14-layer Megtron-6 Panasonic high-speedLow-loss Substrate 1.64mm Thick PCB ENEPIG
1. Introduction
This 14-layer HDI printed circuit board (PCB) is engineered on Panasonic Megtron-6 ultra-low loss substrate platform, featuring an Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) surface finish, precision impedance control, and full compliance with IPC-3 industry standards. Designed for high-speed networking, 5G/6G wireless infrastructure, and industrial electronics applications, the board balances uncompromising signal integrity, thermal stability, and manufacturing reliability, with a symmetric 14-layer stackup optimized for controlled impedance and minimal high-frequency signal loss.
With a nominal finished thickness of 1.64mm, 2x2 panelization with process borders, and 100% electrical testing prior to shipment, this 14-layer Megtron-6 PCB delivers consistent, repeatable performance for both prototype validation and high-volume commercial deployments.
2.PCB Core Construction & Manufacturing Specifications
This section outlines the core mechanical, material, and manufacturing specifications that define the PCB’s physical dimensions, layer configuration, and adherence to global electronics industry standards, forming the structural foundation of the product.
|
Specification
|
Value
|
|
Base material
|
Megtron-6 (Panasonic high-speed low-loss substrate)
|
|
Layer count
|
14 layers
|
|
Board dimensions
|
178.8×169mm (4PCS per panel), 2X2 panelization, 5mm width process border on all four sides
|
|
Finished board thickness
|
1.64mm (nominal; 1.641mm as pressed)
|
|
Finished copper weight
|
1oz (35μm) outer layers, 0.5oz (17μm) inner layers
|
|
Resin filled via
|
Compliant with IPC-4761 TYPE VII standard
|
|
Manufacturing standard
|
IPC-3 Standard
|
|
Surface finish
|
ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)
|
|
Silkscreen
|
White legend on both top and bottom sides
|
|
Solder mask
|
Green solder mask on both top and bottom sides
|
|
Quality assurance
|
100% electrical continuity and isolation test used prior to shipment
|
3.PCB Layer Stackup Design
The 14-layer stackup is symmetrically structured to ensure mechanical stability, consistent impedance control, and optimal signal integrity, with precisely selected core and prepreg materials that deliver the target finished board thickness while maintaining uniform dielectric properties across all layers.
4.Critical Performance Features
4.1 Precision Impedance Control
Precision impedance control is a non-negotiable design requirement for high-speed signal integrity, with strictly defined line width and spacing parameters for both microstrip and stripline configurations to meet target impedance values, validated against the Megtron-6 substrate’s dielectric properties.
|
Impedance Type
|
Target Impedance
|
Trace Width (mm)
|
Trace Spacing (mm)
|
|
Microstrip
|
50Ω
|
0.2
|
-
|
|
Microstrip
|
100Ω
|
0.1
|
0.101
|
|
Stripline
|
50Ω
|
0.1
|
-
|
|
Stripline
|
100Ω
|
0.2
|
0.102
|
4.2 Resin-Filled Vias (IPC-4761 TYPE VII)
-
Resin-filled vias are manufactured to the IPC-4761 TYPE VII standard, the industry’s most stringent specification for via filling inhigh-density interconnect (HDI) PCBs. This standard requires complete via filling with no voids, cracks, or resin bleed, with a flat surface finish that eliminates solder bridging during assembly and prevents signal interference between layers. The resin-filled vias also enhance the PCB’s mechanical strength and thermal conductivity, improving reliability in harsh operating environments.
4.3 ENEPIG Surface Finish
-
The ENEPIG surface finish is selected for its exceptional oxidation resistance, long-term solderability, and compliance with lead-free assembly processes. Unlike traditional immersion gold finishes, ENEPIG features a palladium layer between the nickel and gold layers, which provides superior protection against oxidation and corrosion, even after multiple reflow cycles. This makes the finish ideal for high-reliability applications, including automotive electronics, industrial control systems, and outdoor wireless infrastructure, where the PCB may be exposed to extreme temperatures and humidity.
