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Home Newly Shipped RF PCB 15mil Rogers TMM6 PCB DK6.0 Double-layer ENEPIG 1oz Bare Copper

15mil Rogers TMM6 PCB DK6.0 Double-layer ENEPIG 1oz Bare Copper

This 15mil TMM6 ENEPIG PCB represents a reliable, high-performance solution for engineers pushing the boundaries of frequency and precision.

  • Item NO.:

    BIC-475-v561.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


15mil Rogers TMM6 PCB DK6.0 Double-layer ENEPIG 1oz Bare Copper

 

In the demanding world of high-frequency and microwave electronics, the substrate material and construction integrity of a Printed Circuit Board (PCB) are not merely choices but critical determinants of system performance. We present a precision-engineered double-layer DK6.0 PCB crafted from Rogers TMM6, a premier ceramic thermoset composite, designed explicitly for applications where electrical stability, thermal management, and high reliability are non-negotiable. This board exemplifies a perfect synergy between advanced material science and meticulous fabrication, featuring a 15mil (0.381mm) core and an Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) surface finish. Tailored for strip-line and micro-strip designs, it offers a stable dielectric constant (Dk=6.0) and excellent plated through-hole reliability, making it an ideal, robust foundation for sensitive RF and microwave circuitry.

 

PCB Construction Details

This table outlines the core physical attributes and manufacturing tolerances of the board, defining its form and fabrication capabilities.

 

Parameter

Specification

Base Material

Rogers TMM 6

Layer Count

2 Layers

Board Dimensions

60mm x 96mm (1 PCS), Tolerance: ±0.15mm

Min. Trace / Space

5 mil / 7 mil

Min. Finished Hole Size

0.4 mm

Blind/Buried Vias

No

Finished Board Thickness

0.5 mm

Finished Cu Weight (Outer)

1 oz (35 μm / 1.4 mils)

Via Plating Thickness

20 μm (min)

Surface Finish

ENEPIG

Top/Bottom Silkscreen

No

Top/Bottom Solder Mask

No

Electrical Test

100% Tested

 

 

PCB Stackup

The stackup defines the material composition and thickness of each layer, which is essential for impedance calculation and signal integrity analysis.

 

Layer

Material

Thickness

Layer 1 (Top)

Copper

35 μm (1 oz)

Core

Rogers TMM 6

0.381 mm (15 mil)

Layer 2 (Bottom)

Copper

35 μm (1 oz)

 

 

PCB Statistics

This data quantifies the board's component placement and interconnect density, reflecting its assembly and routing complexity.

 

Item

Quantity

Components

20

Total Pads

26

Thru-Hole Pads

9

Top-Side SMT Pads

17

Bottom-Side SMT Pads

0

Vias

16

Nets

2

 

 

Advanced Material: Rogers TMM6

The heart of this PCB is Rogers TMM6, a ceramic thermoset polymer composite. It bridges the gap between the performance of traditional PTFE materials and the processability of standard epoxy systems. With a tightly controlled dielectric constant (Dk) of 6.00±0.08 at 10 GHz and a low dissipation factor (Df) of 0.0023, it ensures minimal signal loss and consistent phase stability. Its coefficient of thermal expansion (CTE) is matched to copper, dramatically enhancing plated through-hole reliability by minimizing stress during thermal cycling. Furthermore, its high decomposition temperature (Td > 400°C) and resistance to process chemicals make it exceptionally robust during fabrication and assembly, including wire bonding processes enabled by its thermoset resin base.


TMM6 PCB Double-layer ENEPIG

 

Key Features & Benefits for Your Application

 

1) Stable Electrical Performance: The low thermal coefficient of Dk (-11 ppm/°K) ensures consistent electrical properties across a wide temperature range, crucial for outdoor and automotive applications.

 

2) Enhanced Reliability: Copper-matched CTE (X/Y: 18 ppm/K, Z: 26 ppm/K) and robust thermoset chemistry prevent via cracking and delamination, meeting IPC-Class-2 standards as a minimum.

 

3) Superior Processability: Unlike some high-frequency materials, TMM6 is compatible with all standard PCB fabrication processes (drilling, plating, etching), reducing manufacturing complexity and cost.

 

4) Premium Surface Finish–ENEPIG: This finish provides a flat, wire-bondable surface with excellent shelf life. The nickel provides a diffusion barrier, the palladium prevents nickel corrosion ("black pad" syndrome), and the gold ensures superior solderability and contact resistance.

 

5) Global Availability & Support: Supported by a worldwide supply chain and fabrication network, this board is available for prototyping and volume production.

 

 

Typical Applications

This Rogers TMM6 PCB is ideally suited for:

 


  • RF & Microwave Circuits, Power Amplifiers, and Combiners
  • Filters, Couplers, and Phase Shifters
  • Satellite Communication Subsystems and GPS Antennas
  • Patch Antenna Arrays
  • Dielectric Polarizers, Lenses, and Chip Test Fixtures


 

 

Ordering & Documentation

The design is supplied in the universally accepted Gerber RS-274-X format, ensuring accurate and seamless translation from design to production. Every board undergoes 100% electrical testing to verify continuity and isolation, guaranteeing functionality as designed.

 

This 15mil TMM6 ENEPIG PCB represents a reliable, high-performance solution for engineers pushing the boundaries of frequency and precision. We are confident it will provide the stable foundation required for your most demanding applications.






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