18-Layer RO4350B Rogers 4350B PCB 3.2mm Thick ENIG Selective Hard Gold Multilayer Board

18-Layer RO4350B Rogers 4350BPCB 3.2mm Thick ENIG Selective Hard Gold Multilayer Board

Our 18-Layer RO4350B PCB is engineered for high-frequency RF/microwave applications, offering superior signal integrity, thermal stability, and durability. Designed with Rogers RO4350B laminate and RO4450F bondply, this RO4350B multilayer PCB ensures low signal loss, tight impedance control, and excellent thermal management, making it ideal for 5G infrastructure, aerospace, automotive radar, and military communications.

Featuring a 3.2mm thick multilayer PCB construction,ENIG Selective Hard Gold surface finish, this resin-filled vias PCB is built for high-reliability applications requiring exceptional electrical performance and mechanical robustness.

Key Features & Specifications

1. PCB Construction & Material Properties

2. PCB Stackup Structure

PCB Statistic

3.Advanced Material Properties: RO4350B & RO4450F

3.1 Introduction to RO4350B Core Material

Rogers 4350B materials are proprietary woven glass reinforced hydrocarbon/ceramic laminates with electrical performance close to PTFE/woven glass while offering the manufacturability of epoxy/glass. These RO4350B laminates provide tight control over dielectric constant (Dk) and maintain low loss characteristics while utilizing standard epoxy/glass processing methods.

Key advantages of RO4350B include:

• Cost-Effective RF Solution: Available at a fraction of the cost of conventional microwave laminates
• Ease of Processing: Does not require special through-hole treatments or handling procedures like PTFE-based materials
• UL 94 V-0 Rated: Suitable for active devices and high-power RF designs
• Excellent Dimensional Stability: CTE closely matches copper (X/Y: 10/12 ppm/°C), preventing warpage and misalignment
• High Tg (>280°C): Maintains stable expansion characteristics across all processing temperatures
• Reliable PTH Performance: Low Z-axis CTE (32 ppm/°C) ensures plated through-hole integrity even under thermal shock

3.2 Introduction to RO4450F Bondply

The Rogers RO4450F bondplys are specially engineered for multi-layer constructions with RO4000 series laminates. These bondplys offer:

• High Postcure Tg: Enables excellent performance in sequential lamination processes
• Multiple Lamination Cycle Capability: Fully cured RO4450F can withstand repeated lamination cycles
• FR-4 Compatibility: Allows combination with low-flow FR-4 bondply in hybrid constructions
• Superior Lateral Flow Characteristics: Provides excellent filling capability for challenging designs

3.3 Material Performance Characteristics

RO4350B Core Features:

• Dielectric Constant (Dk): 3.48±0.05 at 10GHz/23°C
• Dissipation Factor (Df): 0.0037 at 10GHz/23°C
• Thermal Conductivity: 0.69 W/m/°K
• CTE: X=10 ppm/°C, Y=12 ppm/°C, Z=32 ppm/°C
• Tg: >280°C
• Water Absorption: 0.06%

RO4450F Bondply Features:

• Dielectric Constant (Dk): 3.52±0.05 at 10GHz/23°C
• Dissipation Factor (Df): 0.004 at 10GHz/23°C
• Thermal Conductivity: 0.65 W/m/°K
• CTE: X=19 ppm/°C, Y=17 ppm/°C, Z=50 ppm/°C

Why Choose This 18-Layer RO4350B PCB?

1. Superior High-Frequency Performance

• Low-loss signal transmission for 5G, radar, and satellite communications
• Controlled impedance for high-speed digital & RF circuits

2. Robust Mechanical & Thermal Stability

• High Tg (>280°C) prevents delamination in extreme environments
• Low Z-axis CTE ensures reliable plated through-holes (PTH)
• Resin-filled vias enhance mechanical strength and thermal dissipation

3. Advanced Surface Finishes for Durability

ENIG (Electroless Nickel Immersion Gold):

• Flat surface for fine-pitch components
• Excellent solderability & corrosion resistance

Selective Hard Gold (50 µin):

• Ideal for high-wear areas (connectors, edge contacts)
• Enhanced durability for repeated insertions

4. Optimized for Complex RF & Power Applications

• Blind vias (L11-L18) for high-density interconnects
• Via-in-pad & press-fit holes for secure component mounting
• 4/4 mil trace/space for fine-line circuitry

Typical Applications

✔5G Base Stations & Antennas

✔Automotive Radar (77GHz ADAS, LiDAR)

✔Aerospace & Defense (Radar, Avionics)

✔Satellite Communications (LNB, Phased Arrays)

✔High-Power RF Amplifiers

✔Medical Imaging & Industrial Sensors

Quality Assurance & Global Availability

100% Electrical Testing before shipment

IPC-Class-2 Compliance for high-reliability standards

Worldwide Shipping with fast lead times

Conclusion

This 18-Layer RO4350B RO4450F Multilayer PCB is a high-performance solution for demanding RF, microwave, and high-power applications. With ultra-low loss, superior thermal management, and advanced surface finishes, it is the ideal choice for 5G, automotive radar, aerospace, and defense systems.

Contact us today for custom Rogers RO4350B PCB solutions tailored to your project requirements!