5. PCB Conclusion
In conclusion, this 14-layer Megtron-6 ENEPIG PCB is a high-performance circuit board solution tailored for the most demanding high-speed, high-reliability applications. Its symmetric stackup, precision impedance control, IPC-3 compliance, and robust ENEPIG surface finish ensure consistent signal integrity, mechanical stability, and long-term operational reliability. The combination of 1oz outer copper (for high current-carrying capacity) and 0.5oz inner copper (for fine-line routing capability) balances electrical performance and manufacturing feasibility, while resin-filled vias meet the demands of modern HDI designs. Validated by 100% electrical testing, this 14-layer HDI PCB delivers the consistency and performance required for 5G/6G wireless, data center, and industrial electronic systems.
CCL & Prepreg Material Deep Dive: Megtron-6 R-5775(G) Core & R-5670(G) Prepreg
1. Material Overview
The MEGTRON 6 material family, comprising Laminate R-5775 and Prepreg R-5670, represents Panasonic's advanced high-speed, low-loss printed circuit board material platform. Available in multiple glass cloth variants—Standard E-glass (K/N series) and Low Dk glass (G series)—the product line serves as the industry benchmark for high-frequency and high-speed digital applications requiring low transmission loss, excellent dimensional stability, and superior thermal reliability. These resin systems are engineered with proprietary low-polarity thermosetting polymers that minimize dielectric loss while maintaining the mechanical and thermal properties demanded by high-layer-count PCBs.
2. Material Variants
|
Product Code
|
Glass Cloth Type
|
Application
|
|
R-5775(K) / R-5670(K)
|
Standard E-glass
|
General high-speed digital
|
|
R-5775(N) / R-5670(N)
|
Standard E-glass
|
High-speed with lead-free assembly
|
|
R-5775(G) / R-5670(G)
|
Low Dk glass
|
Ultra-low loss RF & microwave
|
The (G) variant incorporates low dielectric constant glass fibers, resulting in approximately 2-3% lower Dk compared to standard E-glass products, making it particularly advantageous for millimeter-wave applications up to 58GHz and beyond. This design leverages the (G) variant's superior high-frequency performance while benefiting from the mature manufacturing infrastructure established for the MEGTRON family.
|
Part Number
|
R-5775(K)/R-5670(K)
|
R-5775(N)/R-5670(N)
|
R-5775(G)/R-5775(G)
|
|
Tg (DSC)
|
185 °C
|
185 °C
|
185 °C
|
|
Tg (DMA)
|
210 °C
|
210 °C
|
210°C
|
|
Td (Thermal Decomposition) (°C)
|
410 °C
|
410 °C
|
410 °C
|
|
T288 (Without Cu) (min)
|
>120 min
|
>120 min
|
>120 min
|
|
T288 (With Cu) (min)
|
>120 min
|
>120 min
|
>120 min
|
|
CTE-Y
|
14-16 ppm/°C
|
14-16 ppm/°C
|
14-16 ppm/°C
|
|
CTE-Y
|
14-16 ppm/°C
|
14-16 ppm/°C
|
14-16 ppm/°C
|
|
CTE-Z
|
45 ppm/°C
|
45 ppm/°C
|
45 ppm/°C
|
|
CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)
|
260 ppm/°C
|
260 ppm/°C
|
260 ppm/°C
|
|
Thermal Conductivity, (W/m・K)
|
0.42 W/m · K
|
0.42 W/m · cm
|
0.42 W/m · cm
|
|
Volume Resistivity (MΩ・cm)
|
1 x 10⁹ MΩ · cm
|
1 x 10⁹ MΩ · cm
|
1 x 10⁹ MΩ · cm
|
|
Surface Resistivity (mΩ)
|
1 x 10⁸ MΩ
|
1 x 10⁸ MΩ
|
1 x 10⁸ MΩ
|
|
Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50
|
3.4
|
3.4
|
3.4
|
|
Dielectric Constant (Dk) @ 10Ghz; Test Method IPC-TM-650; Condition C-24/23/50
