2-layer TSM-DS3 20mil 0.508mm PCB Immersion Gold Green Solder Mask White Silkscreen

2-layer TSM-DS3 20mil 0.508mm PCB Immersion Gold Green Solder Mask White Silkscreen

1. Product Overview

This 2-Layer TSM-DS3 PCB is a rigid printed circuit board featuring a Immersion Gold surface finish, built on the high-performance TSM-DS3 ceramic-filled reinforced base material. With a compact yet versatile design, strict adherence to IPC-Class-2 standards, and worldwide availability, this custom 20mil PCB is tailored for applications requiring low signal loss, high thermal conductivity, and excellent dimensional stability—even in harsh operating environments. Whether for high-frequency communication, industrial control, or high-power systems, this PCB delivers consistent performance and reliable functionality, backed by 100% electrical testing prior to shipment to ensure zero defects.

2. PCB Construction Details

The construction of this 20mil TSM-DS3 PCB is optimized for precision, durability, and performance, with every parameter carefully selected to meet industry standards and customer requirements. The following table summarizes all key construction details:

3. PCB Stackup

The 2-layer rigid stackup of this PCB is designed to maximize thermal conductivity and signal integrity, leveraging the unique properties of the TSM-DS3 PCB base material. The following table details the stackup structure from top to bottom:

4. PCB Statistics

The following table summarizes the key statistical data of the PCB, including component count, pad distribution, vias, and nets, providing insight into its design complexity and functionality:

5. Key Material: TSM-DS3

The performance of our 2-Layer PCB is largely driven by the TSM-DS3 PCB substrate—a ceramic-filled reinforced material with only ~5% fiberglass content, designed to rival traditional epoxies in fabricating large-format, complex PCBs. TSM-DS3 stands out as an industry-leading low-loss core, boasting a dissipation factor (Df) of 0.0011 at 10 GHz, ensuring minimal signal loss even in high-frequency applications. Its thermal stability is exceptional, with a thermal conductivity (TC) of 0.65 W/m*K, making it ideal for high-power applications where efficient heat dissipation from heat sources in the PCB design is critical.

Additionally, TSM-DS3 features very low coefficients of thermal expansion (CTE), enabling it to withstand demanding thermal cycling without compromising dimensional stability. This material is engineered for predictability and consistency, matching the reliability of the best fiberglass-reinforced epoxies while offering superior performance in high-stress environments.

6. Core Features

This TSM-DS3 ENIG PCB is equipped with a range of features that make it suitable for high-performance applications:

- Dielectric constant (Dk) of 3.0 with a tight tolerance of±0.05 at 10 GHz/23°C, ensuring stable signal transmission.

- Dissipation factor (Df) of 0.0014 at 10 GHz, minimizing signal attenuation and improving energy efficiency.

- High thermal conductivity (unclad) of 0.65 W/MK, facilitating effective heat dissipation in high-power scenarios.

- Low moisture absorption (0.07%), enhancing reliability in humid environments and preventing performance degradation.

- CTE matched to copper: 10 ppm/°C (X-axis), 16 ppm/°C (Y-axis), and 23 ppm/°C (Z-axis), reducing thermal stress and improving long-term durability.

7. Key Benefits

The unique combination of TSM-DS3 PCB material and precise manufacturing delivers tangible benefits for our customers:

- Low fiberglass content (~5%) reduces signal interference and improves dimensional stability compared to traditional fiberglass-reinforced epoxies.

- Dimensional stability rivals that of epoxies, enabling the fabrication of large-format, high-layer-count PCBs without warping or deformation.

- Consistent and predictable manufacturing processes ensure high yields even for complex PCB designs, reducing production costs and lead times.

- Temperature-stable Dk (±0.25% from -30 to 120°C), maintaining performance across a wide operating temperature range.

- Compatibility with resistive foils, expanding design flexibility for specialized applications.

8. Typical Applications

This 2-Layer TSM-DS3 high frequency PCB is engineered to excel in a variety of high-performance, demanding applications, including:

- Couplers: For high-frequency signal coupling with minimal loss.

- Phased Array Antennas: Delivering stable performance for radar and communication systems.

- Radar Manifolds: Withstanding high temperatures and ensuring reliable signal transmission.

- mmWave Antennas/Automotive: Supporting advanced automotive communication systems.

- Oil Drilling: Resisting harsh environmental conditions (high temperature, humidity, vibration).

- Semiconductor/ATE Testing: Providing precise and reliable performance for test equipment.

9. Additional Specifications & Availability

We supply artwork in Gerber RS-274-X format, ensuring compatibility with most PCB design software. The PCB adheres to IPC-Class-2 standards, guaranteeing high quality and reliability for commercial and industrial applications. With worldwide availability, we can deliver this product to customers across the globe, backed by our commitment to on-time delivery and exceptional customer support.

In summary, this TSM-DS3 PCB Immersion Gold finish is a high-performance, reliable solution for demanding electronic applications. Its advanced material, precise construction, and strict quality control make it a top choice for customers seeking consistency, durability, and superior signal and thermal performance.