Taconic 2-Layer TLX-8 0.762mm 30mil Immersion Gold High Frequency Bare Copper PCB

This 30mil Taconic PCB provides consistent performance, durability, and quality for mission‑critical RF systems, making it an excellent choice for industrial, communication, aerospace, and marine applications requiring superior high‑frequency performance.

Item NO.:
BIC-510-v595.0
Order(MOQ):
1-10
Payment:
T/T
Price Range:1 - 50/$99
Price Range:1 - 50/$2.9
Product Origin:
China
Shipping Port:
Shenzhen
Lead Time:
7-10 days

Product Detail

Taconic 2-Layer TLX-8 0.762mm 30mil Immersion Gold High Frequency Bare Copper PCB

This high‑performance double‑sided rigid printed circuit board is purpose‑engineered for demanding radio‑frequency and microwave applications, combining the proven stability of TLX-8 substrate with tight manufacturing control and reliable electrical performance. Unlike general‑purpose FR‑4 boards, this Taconic High Frequency PCB is optimized for low signal loss, stable dielectric properties, and long‑term durability in challenging operating environments, making it a preferred choice for professional RF systems, communication components, and high‑reliability microwave assemblies. Every production step follows strict industrial standards, from material selection and layer formation to final electrical verification, ensuring consistent quality and performance for mission‑critical end products.

PCB Construction Details

The following table summarizes the key structural and processing specifications of the TLX-8 PCB, defining its physical form, material composition, surface treatment, and quality assurance measures.

Item	Specification
Base Material	TLX8
Layer Count	Doublesided (2 layers)
Board Dimensions	40.5 mm × 70.6 mm (1 piece), tolerance ±0.15 mm
Blind Vias	Not applicable
Finished Board Thickness	30 mil (≈ 0.762 mm)
Finished Copper Weight	1 oz (1.4 mils) on outer layers
Surface Finish	Immersion Gold
Top Silkscreen	None
Bottom Silkscreen	None
Top Solder Mask	None
Bottom Solder Mask	None
Preshipment Quality Control	100% full electrical test

PCB Stackup

The stack-up of this Taconic TLX-8 PCB adopts a simplified and mechanically robust 2‑layer rigid structure, with uniform copper distribution and a thickTLX-8 core for stable high‑frequency transmission.

Layer	Material & Thickness
Copper Layer 1	35 μm
TLX8 Core	30 mil (0.762 mm)
Copper Layer 2	35 μm

TLX-8 Material Introduction

At the heart of this PCB is TLX-8, a professional PTFE fiberglass laminate widely recognized for reliable performance across a wide range of RF and microwave applications. With a dielectric constant (Dk) ranging from 2.45 to 2.65, along with configurable thicknesses and copper cladding options, it delivers exceptional versatility for low‑layer‑count microwave designs. The fiberglass reinforcement provides robust mechanical support, allowing the substrate to withstand extreme environments that would degrade standard circuit materials.

TLX-8 performs reliably under severe mechanical and environmental stress: it resists creep in PCBs bolted to high‑vibration structures such as launch‑vehicle equipment; withstands high temperatures in engine modules; offers low outgassing and radiation resistance suitable for space applications (referenced in NASA low‑outgassing material lists); performs reliably in marine environments for naval antennas; and maintains dimensional stability over wide temperature swings in airborne altimeter systems. As a workhorse material in the RF and microwave industry,TLX-8 balances electrical performance, mechanical strength, and environmental durability in a single substrate.

2-Layer TLX-8 0.8mm PCB

Key Benefits of TLX-8

This TLX-8 Taconic PCB leverages the full advantages ofTLX-8 to deliver superior performance in high‑frequency systems:

Excellent passive intermodulation (PIM) performance, typically below−160 dBc
Outstanding mechanical and thermal properties
Low and stable dielectric constant (Dk)
High dimensional stability under temperature and mechanical stress
Low moisture absorption
Tightly controlled Dk for consistent RF performance
Low dissipation factor (DF) for minimal signal loss
UL 94 V‑0 flammability rating
Ideal for low‑layer‑count microwave circuit designs

These characteristics make the board highly suitable for applications where signal purity, stability, and reliability are non‑negotiable.

