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Home Taconic PCB Board 32mil TRF-45 Taconic Substrate Double-sided PCB Immersion Gold Green Solder Mask

32mil TRF-45 Taconic Substrate Double-sided PCB Immersion Gold Green Solder Mask

This 32mil TRF-45 Immersion Gold PCB integrates Taconic's industry-leading high-frequency laminate technology with precision PCB manufacturing to deliver a reliable, high-performance solution for demanding RF and microwave applications.

  • Item NO.:

    BIC-547-v632.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


32mil TRF-45 Taconic Substrate Double-sided PCB Immersion Gold Green Solder Mask

 

PCB Product Overview

 

This is high-performance 32mil TRF-45 double-sided rigid PCB with immersion gold surface finish, engineered specifically for mission-critical radio-frequency, microwave, and high-speed digital applications. Built on Taconic's advanced TRF-45 ceramic-filled PTFE laminate, this board delivers exceptional low-loss performance, stable dielectric properties, outstanding thermal stability, and excellent dimensional control across extreme operating conditions. It is fully manufactured to IPC-Class-2 quality standards, supported by 100% electrical testing before shipment, making it a trusted solution for satellite communications, RFID systems, GPS antennas, and other high-reliability RF modules. The immersion gold surface finish ensures superior solderability, contact conductivity, corrosion resistance, and long-term durability in challenging environments. This Taconic high frequency PCB combines material excellence, precision fabrication, and strict quality assurance to satisfy the most demanding performance and reliability requirements of modern electronic systems.


32mil TRF-45 PCB Immersion Gold

 

1. PCB Construction

This section summarizes the core mechanical, electrical, and surface characteristics of the finished PCB, defining its build specifications, tolerances, and processing features.

 

Parameter

Specification

Base Material

TRF45

Layer Count

Doublesided (2layer rigid)

Board Dimensions

105mm × 76mm per piece, tolerance ±0.15mm

Minimum Trace / Space

4/6 mils

Minimum Hole Size

0.25mm

Blind Vias

None

Finished Board Thickness

0.9mm

Finished Copper Weight

1oz (1.4 mils) on outer layers

Via Plating Thickness

20μm

Surface Finish

Immersion Gold (ENIG)

Top Silkscreen

White

Bottom Silkscreen

None

Top Solder Mask

Green

Bottom Solder Mask

None

PreShipment Quality

100% full electrical test

 

 

2. PCB Stackup

The stackup defines the layer structure and thickness distribution, balancing mechanical rigidity, signal integrity, and thermal performance.

 

Layer

Material & Thickness

Copper Layer 1

35μm (1oz electrodeposited copper)

Dielectric Core

TRF45, 0.813mm (32mil)

Copper Layer 2

35μm (1oz electrodeposited copper)

 

 

3. PCB Layout Statistics

This table provides key design and assembly statistics, supporting component mounting, routing efficiency, and production verification.

 

Item

Quantity

Components

42

Total Pads

38

ThroughHole Pads

25

Top SMT Pads

13

Bottom SMT Pads

0

Vias

15

Nets

2

 

 

4. Design, Quality, and Supply Conditions


  • Artwork Format: Gerber RS-274-X
  • Quality Standard: IPC-Class-2
  • Global Availability: Worldwide shipping supported


 

 

TRF-45 Laminate Material Knowledge Base

 

This section provides a detailed technical introduction to Taconic TRF-45 laminate, the core dielectric used in the above 32mil TRF-45 PCB. It includes material properties, typical values, copper foil options, thickness availability, and application guidance.

 

1. Basic Introduction to TRF-45 CCL

TRF-45 is a next-generation high-performance copper clad laminate developed by Taconic Advanced Dielectric Division, designed specifically for low-loss, thermally stable RF and microwave applications. It is a woven-glass reinforced, ceramic-filled PTFE composite that integrates advanced ceramic filling technology with robust fiberglass reinforcement to achieve an optimal balance of electrical performance, mechanical strength, thermal stability, and manufacturability. Unlike standard PTFE materials, Taconic TRF-45 offers greatly improved dimensional stability and controlled Z-axis expansion, making it highly reliable under soldering and extreme thermal cycling conditions. It supports conventional PCB fabrication processes including shearing, drilling, plating, and etching, enabling broad adoption in professional RF manufacturing.


