4-Layer 60mil AD250C+TG170 FR-4 Hybrid PCB with Immersion Tin Surface Finish

4-Layer 60mil AD250C+TG170 FR-4 Hybrid PCB with Immersion Tin Surface Finish

This 4-layer rigid printed circuit board is a high-performance, application-engineered substrate solution built around Rogers AD250C high-frequency laminate, targeting wireless communication, antenna systems, and RF infrastructure applications. Combining specialized low-loss dielectric materials, tight dimensional control, and industrial-grade manufacturing compliance with IPC-Class-2 standards, this 60mil Rogers PCB delivers consistent electrical performance, mechanical reliability, and mass-production stability for mission-critical RF and microwave circuits. With a finished board thickness of 1.8mm andimmersion tin surface finishing, it supports reliable soldering, long-term shelf stability, and strong compatibility with standard SMT and through-hole assembly processes. Every board undergoes 100% electrical testing before shipment to guarantee functional integrity across global deployments.

PCB Construction Details

This section summarizes the core structural, material, and manufacturing specifications that define the 4-layer board’s physical and electrical build.

PCB Stackup

The following stackup shows the layer-by-layer dielectric and copper structure for this 4-layer high-frequency PCB.

PCB Statistics

This table provides layout-level component and interconnection statistics for design and assembly reference.

Material & Performance Overview

At the heart of this PCB is Rogers AD250C, a glass-reinforced PTFE-basedhigh-frequency laminateengineered specifically for wireless antenna and RF applications. It provides tightly controlled dielectric properties, ultra-low signal loss, and exceptional passive intermodulation (PIM) performance—critical for modern cellular, automotive, and satellite communication systems. Unlike general-purpose FR-4 materials, AD250C maintains stable electrical performance across high operating frequencies, minimizing signal attenuation, distortion, and interference in real-world deployment.

Key Features & Operational Benefits

This 4-layer AD250C PCB leverages the full potential of AD250C laminate and precision manufacturing to deliver a suite of industry-leading features and tangible benefits for wireless antenna systems.

Core Features

1)Controlled Dielectric Constant: DK 2.5±0.04 at 10GHz ensures consistent signal propagation, eliminating frequency-dependent performance variations.

2)Ultra-Low Dissipation Factor: 0.0013 at 10GHz minimizes signal loss, extending communication range and improving energy efficiency.

3)Superior Thermal Stability: High Tg >280°C and low CTE values (X-axis 47 ppm/°C, Y-axis 29 ppm/°C, Z-axis 196 ppm/°C) prevent warping and signal degradation during thermal cycling.

4)Exceptional PIM Performance: -159 dBc at 30 mil (1900 MHz) ensures minimal signal interference, critical for multi-band cellular and satellite antenna systems.

5)Robust Environmental Resistance: Low water absorption (0.04%) and UL 94 V-0 rating deliver long-term reliability in harsh outdoor and industrial environments.

Performance Benefits

This 4-layer AD250C+ TG 170 FR-4 PCB provides multiple advantages for RF and antenna designs:

1)Ultra-low loss performance: With a loss tangent below 0.002 at 10GHz, the board preserves signal integrity across typical wireless frequency bands.

2)Controlled dielectric constant: Tight Dk tolerance ensures repeatable, consistent circuit performance from board to board.

3)Superior PIM performance: Very low passive intermodulation (-159 dBc at 1900MHz for 30mil material) improves antenna sensitivity, reduces interference, and lowers yield losses associated with PIM-related failures.

4)High manufacturing stability: Excellent dimensional stability supports high-yield PCB fabrication, reliable plating, and consistent assembly results.

5)Robust reliability: High thermal resistance, low moisture absorption, and IPC-Class-2 qualification ensure long-term operational stability in field environments.

Applications

This 4-layer 60mil AD250C hybrid PCB is purpose-built for demanding wireless and RF antenna systems, including:

• Cellular infrastructure base station antennas
• Automotive telematics and connected-car antenna systems
• Commercial satellite radio and communication antennas

Other high-frequency RF subsystems requiring low loss, stable Dk, and excellent PIM performance

Quality & Availability

Manufactured in compliance with IPC-Class-2 standards and supported by Gerber RS-274‑X artwork input, this hybrid PCB ensures consistent quality and design compatibility. Full electrical testing is performed on every unit prior to delivery, minimizing field failure risks. The product is available for global distribution, supporting customers across North America, Europe, Asia, and other major electronics manufacturing regions.

Whether you are designing next-generation cellular infrastructure, automotive antenna systems, or satellite communication devices,this 4 Layer Hybrid PCB offers the performance, reliability, and scalability to bring your vision to life. Contact our technical team for customized design support, volume pricing, and lead time information to align with your project requirements.