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RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;
Item NO.:
BIC-070-v137.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaColor:
WhiteShipping Port:
ShenzhenLead Time:
7-10 days
6 Layer High Frequency PCB Built On 3 Cores of 20mil RO4003C and 4mil RO4450F for Radar Altimeter
(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)
Hello everyone.
Warm greetings!
Today we talked about is a type of 6 layers high frequency PCB. It’s built on 3 core of 20mil RO4003C with bondply RO4450F for the application of radar altimeter. The stack-up is as follows.
As is known to all, there’re 6 cores in RO4003C family, i.e. 8mil (0.203mm) to 60mil (1.524mm).
RO4003C: |
|
8mil |
0.203mm |
12mil |
0.305mm |
16mil |
0.406mm |
20mil |
0.508mm |
32mil |
0.813mm |
60mil |
1.524mm |
So it’s very interesting that stack-up of 4 layers can be done in many different ways.
Following is the basic specifications.
Base material: RO4003C 0.508 mm x 3 sheets, RO4450F 0.102mm x 1 sheet
Layer count: 6 layers
Type: 1 PCB up per panel with v-cut
Format: 129mm x 75mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm/ Inner layer 35 μm
Solder mask / Legend: Green / White
Final PCB height: 1.94 mm
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
Features and benefits :
1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;
2) Reducing signal loss in high frequency application meets the development needs of communication technology;
3) UL, ISO14001, IATF16949 certified factory;
4) 16000 square meter workshop;
5) More than 18 years of PCB experience;
Applications:
Satellite antenna, Power splitter, Radio frequency, Power divider
PCB Data Sheet:
PCB SIZE | 129 x 75mm=1PCS |
BOARD TYPE | Multilayer PCB |
Number of Layers | 6 layers |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper --------35µm (1 oz)+plate TOP layer |
RO4003C 0.508mm | |
copper ------- 35µm(1 oz) | |
Prepreg RO4450F 0.101mm | |
Copper ------- 35µm (1 oz) | |
RO4003C 0.508mm | |
Copper ------- 35µm (1 oz) | |
Prepreg RO4450F 0.101mm | |
Copper ------- 35µm (1 oz) | |
RO4003C 0.508mm | |
copper --------35µm (1 oz)+plate BOT layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 6mil / 6 mil |
Minimum / Maximum Holes: | 0.4 mm / 3.5 mm |
Number of Different Holes: | 15 |
Number of Drill Holes: | 324 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control: | no |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | RO4003C, RO4450F, Tg280℃, er<3.48, Rogers Corp. |
Final foil external: | 1 oz |
Final foil internal: | 1 oz |
Final height of PCB: | 1.94 mm ±10% |
PLATING AND COATING | |
Surface Finish | Immersion gold 0.05 micron over nickle 4.4 micron |
Solder Mask Apply To: | N/A |
Solder Mask Color: | N/A |
Solder Mask Type: | N/A |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | N/A |
Colour of Component Legend | N/A |
Manufacturer Name or Logo: | N/A |
VIA | Plated through hole(PTH), minimum size 0.4mm. No blind via or buried vias |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" |
Board plating: | 0.0029" |
Drill tolerance: | 0.002" |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
BICHNEG PCB WORKSHOP:
BICHNEG PCB CERTIFICATION:
BICHENG PCB MAIN COURIERS:
Previous:
PCB Spacer FR-4 Spacer Block Space Bar On 1.5mm FR4 with Drill HolesNext:
10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450FIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
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