TLX-8 Data Sheet

TLX-8 TYPICAL VALUES
Property	Test Method	Unit	Value	Unit	Value
DK @10 GHz	IPC-650 2.5.5.3		2.55		2.55
Df @1.9 GHz	IPC-650 2.5.5.5.1		0.0012		0.0012
Df @10 GHz	IPC-650 2.5.5.5.1		0.0017		0.0017
Dielectric Breakdown	IPC-650 2.5.6	kV	>45	kV	>45
Moisture Absorption	IPC-650 2.6.2.1	%	0.02	%	0.02
Flexural Strength(MD)	ASTM D 709	psi	28,900	N/mm2
Flexural Strength(CD)	ASTM D 709	psi	20,600	N/mm2
Tensile Strength(MD)	ASTM D 902	psi	35,600	N/mm2
Tensile Strength(CD)	ASTM D 902	psi	27,500	N/mm2
Elongation at Break(MD)	ASTM D 902	%	3.94	%	3.94
Elongation at Break(CD)	ASTM D 902	%	3.92	%	3.92
Young's Modulus(MD)	ASTM D 902	kpsi	980	N/mm2
Young's Modulus(CD)	ASTM D 902	kpsi	1,200	N/mm2
Young's Modulus(MD)	ASTM D 3039	kpsi	1,630	N/mm2
Poisson's Ratio	ASTM D 3039		0.135	N/mm
Peel Stength(1 oz.ed)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	15	N/mm
Peel Stength(1 oz.RTF)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	17	N/mm
Peel Stength(½ oz.ed)	IPC-650 2.4.8.3(Elevated Temp.)	Ibs./linear inch	14	N/mm
Peel Stength(½ oz.ed)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	11	N/mm
Peel Stength(1 oz.rolled)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	13	N/mm	2.1
Thermal Conductivity	ASTM F433/ASTM 1530-06	W/M*K	0.19	W/M*K	0.19
Dimensional Stability(MD)	IPC-650 2.4.39 Sec.5.5(After Bake.)	mils/in.	0.06	mm/M
Dimensional Stability(CD)	IPC-650 2.4.39 Sec.5.4(After Bake.)	mils/in.	0.08	mm/M
Dimensional Stability(MD)	IPC-650 2.4.39 Sec.5.5(Thermal Stress.)	mils/in.	0.09	mm/M
Dimensional Stability(CD)	IPC-650 2.4.39 Sec.5.5(Thermal Stress.)	mils/in.	0.1	mm/M
Surface Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)	Mohm	6.605 x 108	Mohm	6.605 x 108
Surface Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)	Mohm	3.550 x 106	Mohm	3.550 x 106
Volume Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)	Mohm/cm	1.110 x 1010	Mohm/cm	1.110 x 1010
Volume Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)	Mohm/cm	1.046 x 1010	Mohm/cm	1.046 x 1010
CTE(X axis)(25-260℃)	IPC-650 2.4.41/ASTM D 3386	ppm/℃	21	ppm/℃	21
CTE(Y axis)(25-260℃)	IPC-650 2.4.41/ASTM D 3386	ppm/℃	23	ppm/℃	23
CTE(Z axis)(25-260℃)	IPC-650 2.4.41/ASTM D 3386	ppm/℃	215	ppm/℃	215
Density(Specific Gravity)	ASTM D 792	g/cm3	2.25	g/cm3	2.25
Td(2% Weight Loss)	IPC-650 2.4.24.6(TGA)	℃	535	℃
Td(5% Weight Loss)	IPC-650 2.4.24.6(TGA)	℃	553	℃
Flammability Rating	UL-94		V-0		V-0

Typical Applications

Thanks to its high-frequency performance and robust material properties, this 30mil TLX-8-based PCB supports a wide variety of RF and microwave components and systems:

Antennas (including aerospace, marine, and mobile communication antennas)
Mixers, power splitters, filters, and combiners
General passive RF and microwave components
Radar systems and mobile communication equipment
Microwave test instruments and transmission devices

Conclusion

This double-sided TLX-8 PCB represents a high‑reliability, high‑performance solution for modern RF and microwave applications. From material selection and structural design to manufacturing precision and final testing, every aspect is engineered to support stable, low‑loss signal transmission in demanding environments. The absence of solder mask and silkscreen supports specialized high‑frequency assembly needs, while immersion gold surface finishing ensures reliable soldering and long‑term contact stability. Backed by 100% electrical testing before shipment, this 30mil Taconic PCB provides consistent performance, durability, and quality for mission‑critical RF systems, making it an excellent choice for industrial, communication, aerospace, and marine applications requiring superior high‑frequency performance.