6-layer RO4003C Laminate + RO4450F PP PCB 1.174mm Finished Thick ENIG Back Drill Vias

6-layer RO4003C Laminate + RO4450F PPPCB 1.174mm Finished Thick ENIG Back Drill Vias

This is a high-frequency 6-layer PCB built on Rogers RO4003C and RO4450F PP materials, engineered for RF, microwave, and high-speed signal applications that demand stable dielectric properties, low insertion loss, and long-term reliability. Unlike standard FR-4 PCBs, this board combines high-performance ceramic-filled hydrocarbon laminates with precision back drilling and full electrical testing, making it ideal for aerospace, automotive radar, 5G communications, and precision sensing equipment. Every layer, material, and process is optimized to preserve signal integrity, control impedance, and ensure stable performance across wide frequency and temperature ranges.

1. PCB Construction Details

This section summarizes the full mechanical and structural configuration of the finished PCB, including layer count, materials, thickness, surface treatment, and quality control.

2. PCB Stack-up

This table defines this 6-layer RO4003C PCB layer sequence, dielectric type, and thickness of each core and prepreg layer for impedance consistency.

3. RO4003CTypical Value

This table compiles key electrical and physical properties from official Rogers datasheets for design reference.

4. RO4003C Material Introduction

RO4003C is a glass-reinforced hydrocarbon-ceramic laminate from Rogers RO4000 series, designed for high-volume, performance-critical RF and microwave applications. It offers excellent high-frequency electrical performance combined with mechanical stability and standard PCB process compatibility. Unlike PTFE-based materials, Rogers 4003C does not require special drilling or via preparation, supporting reliable multilayer fabrication.

5. Key Benefits of RO4003C

• Stable Dk over wide frequency and temperature for consistent impedance and signal behavior.
• Ultra-low dissipation factor minimizes insertion loss and improves power efficiency.
• CTE closely matched to copper ensures reliable plated through-holes and thermal cycling performance.
• Excellent dimensional stability supports fine lines, small vias, and high circuit density.
• Standard FR-4 process compatibility lowers manufacturing cost and improves yield.
• Lead-free assembly compatible for modern environmental and reliability standards.

6. What is Back Drill?

Back drill (controlled-depth drilling) is a precision process that removes the unused, excess copper barrel of through-holes to eliminate via stubs. These stubs cause signal reflection, resonance, and crosstalk at high frequencies. By back-drilling non-functional sections, this 6-layer RO4003C Back Drill PCB greatly improves signal integrity, reduces jitter, and supports cleaner high-speed transmission without expensive HDI or sequential lamination.

7. Typical Applications

This 6-layer RO4003C high-frequency PCB is widely used in:

• Automotive radar (24GHz / 77GHz)
• 5G base station antennas and power amplifiers
• Satellite communications and RF transceivers
• Microwave sensors and measurement equipment
• Aerospace and high-reliability communication systems
• High-speed digital backplanes and signal processing modules

8. Conclusion

This 6-layer high-frequency PCB delivers professional-grade performance by combining Rogers RO4003C low-loss laminates, RO4450F bonding sheets, precision stack-up, back drilling, and 100% electrical testing. It provides stable dielectric properties, low signal loss, excellent thermal reliability, and manufacturing compatibility for mission-critical RF, microwave, and high-speed designs. For customers seeking a robust, high-performance, and cost-effective solution for demanding wireless and sensing applications, this PCB represents a mature, reliable, and field-proven choice.