Taconic TRF-45 laminate

 

2. Core Performance Parameters of TRF-45 CCL


Property

Test Method

Unit

TRF-45 Typical Value

Dielectric Constant (Dk) @10GHz

IPC-TM-650 2.5.5.6

4.5±0.15

Dissipation Factor (Df) @10GHz

IPC-TM-650 2.5.5.5.1(m)

0.0035

Moisture Absorption

IPC-TM-650 2.6.2.1

%

0.06

Surface Resistivity

IPC-TM-650 2.5.17.1

3.0×10⁷

Volume Resistivity

IPC-TM-650 2.5.17.1

MΩ·cm

8.0×10⁷

Flexural Strength (Lengthwise)

IPC-TM-650 2.4.4

N/mm²

177

Flexural Strength (Crosswise)

IPC-TM-650 2.4.4

N/mm²

103

Peel Strength

IPC-TM-650 2.4.8

N/mm

1.4

Thermal Conductivity

ASTM F433

W/m·K

0.43

CTE (Xaxis, 50–150°C)

ASTM D3386 (TMA)

ppm/°C

9

CTE (Yaxis, 50–150°C)

ASTM D3386 (TMA)

ppm/°C

9

CTE (Zaxis, 50–150°C)

ASTM D3386 (TMA)

ppm/°C

40

Flammability

UL 94

V-0

 

 

3. Key Material Advantages

 

1)Ultra-low loss: Df = 0.0035 @10GHz supports long-distance, high-frequency signal transmission with minimal attenuation.

 

2)Stable dielectric properties: Dk remains tightly controlled across temperature and frequency, ensuring consistent impedance and circuit performance.

 

3)Excellent thermal stability: Low and consistent Z-axis expansion reduces stress on vias and conductors during thermal shock.

 

4)High dimensional stability: Woven glass reinforcement minimizes warpage and twist, supporting fine-line and high-precision fabrication.

 

5)Low moisture absorption: Only 0.06% moisture uptake preserves electrical stability in high-humidity environments.

 

6)Good thermal conductivity: Efficient heat dissipation improves reliability for power RF circuits.


7)UL 94 V-0 flammability: Meets strict safety requirements for industrial, automotive, and aerospace use.

 

8)Compatibility with standard processes: Supports drilling, plating, and etching using standard PTFE PCB manufacturing methods.

 

 

4.Typical Thicknesses Available

TRF-45 substrate is supplied in various dielectric thicknesses, with standard tolerances according to IPC-4103/Class B for thicknesses≥64mils.

 

Inch

mm

0.008

0.2

0.016

0.41

0.024

0.61

0.032

0.81

0.04

1.02

0.064

1.63

0.12

3.05

 

 

5.Copper Foil Options

TRF-45 is cladded with electrodeposited (ED) copper foils having different profiles. The choice of foil affects insertion loss and peel strength.

 

Designation

Copper Weight

Thickness

Treatment Type

CLH

½ oz

~18μm

Reverse treated ED

CL1

1 oz

~35μm

Reverse treated ED

CVH (CH)

½ oz

~18μm

Very low profile ED

CV1 (C1)

1 oz

~35μm

Very low profile ED

C2

2 oz

~70μm

Electrodeposited

 

 

6. Typical Applications of TRF-45 CCL

TRF-45 CCL is widely used in high-performance RF and microwave components:


  • Satellite communication antennas and feed networks
  • RFID reader and active antenna systems
  • GPS and GNSS antenna modules
  • Automotive radar and sensor boards
  • Aerospace and military RF assemblies
  • High-speed digital and microwave test boards
  • Base station filters, couplers, and power dividers


 

 

7.Processing Guidelines

 

1)TRF-45 can be drilled, routed, and plated using conventional methods for woven-glass PTFE materials. Key considerations:

 

2)Use carbide drills with high chip-load to avoid smearing.

 

3)Plasma or chemical etch treatment is recommended before electroless copper deposition to improve adhesion.

 

4)Solder mask adhesion may require a sodium naphthalate or plasma etch pre-treatment.

 

5)Reflow soldering is compatible with the material's low Z-axis CTE (40ppm/°C), reducing via barrel cracking risk.

 

 

Conclusion

This 32mil TRF-45 Immersion Gold PCB integrates Taconic's industry-leading high-frequency laminate technology with precision PCB manufacturing to deliver a reliable, high-performance solution for demanding RF and microwave applications. With strict adherence to IPC-Class-2, full electrical testing, stable material properties, and optimized structural design, this board ensures consistent signal integrity, thermal stability, and long-term durability. The accompanying detailed TRF-45 CCL knowledge base provides engineers with full transparency of material behavior, processing compatibility, and performance limits to support accurate design, simulation, and qualification.

 

For further information or to request a quotation, please contact our technical sales team.

 

 







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