|
——
|
——
|
——
|
|
Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50
|
3.4
|
3.4
|
3.4
|
|
Df at 1 GHz
|
0.002
|
0.002
|
0.002
|
|
Df at 10 GHz
|
——
|
——
|
——
|
|
Df at 12 GHz
|
0.004
|
0.004
|
0.004
|
|
Water Absorption (%)
|
0.14%
|
0.14%
|
0.14%
|
|
Poisson's Ratio
|
0.2
|
0.2
|
0.2
|
|
Flexural Warp (MD) (GPa)
|
19 GPa
|
19 GPa
|
19 GPa
|
|
Flexural Fill (TD) (GPa)
|
18 GPa
|
18 GPa
|
18 GPa
|
|
Peel Strength (1 Oz. Cu) (kN/m)
|
0.8 (Cu:H-VLP) kN/m
|
0.8 (Cu:H-VLP) kN/m
|
0.8 (Cu:H-VLP) kN/m
|
|
Flammability
|
94V-0
|
94V-0
|
94V-0
|
3.MEGTRON 6 (G)–Core Material Dielectric Properties
|
Core Type
|
Actual Thickness
|
Cloth Style
|
ply
|
Typical Resin Content (%)
|
Typical Df
|
|
mil
|
mm
|
1 GHz
|
13 GHz
|
24 GHz
|
36 GHz
|
47 GHz
|
58 GHz
|
|
2
|
2
|
0.05
|
1035
|
1
|
67
|
0.002
|
0.0037
|
0.004
|
0.0043
|
0.0044
|
0.0046
|
|
2.6
|
2.6
|
0.065
|
1078
|
1
|
59
|
0.002
|
0.0037
|
0.004
|
0.0042
|
0.0044
|
0.0046
|
|
3
|
3
|
0.075
|
1078
|
1
|
65
|
0.002
|
0.0037
|
0.004
|
0.0042
|
0.0044
|
0.0046
|
|
3.5
|
3.5
|
0.09
|
1078
|
1
|
70
|
0.002
|
0.0037
|
0.004
|
0.0043
|
0.0044
|
0.0046
|
|
4
|
3.9
|
0.1
|
2013
|
1
|
56
|
0.002
|
0.0037
|
0.004
|
0.0042
|
0.0044
|
0.0046
|
|
4
|
3.9
|
0.1
|
1035
|
2
|
67
|
0.002
|
0.0037
|
0.004
|
0.0043
|
0.0044
|
0.0046
|
|
5
|
5
|
0.127
|
1078
|
2
|
59
|
0.002
|
0.0037
|
0.004
|
0.0042
|
0.0044
|
0.0046
|
|
5
|
4.9
|
0.125
|
2116
|
1
|
56
|
0.002
|
0.0037
|
0.004
|
0.0042
|
0.0044
|
0.0046
|
|
6
|
5.7
|
0.146
|
1078
|
2
|
65
|
0.002
|
0.0037
|
0.004
|
0.0042
|
0.0044
|
0.0046
|
|
7
|
7
|
0.178
|
1078
|
2
|
70
|
0.002
|
0.0037
|
0.004
|
0.0043
|
0.0044
|
0.0046
|
|
8
|
7.9
|
0.2
|
2013
|
2
|
56
|
0.002
|
0.0037
|
0.004
|
0.0042
|
0.0044
|
0.0046
|
|
10
|
9.8
|
0.25
|
2116
|
2
|
56
|
0.002
|
0.0037
|
0.004
|
0.0042
|
0.0044
|
0.0046
|
|
12
|
11.8
|
0.3
|
2013
|
3
|
56
|
0.002
|
0.0037
|
0.004
|
0.0042
|
0.0044
|
0.0046
|
|
16
|
15.7
|
0.4
|
2013
|
4
|
56
|
0.002
|
0.0037
|
0.004
|
0.0042
|
0.0044
|
0.0046
|
|
20
|
19.7
|
0.5
|
2116
|
4
|
56
|
0.002
|
0.0037
|
0.004
|
0.0042
|
0.0044
|
0.0046
|
|
25
|
24.6
|
0.625
|
2116
|
5
|
56
|
0.002
|
0.0037
|
0.004
|
0.0042
|
0.0044
|
0.0046
|
|
30
|
29.5
|
0.75
|
2116
|
6
|
56
|
0.002
|
0.0037
|
0.004
|
0.0042
|
0.0044
|
0.0046
|
4. MEGTRON 6 (G)–Prepreg R-5670 Properties
|
Cloth Style
|
Resin Content (%)
|
Typical Thickness
|
Typical Dk
|
|
(um)
|
1 GHz
|
13 GHz
|
24 GHz
|
36 GHz
|
47 GHz
|
58 GHz
|
|
1035
|
72
|
60
|
3.2
|
3.13
|
3.13
|
3.13
|
3.13
|
3.13
|
|
75
|
68
|
3.16
|
3.1
|
3.1
|
3.1
|
3.1
|
3.1
|
|
77
|
74
|
3.13
|
3.08
|
3.08
|
3.08
|
3.08
|
3.08
|
|
1078
|
66
|
77
|
3.26
|
3.2
|
3.2
|
3.2
|
3.2
|
3.2
|
|
70
|
89
|
3.22
|
3.16
|
3.16
|
3.16
|
3.16
|
3.16
|
|
74
|
104
|
3.17
|
3.11
|
3.11
|
3.11
|
3.11
|
3.11
|
|
77
|
118
|
3.13
|
3.08
|
3.08
|
3.08
|
3.08
|
3.08
|
|
2013
|
56
|
98
|
3.4
|
3.34
|
3.34
|
3.34
|
3.34
|
3.34
|
|
59
|
106
|
3.37
|
3.29
|
3.29
|
3.29
|
3.29
|
3.29
|
|
2116
|
56
|
125
|
3.4
|
3.34
|
3.34
|
3.34
|
3.34
|
3.34
|
|
58
|
132
|
3.37
|
3.31
|
3.31
|
3.31
|
3.31
|
3.31
|
5. Material Storage and Handling Requirements
-
