8-layer RO4003C + RO4450F Bondply 5.05mm Thick Immersion Gold Custom High Frequency PCB

8-layer RO4003C +RO4450F Bondply 5.05mm Thick Immersion Gold Custom High Frequency PCB

Product Overview

This is an 8-layer high-frequency PCB engineered for mission-critical RF, microwave, and millimeter-wave applications. It uses Rogers RO4003C hydrocarbon-ceramic cores and RO4450F bondply for stable dielectric performance, low loss, and excellent multilayer manufacturability.

The multilayer board is finished with ENIG for reliable soldering and long-term stability, and fully electrically tested before shipment. It delivers consistent impedance control, minimal signal attenuation, and robust mechanical reliability in commercial and industrial high-frequency systems.

1. PCB Construction Details

This section summarizes the full mechanical, material, and surface-finish configuration of the finished 8-layer board.

2. PCB Stack-up

This stack-up is designed for impedance consistency, low insertion loss, and reliable multilayer lamination using Rogers4003C cores and RO4450F bondply.

3. RO4003C Datasheet Parameters

These official Rogers specifications define the high-frequency electrical and thermal stability of RO4003C laminate.

4. RO4003C Typical Applications

RO4003C high frequency PCB is a widely adopted high-frequency laminate that balances electrical performance and processability. It is ideal for: 

• 5G/4G base station antennas, filters, couplers, and power dividers
• Automotive radar (24GHz / 77GHz) and ADAS sensors
• Satellite communications, VSAT, and LNB modules
• Point-to-point microwave and millimeter-wave radio
• High-precision test instrumentation and RF sensors
• Low-noise amplifiers (LNA) and high-linearity power amplifiers
• IoT and high-performance RFID antenna boards

Its stable Dk, low loss, and copper-matched CTE make it suitable for both single-layer and multilayer RF designs where signal fidelity and thermal stability are required.

5. Conclusion

This 8-layer RO4003C + RO4450F PCB is a high-reliability solution for demanding RF and microwave systems. The combination of Rogers’industry-proven high-frequency materials, tight impedance control, ENIG surface finish, and 100% electrical testing ensures consistent performance in commercial, industrial, and automotive environments.

Compared to standard FR-4 or PTFE-based boards, this design offers lower insertion loss, better thermal stability, and easier manufacturing without special via treatment. It supports high-density routing, reliable lead-free assembly, and long-term operation under fluctuating temperatures and humidity. For engineers seeking a cost-effective, high-performance multilayer RF platform, this board provides a robust, repeatable, and production-ready foundation.

6.RO4003C Multilayer Circuit Processing Guidelines

These guidelines were developed to provide fabricators basic information on processing double-sided and multi-layered printed wiring boards (PWB’s) using RO4003C laminates. Please refer to RO4400 bondply processing guidelines for additional information on inner-layer preparation and multi-layer bonding.

Storage

• Fully clad RO4003C substrate should be stored at room temperature (between 50-90°F/ 10-32°C). A first-in-first-out inventory system and a method to track material lot numbers through PWB processing and delivery of finished circuits is recommended.

INNER LAYER PREPARATION

Tooling

•  Rogers RO4003C PCB laminates are compatible with many pinned and pinless tooling systems. Choosing whether to use round or slotted pins, external or internal pinning, standard or multiline tooling, and pre vs. post-etch punching would depend on the capabilities and preferences of the circuit facility and final registration requirements. In general, slotted pins, a multiline tooling format, and post-etch punching will meet most needs.

Surface Preparation for Photoresist Processing and Copper Etching

•  Depending upon RO4003C core thickness, copper surfaces can be prepared for photo imaging using chemical or mechanical processes. Thinner cores should be prepared using a chemical process consisting of cleaning, micro-etching, water rinsing, and drying steps. Thicker RO4003C cores are compatible with mechanical scrub systems.

• RO4003C Multilayer PCB materials are compatible with most liquid and dry film photo-resists and, once patterned, can be processed through develop, etch, and strip (DES) systems typically used to process FR-4 materials.

Oxide Treatment

•  RO4003C cores can be processed through any copper oxide or oxide alternative process in preparation for multi-layer bonding. The best treatment choice is typically the one recommended in the guidelines supporting the chosen prepreg or adhesive system.

Multi-Layer Bonding

•  RO4003C laminates are compatible with many thermosetting and thermoplastic adhesive systems. Guidelines for the adhesive system should be consulted for bond cycle parameters.

DRILLING

Drilling Considerations

• Standard entry (aluminum or thin pressed phenolic) and exit (pressed phenolic or fiber board) materials can be used when drilling RO4003C cores or bonded assemblies in one-up or multi-up stacks.
• RO4003C materials are compatible with a broad range of drilling parameters. However, drilling speeds greater than 500 surface feet per minute (SFM) should be avoided. Chip loads greater than 0.002”/rev are recommended for mid-range and large diameter tools while lower chiploads (<0.002”/rev) are recommended for small (<0.0135”) diameter drills. In general, standard geometry drills are preferred over undercut styles as they more effectively evacuate debris from the holes during the drilling process. Hit counts should be based on inspection of plated-through holes (PTH’s) and not the appearance of the tools. Drilling RO4003C laminates will result in an accelerated wear rate of drills. But, hole wall quality is determined by the size distribution of the ceramic powder and not by the cutting edge of the drill bit. A hole wall roughness ranging from 8 to 25 µm is expected and should remain consistent from the initial hit through several thousand hits.
• Offered below are a summary of recommended drill parameters, equations for using surface speed and chip load to calculate spindle speeds and infeed rates, and a ready-reference drill table.

