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The F4BM220 F4BM High frequency PCB represents a new standard in high-performance, 2-layer printed circuit boards. With its exceptional electrical characteristics, low loss, and enhanced stability, it offers unrivaled performance for a wide range of applications.
Item NO.:
BIC-325-v404.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Wangling F4BM220 DK2.2 F4B PCB 2-layer 1.575mm Thick F4BM Series High Frequency Substrate
Introduction
The F4BM220 PCB is a 2-layer printed circuit board constructed with Wangling F4BM220 material, which exhibits exceptional electrical performance and enhanced stability. With its precise control of dielectric constant and low loss characteristics, the 1.575mm F4BM220 substrate PCB allows for seamless integration into a wide range of applications, offering superior performance and reliability. It is suitable for both commercial and industrial applications that require high-frequency, high-speed, and RF/microwave capabilities
PCB Construction & Manufacturing Specifications
|
Parameter |
Specification |
|
Base Material |
F4BM220 (PTFE-based) |
|
Layer Count |
2-layer rigid PCB |
|
Board Dimensions |
130.5mm × 103mm (±0.15mm tolerance) |
|
Finished Thickness |
1.7mm (Core: 1.575mm + 2×35μm Cu) |
|
Copper Weight (Outer Layers) |
1oz (35μm) |
|
Minimum Trace/Space |
4/6 mils |
|
Minimum Hole Size |
0.3mm (mechanical drill) |
|
Via Plating Thickness |
20μm |
|
Surface Finish |
ENIG (Electroless Nickel Immersion Gold) |
|
Solder Mask & Silkscreen |
None (Bare copper with ENIG finish) |
|
Electrical Testing |
100% tested prior to shipment |
|
Quality Standard |
IPC-Class-2 |
PCB Stackup (2-Layer Design)
|
Layer |
Material |
Thickness |
Function |
|
Top Layer (L1) |
Copper |
35μm (1oz) |
Signal routing |
|
Core |
F4BM220 |
1.575mm |
Dielectric substrate |
|
Bottom Layer (L2) |
Copper |
35μm (1oz) |
Signal/Ground plane |
PCB Statistics (Component & Routing Details)
|
Parameter |
Count |
|
Total Components |
43 |
|
Total Pads |
94 |
|
Through-Hole Pads |
56 |
|
Top SMT Pads |
38 |
|
Bottom SMT Pads |
0 |
|
Vias |
51 |
|
Nets |
2 |
F4BM220 Laminate–Advanced RF Material
Introduction to F4BM220
Wangling F4BM220 is a high-performance PTFE (Polytetrafluoroethylene)-based laminate, reinforced with fiberglass cloth for enhanced dimensional stability. Compared to standard F4B220, it offers:
-Lower dielectric loss (improved signal integrity)
-Higher insulation resistance (reduced leakage currents)
-Better thermal and frequency stability
F4BM220 1.575mm Thick PCB Substrate is paired with ED (Electrodeposited) copper foil, making it suitable for general RF applications without PIM (Passive Intermodulation) requirements. For applications needing ultra-low PIM, the F4BME220 DK2.2 F4B PCB variant with RTF (Reverse-Treated Foil) copper is recommended.
Features of the F4BM220 PCB
1.Dielectric Constant (Dk):
The F4BM220 PCB exhibits a precise dielectric constant of 2.2±0.04 at 10GHz, ensuring accurate signal transmission and minimal degradation.
2.Dissipation Factor:
With a dissipation factor of .001 at 10GHz, the F4BM220 PCB minimizes signal loss and ensures high-quality performance even in high-frequency applications.
3.Coefficient of Thermal Expansion (CTE):
The F4BM220 PCB demonstrates excellent dimensional stability with a CTE x-axis of 25 ppm/°C, CTE y-axis of 34 ppm/°C, and CTE z-axis of 240 ppm/°C in the temperature range of -55°C to 288°C.
4.Thermal Coefficient of Dk:
The thermal coefficient of Dk is recorded at -142 ppm/°C for the temperature range of -55°C to 150°C, ensuring consistent signal integrity across varying operating conditions.
5.Moisture Absorption:
The F4BM220 PCB boasts a moisture absorption rate of≤0.08%, guaranteeing long-term reliability and consistent performance even in humid environments.
6.Flammability:
The F4BM220 PCB complies with UL-94 V0 flammability standards, ensuring safe and reliable operation.
Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: worldwide
Typical Applications
The F4BM220 PCB is suitable for various applications in the electronics industry, including:
- Microwave, RF, and radar systems
- Phase shifters
- Power dividers, couplers, combiners
- Feed networks
- Phase-sensitive antennas, phased array antennas
- Satellite communications
- Base station antennas
In Summary
The F4BM220 F4BM High frequency PCB represents a new standard in high-performance, 2-layer printed circuit boards. With its exceptional electrical characteristics, low loss, and enhanced stability, it offers unrivaled performance for a wide range of applications. Whether you are working on microwave systems, phase-sensitive antennas, or power dividers, the F4BM220 F4B Substrate PCB is the perfect choice to meet your project needs. Experience the reliability and superior performance of the 2-layer F4BM220 PCB for your next electronics project.
Order your F4BM220 PCB today and unlock the true potential of your electronic applications!
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