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If you are designing systems that demand the utmost in high-frequency performance, miniaturization, and reliability, this 5.1 mil CLTE-XT board is your answer.
Item NO.:
BIC-402-v485.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers CLTE-XT PCB 2-layer 5.1mil 0.129 mm Immersion Gold 35μm Finished Copper
Introduction
Engineered with Rogers CLTE-XT laminate—an advanced composite of micro-dispersed ceramic filler, PTFE, and woven fiberglass reinforcement—our 2-layer 5.1 mil PCB redefines performance for high-end electronic systems. This laminate is specifically designed to deliver ultra-low insertion loss while maintaining industry-leading dimensional stability, building on the proven reliability of the CLTE series PCB substrate with enhanced performance consistency across wider temperature ranges. Whether for precision communication, automotive advanced systems, or radar technology, this Rogers CLTE-XT PCB is engineered to meet the most stringent requirements of modern high-frequency applications.
PCB Construction Details
Below is a comprehensive table outlining the core structural and manufacturing parameters of the PCB, ensuring clarity for design and production planning.
|
Parameter |
Specification |
|
Base Material |
Rogers CLTE-XT |
|
Layer Count |
2 |
|
Board Dimensions |
63.0 mm x 35.0 mm (1PCS) ±0.15mm |
|
Minimum Trace/Spacing |
5 mil / 6 mil |
|
Minimum Hole Size |
0.3 mm |
|
Via Type |
Through-Hole Vias Only (No Blind/Buried) |
|
Finished Board Thickness |
0.25 mm |
|
Finished Copper Weight (Outer) |
1 oz (35 μm / 1.4 mils) |
|
Via Plating Thickness |
20 μm |
|
Surface Finish |
Immersion Gold (ENIG) |
|
Solder Mask |
None (Top & Bottom) |
|
Silkscreen |
None (Top & Bottom) |
|
Electrical Test |
100% Tested |
PCB Stackup
The 2-layer rigid PCB features a precisely calibrated stackup to optimize signal integrity, detailed in the table below.
|
Layer |
Material |
Thickness |
|
Layer 1 |
Copper Foil |
35 μm (1 oz) |
|
Core |
Rogers CLTE-XT |
0.129 mm (5.1 mil) |
|
Layer 2 |
Copper Foil |
35 μm (1 oz) |
PCB Statistics
This table summarizes key assembly-related metrics, providing critical data for component integration and production efficiency.
|
Item |
Quantity |
|
Components |
6 |
|
Total Pads |
27 |
|
Thru-Hole Pads |
15 |
|
Top-Side SMT Pads |
12 |
|
Bottom-Side SMT Pads |
0 |
|
Vias |
8 |
|
Nets |
2 |
Core Performance Features
At 10GHz, 23°C, and 50% relative humidity, this CLTE-XT PCB delivers exceptional electrical performance: a dielectric constant (DK) of 2.79–2.94 with an industry-leading tight tolerance of±0.03, ensuring consistent signal propagation across batches.
The dissipation factor is an ultra-low 0.0010, minimizing circuit losses in high-frequency operations.
Physically, it boasts superior stability with X/Y-axis CTE of 12.7/13.7 ppm/°C and Z-axis CTE of 40.8 ppm/°C, while its glass transition temperature (Td) of 539°C and moisture absorption of just 0.02% guarantee reliability in extreme thermal and humid environments. Additionally, a dielectric constant temperature coefficient of -8 ppm/°C ensures performance stability as operating temperatures fluctuate.
Key Benefits
1) Enhanced Reliability: Premium via plating ensures long-term plated through-hole (PTH) integrity, reducing field failures.
2) Batch Consistency: Repeatable lot-to-lot performance simplifies mass production and quality control.
3) Balanced Performance: Low circuit losses are achieved without compromising dimensional stability, a critical advantage for high-precision designs.
4) System Compatibility: Stable dielectric constant across temperatures reduces mechanical stress when integrated with ceramic active devices, boosting overall system reliability.
Typical Applications
This CLTE-XT high frequency PCB is the ideal choice for:
Additional Information
Conclusion
This PCB is more than a component; it's a platform for innovation. If you are designing systems that demand the utmost in high-frequency performance, miniaturization, and reliability, this 5.1 mil CLTE-XT board is your answer. Contact our sales team today to discuss how this product can be integrated into your next groundbreaking project.
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3-layer RF Hybrid PCB 10mil 0.25mm RO3006 +TG170 FR4 Mixed Dielectric Material BoardIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
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