Recommended Ranges

CALCULATING SPINDLE SPEED AND INFEED

• Spindle Speed = (12 x Surface Speed (SFM))/(πx Tool Diam. (in.))
• Feed Rate (IPM) = [Spindle Speed (RPM)] x [Chip Load (in/rev.)]

Example:

• Desired Surface Speed: 400 SFM
• Desired Chip Load: 0.003”(0.08 mm)/rev.
• Tool Diameter: 0.0295”(0.75 mm)
• Spindle Speed = (12 x 400)/(3.14 X 0.0295) = 51800 RPM
• Infeed Rate = 51,800 x 0.003 = 155 IPM

QUICK REFERENCE TABLE

Conditions stated are tapered from 200 SFM and 0.002”chip load up to 400 SFM and 0.003”chip load.

PTH PROCESSING

Surface Preparation

• Thick multi-layer and double-sided RO4003C constructions can be processed through conveyorized debur equipment that uses oscillating nylon brushes to abrade the copper surfaces. Thinner RO4003C layers may require pumice scrubbing by hand, conveyorized processing with an abrasive spray, or chemical preparation. In general, the thickness of the material and registration requirements should be considered when choosing the best method of debur and surface preparation.

• Desmear is typically not required of drilled holes in RO4003C double-sided boards as the high glass transition temperature of the resin system (>280°C/ >536°F) minimizes the occurrence of smear. RO4003C multi-layer boards may require desmear depending upon the needs of the bondply or prepreg layers. If desmear is required, a single or double pass through alkaline permanganate or a CF4/O2 plasma process may be used.

• We recommend against etchback of the RO4003C laminate layers as this might result in aggressive etchback of resin near copper layers and loosening of filler particles on the hole wall.

Metal Deposition

• RO4003C materials do not require special treatments prior to metallization and are compatible with electroless copper processing and direct deposition of ionic and colloidal conductive layers. A copper flash plate (0.00025”) prior to imaging might be considered for RO4003C boards with high aspect ratio holes.

COPPER PLATING & OUTER-LAYER PROCESSING

• RO4003C laminates are compatible with panel and pattern processing using standard acid copper and electrolytic tin or tin/lead plating. Once plated, RO4003C laminates can be processed through any standard strip/etch/strip (SES) process.

• The post-etch surface of RO4003C laminates should be preserved as this surface will bond very well with direct screened and photo-imageable solder masks.

Final Metal Finishes

• RO4003C laminates are compatible with organic solderability preservatives (OSP’s), hot air solder levelling (HASL), and most chemically deposited or electroplated finishes.

FINAL CIRCUITIZATION

• Circuits made using RO4003C laminates can be“individualized”by dicing, sawing, shearing, routing or punching. V-scoring and breakaway tabs can be used to facilitate individualization of RO4003C circuits after automated assembly.

ROUTING

• RO4003C laminates are routed using carbide tools and conditions that are typical to processing traditional epoxy/glass materials. Copper should be etched away from the routing path to prevent burring.

MAXIMUM STACK HEIGHT

• The maximum stack height for RO4003C routing should be based on 70% of the actual flute length to allow for debris removal.

Example:

• Flute Length: 0.300”x 0.70 = 0.210”(5.33 mm)
• Backer Penetration:–0.030”(0.762mm)
• Max. Stack Height: 0.180”(4.572mm)

TOOL TYPE

• Carbide multi-fluted spiral chip breakers or diamond cut router bits.

ROUTING CONDITIONS

• Surface speeds below 500 SFM should be used whenever possible to maximize tool life when routing RO4003C. Tool life is generally greater than 30 linear feet when routing RO4003C at the maximum allowable stack height.
• Chip Load: 0.0010-0.0015”(0.0254-0.0381mm)/rev
• Surface Speed: 300 SFM

QUICK REFERENCE TABLE

Tool DiameterSpindle SpeedLateral Feed Rate

SHELF LIFE

• RO4003C as Rogers’High Frequency laminate can be stored for extended durations under ambient room temperatures (55-85°F, 13-30°C) and humidity levels. At room temperature, the dielectric materials of RO4003C are inert to high humidity. However, copper claddings of RO4003C can be oxidized during exposure to high humidity. (Oxidation on the copper surface can easily be removed in a standard micro-etch process.) In addition, over an extended period (>5 years) the exposed dielectric along edges of RO4003C panel may experience detectable levels of oxidation. Accounting for standard tooling hole and trim loss, such trace levels of oxidation would not be expected to extend into the utilized portion of the RO4003C laminate.

• Prolonged exposure in an oxidative environment may cause changes to the dielectric properties of RO4003C hydrocarbon based materials. The rate of change increases at higher temperatures and is highly dependent on the RO4003C circuit design. Although RO4003C has been used successfully in innumerable applications and reports of oxidation resulting in performance problems are extremely rare, it is recommended that the customer evaluate RO4003C material and design combination to determine fitness for use over the entire life of the end product.

• The information in this data sheet is intended to assist in designing with RO4003C circuit materials. The user should determine the suitability of RO4003C for each application.
• RO4003C is a trademark of Rogers Corporation or one of its subsidiaries ©2021 Rogers Corporation, Printed in U.S.A. All rights reserved.