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Home Multilayer PCB Board Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin

Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin


The board is designed as a 4-layer structure, because 4-layer PCB is relatively simple and inexpensive


  • Item NO.:

    BIC-161-v150.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Hi Everyone,

Today, we’re going to talk about 2 types of 4-layer high frequency PCB made on 16mil core of RO4003C.


The board is designed as a 4-layer structure, because 4-layer PCB is relatively simple and inexpensive, which is helpful to open up a new market.


Let’s see the stack-up first.

stackup 12mil_RO4003C_16mil_RO4003C


Viewing from stack up, we can see the 1st layer to the 2nd layer and 4th layer to 3rd layer are 12mil core of RO4003C and 16mil core of RO4003C, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the 2 cores are bonded by bonding film -Prepreg.


At present, there’re 2 types of PP used in multi-layer high frequency PCB’s. That is FR-4 dielectric and high frequency dielectric, such as RO4450F, Cuclad 6250, Taconic’s FastRise-28 (FR-28) etc.


Copper weight on inner layer is half ounces, outer layers 1 ounce. Blind vias are drilled on both cores.


microsection RO4003C 4450F


The 2ndboard is a mixed PCB, FR-4 is used on layer 3 and layer 4, high frequency signal transmit on high frequency substrate: L1 and L2. According to the actual applications, the thickness of dielectric material and FR-4 can be adjusted.


stackup 16mil_RO4003C_FR-4


The application of 16mil RO4003C hybrid PCB is wide, such as modular oscilloscope, antenna combiner, balanced amplifier, 4G antenna etc.


The advantages of 16mil RO4003C hybrid PCB are shown as follows:


1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.

2) Reducing signal loss in high frequency application meets the development needs of communication technology.

3) Cost reduced over stack-ups with all low loss material;


microsection RO4003C+FR4


Standard thickness of RO4003C are 0.008” (0.203mm), 0.012” (0.305mm), 0.016” (0.406mm), 0.020” (0.508mm), 0.032” (0.813mm) and 0.060” (1.524mm). These thickness are available in house. Welcome your patronage.


Data Sheet of Rogers 4003C (RO4003C)


RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z 10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010 MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109 COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280 ℃TMA A IPC-TM-650 2.4.24.3
Td 425 ℃TGA ASTM D 3850
Thermal Conductivity 0.71 W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06 % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A UL 94
Lead-free Process Compatible Yes


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