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Home Multilayer PCB Board 10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F

10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F

It’s for the application of broadband wireless solutions. It's 2.0 mm thick, pads are immersion gold plated.


  • Item NO.:

    BIC-071-v149.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions

(PCB's are custom-made products, the picture and parameters shown are just for reference)


Hello everyone,

Good day!

In the previous products, we’ve talked 4-layer RF PCB and 6-layer RF PCB. We have known that Rogers multilayer PCBs are made of every different core. So 10-layer RF PCB becomes simple now, is it right?


10-layer RF PCB is made on 5 cores of Rogers material. Since the final thickness will not be much thicker, so the thin core is usually used, such as 6.6mil RO4350B, 10mil RO4350B, 13.3mil RO4350B, 8mil RO4003C and12mil RO4003C etc.


Today this 10-layer PCB is on 5 cores of 10mil RO4350B combined by RO4450F prepreg.

It’s for the application of broadband wireless solutions. It's 2.0 mm thick, pads are immersion gold plated. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards are packed for shipment.


Features and benefits:


1) Excellent dimensional stability.

2) Good high temperature and low temperature resistance.(-192℃-260℃)

3) Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.

4) Engineering design prevents problems from occurring in preproduction.

5) DDU Door to door shipment with competitive shipping cost,

6) No MOQ, low cost for prototypes and samples.


Applications:


RO4350B Application


Parameter and data sheet:


PCB SIZE 115 x 110mm=1PCS=1design
BOARD TYPE High Frequency PCB, Multilayer PCB
Number of Layers 10 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP TOP Layer: signal - 1/2oz foil + 25μm Cu
Core RO4350B -0.254mm
INT 1: mixed - 1/2oz foil
Prepreg RO4450F -0.202mm (2 x 0.101)
INT 2: mixed - 1/2oz foil
Core RO4350B -0.254mm
INT 3: mixed - 1/2oz foil
Prepreg RO4450F -0.202mm (2 x 0.101)
INT 4: mixed - 1/2oz foil
Core RO4350B -0.254mm
INT 5: mixed - 1/2oz foil
Prepreg RO4450F -0.202mm (2 x 0.101)
INT 6: mixed - 1/2oz foil
Core RO4350B -0.254mm
INT 7: mixed - 1/2oz foil
Prepreg RO4450F -0.202mm (2 x 0.101)
INT 8: mixed - 1/2oz foil
Core RO4350B -0.254mm
BOT Layer: signal - 1/2oz foil + 25μm Cu
TECHNOLOGY
Minimum Trace and Space: 5.5mil/5mil
Minimum / Maximum Holes: 0.3/2.0mm
Number of Different Holes: 9
Number of Drill Holes: 7505
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control NO
BOARD MATERIAL
Glass Epoxy:  RO4350B core 0.254mm(10mil), RO4450B PP 0.1mm(4mil)
Final foil external:  1oz
Final foil internal:  0.5oz
Final height of PCB:  2.0mm ±10%
PLATING AND COATING
Surface Finish Electroless nickel over Immersion Gold (ENIG)( 0.05µm  over 3µm nickel)
Solder Mask Apply To:  N/A
Solder Mask Color:  N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA Plated Through Hole(PTH), via tented. BGA package
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.



PCB MANUFACTURING PROCESS:



BICHENG PCB WORKSHOP:



BICHENG PCB CERTIFICATE:



BICHENG MAIN COURIERS:


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IPv6 network supported

IPv6 network supported

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