Rogers 15mil TMM10 PCB 2-layer EPIG Finish Green Solder Mask White Silkscreen

Rogers 15mil TMM10 PCB 2-layer EPIG Finish Green Solder Mask White Silkscreen

In the realm of high-frequency electronics, where signal integrity, thermal stability, and reliability are non-negotiable,the 15mil TMM10 Double-Sided PCB stands as a pinnacle of engineering excellence. Designed specifically for demanding Radio Frequency (RF), microwave, and aerospace communication systems, this board leverages the exceptional properties of Rogers TMM10 thermoset material to deliver consistent performance where conventional materials falter. With itsElectroless Palladium Immersion Gold (EPIG) finish and precision fabrication, this PCB is the ideal solution for applications ranging from satellite communications and GPS antennas to advanced chip testing and dielectric polarizers.

PCB Construction Details

The following table encapsulates the critical physical and manufacturing specifications of the TMM10 PCB, highlighting its precision engineering.

PCB Stackup

This simplified stackup demonstrates the symmetric and robust construction using a solid TMM10 core, ensuring stable electrical performance.

PCB Statistics

This breakdown of board components and connectivity illustrates a compact, efficiently routed design typical of many RF modules and antenna boards.

TMM10 Material

Rogers TMM10 is not just another substrate; it is a carefully engineeredthermoset microwave material that bridges the performance gap between PTFE and ceramic-filled composites. It provides the excellent electrical properties of high-end materials while overcoming their mechanical limitations, such as creep and cold flow. This makes it exceptionally robust during fabrication and in the field.

Key Material Features & Benefits

1) Stable Dielectric Constant (Dk): 9.20±0.230 @ 10GHz. This high, stable Dk is ideal for miniaturizing circuit designs, particularly for patch antennas and resonant structures.

2) Low Dissipation Factor (Df): 0.0022 @ 10GHz. Ensures low signal loss, which is critical for maintaining efficiency in power-sensitive transmit/receive applications.

3) Excellent Thermal & Mechanical Properties:

• Thermal Coefficient of Dk: -38 ppm/°K, ensuring predictable performance across temperature ranges.
• Coefficient of Thermal Expansion (CTE) matched to copper, minimizing stress on plated through-holes and improving long-term reliability.
• High Decomposition Temperature (Td): 425°C, offering a wide processing window and excellent soldering resistance.
• Thermal Conductivity: 0.76 W/m/K, aiding in heat dissipation from active components.
• Fabrication Advantages: The thermoset resin system is resistant to process chemicals and does not require a sodium etch (napthanate treatment) prior to plating, simplifying manufacturing and enhancing yield. Its robust surface also supports reliable wire-bonding.

Quality Commitment & Global Support

This TMM10 EPIG Finish PCB is manufactured in full compliance with IPC-A-600 Class 2 standards, ensuring acceptance for a wide range of commercial and industrial applications where high reliability is required. The design is processed from industry-standard Gerber RS-274-X format data, guaranteeing translation accuracy from design to finished product. Backed by our global supply chain, this high-performance PCB is readily available worldwide, providing engineers and procurement teams with a dependable source for their critical component needs.

Choose this 15mil TMM10 PCB for your next project where frequency stability, material durability, and proven performance are paramount. It is more than a circuit board; it is a foundation for innovation in the connected world.