3-layer RF Hybrid PCB 10mil 0.25mm RO3006 +TG170 FR4 Mixed Dielectric Material Board

3-layer RF Hybrid PCB 10mil 0.25mm RO3006 +TG170 FR4 Mixed Dielectric Material Board

Introducing our newly released 3-Layer RF Hybrid PCB, engineered to deliver exceptional performance in high-frequency applications. This cutting-edge printed circuit board combines the superior electrical properties of Rogers RO3006 with the mechanical stability of TG170 FR4, creating a hybrid solution that excels in both commercial microwave and RF environments. With meticulous construction and rigorous quality testing, this Hybrid PCB Board is designed to meet the demands of modern wireless communication systems, automotive radar, and satellite technology.

PCB Construction Details

The following table outlines the comprehensive construction specifications of our 3-layer Hybrid PCB:

PCB Stackup

This table presents the precise layer configuration of our 3-layer Mixed Dielectric Material Board, showcasing the strategic combination of materials:

PCB Statistics

The following table provides key statistical data regarding the PCB's component layout and connectivity features:

Material Excellence: Rogers RO3006 + TG170 FR4

At the heart of this PCB is Rogers 3006, a ceramic-filled PTFE composite engineered for commercial microwave/RF applications. Unlike traditional PTFE glass materials, RO3006 maintains a stable dielectric constant (Dk) across temperatures, eliminating disruptive step changes near room temperature. Complemented by TG170 FR4 (a high-Tg epoxy glass core), the hybrid design delivers both electrical precision and mechanical robustness.

Key Features of RO3006

• Dielectric Constant (Dk): 6.15±0.15 at 10 GHz/23°C (consistent across temperature ranges)
• Dissipation Factor: 0.002 at 10 GHz/23°C (ultra-low signal loss for RF)
• Thermal Stability: Td > 500°C (resistant to high-temperature processing)
• Thermal Conductivity: 0.79 W/mK (efficient heat dissipation)
• Moisture Absorption: 0.02% (minimal performance degradation in humid environments)
• CTE (-55 to 288°C): X/Y = 17 ppm/°C, Z = 24 ppm/°C (closely matches copper for reliability)

Benefits for RF Designers

1) Hybrid Design Flexibility: RO3006’s compatibility with TG170 FR4 enables multi-layer designs that balance high-frequency performance and cost, ideal for mixed-signal applications.

2) Temperature Resilience: Low in-plane CTE (matching copper) ensures dimensional stability in temperature-fluctuating environments (e.g., automotive radar), reducing solder joint failures in SMT assemblies.

3) Volume-Proof Economics: RO3006’s scalable manufacturing process delivers consistent quality at competitive pricing for mass production.

4) Reliable Signal Integrity: Ultra-low dissipation factor and stable Dk minimize signal attenuation, critical for high-speed RF links in satellites and cellular amplifiers.

Quality & Availability

• Artwork format: Gerber RS-274-X
• Compliance standard: IPC-Class-2
• Global availability: Shipped worldwide

Typical Applications

This Hybrid PCB Material excels in high-stakes RF environments, including:

- Automotive radar applications

- Global positioning satellite antennas

- Cellular telecommunications systems - power amplifiers and antennas

- Patch antenna for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes

Conclusion

Our 3-layer RO3006 Hybrid PCB represents the perfect fusion of advanced materials and precision manufacturing. Whether you're developing next-generation automotive radar systems or high-performance wireless infrastructure, this PCB delivers the reliability, signal integrity, and mechanical stability required for today's most demanding RF applications. Backed by rigorous quality control and global availability, it's the ideal choice for engineers seeking to push the boundaries of wireless technology.