± 3°C |
- |
IPC-TM-650 Test Method 2.4.4 |
|
Dimensional Stability (MD/CMD) |
0.02/0.06 |
mils/inch |
after etch + bake |
- |
IPC-TM-650 2.4.39a |
|
Physical Properties |
|
|||||
Flammability |
V-0 |
- |
- |
- |
UL-94 |
|
Moisture Absorption |
0.04 |
% |
E1/105 +D48/50 |
- |
IPC TM-650 2.6.2.1 |
|
Density |
2.28 |
g/cm3 |
C-24/23/50 |
- |
ASTM D792 |
|
Specific Heat Capacity |
0.813 |
J/g°K |
2 hours at 105°C |
- |
ASTM E2716 |
|
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