The MEGTRON 6 materials require specific storage conditions to maintain their performance characteristics. Laminate should be stored flat in a cool, dry environment, preferably in the original container to prevent surface scratching and contamination. Prepreg storage is more critical, requiring controlled conditions of 23°C or less and 50% RH or less. Extended storage (>3 months) should be at 5°C in sealed packaging. Prepreg exposed to ambient conditions must be carefully tracked, with cumulative exposure not exceeding 8 hours under the recommended conditions, or as agreed between the user and supplier.
6.Processing Guidelines
6.1 Drilling Parameters:
-
The drilling recommendations for MEGTRON 6 are optimized for hole quality and bit life. For a 0.30mm drill (commonly used in this design for via formation), the recommended parameters are 160 krpm spindle speed, 151 m/min velocity, and 20μm/rev chip load, yielding a bit life of 700-1,000 hits. The use of lubricated entry sheets (LE sheets) and high helix angle drill bits is recommended to reduce smear and improve hole wall quality. Peck drilling is suggested for thin drill bits (<0.3mm) to manage chip evacuation and prevent bit breakage.
6.2 Lamination Parameters:
-
The press cycle should achieve a product temperature above 185°C for a minimum of 75 minutes, with a heat-up rate of 2.0-4.0°C/min and pressure of 3.0-4.0 MPa. The vacuum should be applied for the first 30 minutes of the cycle (typically during 90-130°C temperature range) to ensure void-free lamination.
6.3 Desmear Process:
-
The permanganate desmear process is recommended at twice the standard FR-4 conditions due to the material's lower weight loss. Typical parameters include alkaline swelling at 65-85°C for 5-10 minutes followed by permanganate etching at 70-85°C for 10-15 minutes. For plasma desmear, half the FR-4 time is recommended, and for hybrid constructions with FR-4, a combined plasma/permanganate approach is suggested.
6.4 Plating Compatibility:
-
R-5775 supports Ag plating, Sn plating, direct gold plating, and OSP finishes. For Ni plating (as in ENIG/ENEPIG), pre-treatment baking (e.g., 5 hours at 150°C) or extended room temperature holding is recommended to ensure adequate adhesion.
7.Conclusion
This 14-layer Megtron-6 PCB with ENEPIG surface finish represents a high-performance solution for modern high-speed electronic systems, combining precision manufacturing, industry-leading material technology, and strict quality control. The PCB’s optimized layer stackup, tightly controlled impedance parameters, and robust construction ensure exceptional signal integrity and reliability, while the Megtron-6 material system delivers the ultra-low loss and thermal stability required for high-frequency operation. The ENEPIG surface finish provides excellent solderability and corrosion resistance, supporting long-term reliability in both consumer and industrial applications.
Backed by IPC-3 manufacturing standards and 100% electrical testing, this PCB is designed to meet the most demanding requirements of today’s advanced electronic devices, offering a reliable, high-performance foundation for 5G/6G communication, data center, and aerospace systems. When paired with the advanced properties of the Megtron-6 CCL system, this PCB delivers a level of performance and consistency that sets it apart from standard FR-4 PCBs, making it the ideal choice for applications where signal integrity and reliability are non-negotiable.
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