Hybrid RF and
High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion
Tin
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Hi Everyone,
Today, we’re going to talk about 2 types of 4-layer high frequency PCB made on 16mil core of RO4003C.
The board is designed as a 4-layer structure,
because 4-layer PCB is relatively simple and inexpensive, which is helpful to
open up a new market.
Let’s see the stack-up first.
Viewing from stack up, we can see the 1st layer
to the 2nd layer and 4th layer to 3rd layer are 12mil core of RO4003C and 16mil
core of RO4003C, the core has fixed thickness which is very important to the
electrical length of RF lines on the circuit board, and the 2 cores are bonded
by bonding film -Prepreg.
At present, there’re 2 types of PP used in
multi-layer high frequency PCB’s. That is FR-4 dielectric and high frequency
dielectric, such as RO4450F, Cuclad 6250, Taconic’s FastRise-28 (FR-28) etc.
Copper weight on inner layer is half ounces, outer
layers 1 ounce. Blind vias are drilled on both cores.
The 2ndboard is a mixed PCB, FR-4
is used on layer 3 and layer 4, high frequency signal transmit on high
frequency substrate: L1 and L2. According to the actual applications, the
thickness of dielectric material and FR-4 can be adjusted.
The application of 16mil RO4003C hybrid PCB is
wide, such as modular oscilloscope, antenna combiner, balanced amplifier, 4G
antenna etc.
The advantages of 16mil RO4003C hybrid PCB are shown
as follows:
1) RO4003C exhibits a stable dielectric
constant over a broad frequency range. This makes it an ideal substrate for
broadband applications.
2) Reducing signal loss in high frequency
application meets the development needs of communication technology.
3) Cost reduced over stack-ups with all low
loss material;
Standard thickness of RO4003C are 0.008”
(0.203mm), 0.012” (0.305mm), 0.016” (0.406mm), 0.020” (0.508mm), 0.032” (0.813mm)
and 0.060” (1.524mm). These thickness
are available in house. Welcome your patronage.
Data Sheet of Rogers 4003C (RO4003C)
|
RO4003C
Typical Value
|
|
Property
|
RO4003C
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
3.38±0.05
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5 Clamped Stripline
|
|
Dielectric Constant,εDesign
|
3.55
|
Z
|
|
8 to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation Factortan,δ
|
0.0027
0.0021
|
Z
|
|
10
GHz/23℃
2.5 GHz/23℃
|
IPC-TM-650
2.5.5.5
|
|
Thermal Coefficient of ε
|
+40
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650
2.5.5.5
|
|
Volume Resistivity
|
1.7 x 1010
|
|
MΩ.cm
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Surface Resistivity
|
4.2 x 109
|
|
MΩ
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Electrical Strength
|
31.2(780)
|
Z
|
Kv/mm(v/mil)
|
0.51mm(0.020")
|
IPC-TM-650
2.5.6.2
|
|
Tensile Modulus
|
19,650(2,850)
19,450(2,821)
|
X
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Tensile Strength
|
139(20.2)
100(14.5)
|
X
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Flexural Strength
|
276
(40)
|
|
MPa
(kpsi)
|
|
IPC-TM-650
2.4.4
|
|
Dimensional Stability
|
<0.3
|
X,Y
|
mm/m
(mil/inch)
|
after etch+E2/150℃
|
IPC-TM-650
2.4.39A
|
|
Coefficient of Thermal Expansion
|
11
14
46
|
X
Y
Z
|
ppm/℃
|
-55℃to288℃
|
IPC-TM-650
2.4.41
|
|
Tg
|
>280
|
|
℃TMA
|
A
|
IPC-TM-650
2.4.24.3
|
|
Td
|
425
|
|
℃TGA
|
|
ASTM
D 3850
|
|
Thermal Conductivity
|
0.71
|
|
W/M/oK
|
80℃
|
ASTM
C518
|
|
Moisture Absorption
|
0.06
|
|
%
|
48hrs
immersion 0.060"
sample Temperature 50℃
|
ASTM
D 570
|
|
Density
|
1.79
|
|
gm/cm3
|
23℃
|
ASTM
D 792
|
|
Copper Peel Stength
|
1.05
(6.0)
|
|
N/mm
(pli)
|
after
solder float 1 oz.
EDC Foil
|
IPC-TM-650
2.4.8
|
|
Flammability
|
N/A
|
|
|
|
UL
94
|
|
Lead-free Process Compatible
|
Yes
|
|
|
|
|
PCB MANUFACTURING PROCESS:
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BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
