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Whether for prototype verification, small‑batch testing, or volume production, this TLX‑7 2‑layer 30mil immersion gold PCB provides stable, high‑quality performance for mission‑critical microwave and RF applications.
Item NO.:
BIC-508-v593.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Taconic TLX-7 2-layer 30mil 0.762mm Immersion Gold Custom PCB No Solder Mask
This high-performance 2-layer rigid printed circuit board is built on Taconic TLX-7 high-frequency laminate, precisely engineered for RF, microwave, and millimeter-wave applications where signal integrity, electrical stability, and mechanical reliability are mission-critical.ThisTaconic high frequencyPCB delivers consistent performance across temperature and frequency ranges. It supports compact, high-density RF layouts while maintaining low signal loss and stable dielectric properties ideal for professional communication, radar, and test equipment. With immersion gold surface finishing and full electrical testing, this board ensures long-term reliability, excellent solderability, and stable performance in demanding operating environments.
PCB Construction Details
The following table summarizes the key mechanical, electrical, and manufacturing specifications that define the board’s build quality and precision.
|
Item |
Specification |
|
Board Dimensions |
102mm × 86mm (1 piece), tolerance ±0.15mm |
|
Minimum Trace / Space |
4/6 mils |
|
Minimum Hole Size |
0.5mm |
|
Blind Vias |
Not applicable |
|
Finished Board Thickness |
0.8mm |
|
Finished Copper Weight (Outer Layers) |
1oz (1.4 mils) |
|
Via Plating Thickness |
20 μm |
|
Surface Finish |
Immersion Gold |
|
Top Silkscreen |
White |
|
Bottom Silkscreen |
None |
|
Top Solder Mask |
None |
|
Bottom Solder Mask |
None |
|
PreShipment Quality Check |
100% Electrical test |
PCB Stackup
This section details the layer structure and material thickness of the 2-layer TLX-7 board for clear structural transparency.
|
Layer |
Material & Thickness |
|
Copper Layer 1 |
35 μm |
|
Taconic TLX7 Core |
0.762 mm (30mil) |
|
Copper Layer 2 |
35 μm |
PCB Statistics
Below is the layout and component‑related statistical data for design reference and assembly planning.
|
Item |
Quantity |
|
Components |
31 |
|
Total Pads |
56 |
|
ThroughHole Pads |
32 |
|
Top SMT Pads |
24 |
|
Bottom SMT Pads |
0 |
|
Vias |
29 |
|
Nets |
2 |
Substrate & Material Introduction
Key Performance Benefits
This TLX-7 Taconic PCB Laminates offers a combination of electrical and physical advantages that distinguish it from standard FR‑4 and lower‑grade microwave substrates:
1)Excellent mechanical and thermal properties: Resists warping, deformation, and fatigue under thermal cycling and mechanical stress.
2)Low and stable dielectric constant (DK): Ensures predictable impedance control and signal behavior across frequency and temperature.
3)High dimensional stability: Maintains board shape and feature accuracy during processing, assembly, and field use.
4)Low moisture absorption: Preserves electrical performance in high‑humidity environments, avoiding signal degradation or insulation issues.
5)UL 94 V‑0 flammability rating: Supports safe operation in commercial and industrial electronic systems.
6)Tightly controlled DK: Reduces variability between boards, supporting high‑volume production consistency.
7)Extremely low dissipation factor (DF): Minimizes signal attenuation, improving efficiency in transmission and reception circuits.
8)Optimized for low layer‑count microwave designs: Economical and high‑performance solution for simple but critical RF circuits.
Applications
Due to its superior high‑frequency characteristics, this TLX-7 high frequency PCB is widely used in professional and industrial fields including:
This product is available worldwide, supported by efficient quality control and logistics systems to meet global customer demand for high frequency PCBs. Whether for prototype verification, small‑batch testing, or volume production, this TLX‑7 2‑layer 30mil immersion gold PCB provides stable, high‑quality performance for mission‑critical microwave and RF applications.
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