Rogers TMM13i PCB 2-layer 15mil Microwave-grade Substrate ENIG No Solder Mask

Rogers TMM13i PCB 2-layer 15mil Microwave-grade Substrate ENIG No Solder Mask

This high-performance 2-layer printed circuit board is engineered on Rogers TMM13i microwave-grade substrate, designed to deliver exceptional electrical stability, mechanical reliability, and thermal consistency for mission-critical RF, microwave, and high-frequency communication applications. Combining industry-leading material properties with precision manufacturing compliant to IPC-Class-2 standards, this Rogers PCB balances electrical performance, manufacturability, and long-term durability for both prototyping and volume deployment.

With a compact form factor, fine-trace capability, and immersion gold surface finish, it supports reliable signal integrity in demanding environments including satellite communications, RF filtering, couplers, and high-frequency test systems. Every board undergoes full electrical testing to guarantee performance before global shipment, making it a trusted solution for professional high-frequency electronic systems.

PCB Construction Overview

This section summarizes the core mechanical, electrical, and manufacturing specifications that define the board’s structural integrity and production quality.

PCB Stackup Structure

The stackup is symmetric and optimized for consistent electrical performance and thermal stability in high-frequency operation.

PCB Layout & Circuit Statistics

This data reflects the TMM13i Rogers Immersion Gold PCB board’s component density, interconnect complexity, and signal routing structure.

Material Introduction: Rogers TMM13i

• Rogers TMM13i is an advanced isotropic thermoset ceramic-filled polymer composite specifically developed for high-reliability RF, microwave, and high-frequency applications. Engineered for plated through-hole, stripline, and microstrip circuits, it unites the superior electrical performance of ceramic substrates with the processing ease of softer dielectric materials. Unlike manyhighfrequency laminates, TMM13i PCB maintains consistent isotropic dielectric properties across wide frequency ranges, supporting stable signal propagation in precision communication and test systems. Its thermoset chemistry ensures strong structural stability, excellent via reliability, and compatibility with standard PCB manufacturing flows, reducing production complexity while elevating end-product performance.

Key Electrical & Thermal Features

• Dielectric Constant (Dk): 12.85±0.35, providing stable and predictable high-frequency performance.
• Dissipation Factor (Df): 0.0019 at 10 GHz, enabling low signal loss and improved efficiency in RF circuits.
• Thermal Coefficient of Dk: -70 ppm/°K, maintaining dielectric stability across temperature variations.
• Coefficient of Thermal Expansion (CTE): Matched closely to copper; X: 19 ppm/°C, Y: 19 ppm/°C, Z: 20 ppm/°C (-55 to 288°C), minimizing thermal stress and ensuring reliable plated through-holes.
• Process Compatibility: Lead-free assembly compatible; flammability rating of 94V-0 for enhanced safety.

Performance Benefits

TMM13i high frequency PCB’s unique material formulation delivers multiple advantages in real-world manufacturing and operation:

1)Excellent mechanical properties resist creep and cold flow, preserving board geometry under stress and temperature. 

2)High resistance to processing chemicals reduces material damage during fabrication, improving yield and reliability.

3)No requirement for sodium naphthenate treatment before electroless plating simplifies manufacturing and lowers costs.

4)Thermoset resin base enables reliable and consistent wire-bonding for high-reliability microelectronic assembly.

5)Stable dielectric and thermal properties ensure consistent performance in extreme operating environments.

6)Compatibility with conventional PCB processing reduces development time and specialized manufacturing costs compared to many high-frequency substrates.

Typical Applications

This TMM13i 2-layer PCB is purpose-built for high-performance electronic systems where signal integrity, thermal stability, and mechanical robustness are critical:

• Chip test fixtures and testers
• Dielectric polarizers and microwave lenses
• High-frequency filters and directional couplers
• RF and microwave circuit assemblies
• Satellite communication systems
• Aerospace and defense high-frequency electronics
• Point-to-point radio and broadband communication modules

Conclusion

This TMM13i 15mil PCB represents a premium integration of high-frequency material science and precision PCB manufacturing. From its carefully designed stackup and robust construction to its IPC-Class-2 quality assurance and globally available supply chain, every aspect is optimized to support reliable, high-performance operation in professional RF and microwave systems. Whether used in satellite communications, test instrumentation, or high-frequency signal processing equipment, this Rogers 15mil PCB provides consistent electrical performance, mechanical durability, and manufacturing excellence for the most demanding applications.