20mil AGC RF-30A 2-Layer High Frequency ENIG Finish Custom PCB

20mil AGC RF-30A 2-Layer High Frequency ENIG Finish Custom PCB

PCB productOverview

This high-performance 2-layer rigid printed circuit board is purpose-built for demanding radio-frequency, microwave, 5G/6G communication, radar, and aerospace applications. Built on AGC's advanced RF-30A organic-ceramic laminate with 20mil dielectric thickness and finished with Electroless Nickel Immersion Gold (ENIG), this AGC PCB delivers exceptional high-frequency signal integrity, low insertion loss, stable electrical performance across wide bandwidths, and robust reliability under lead-free assembly and harsh environmental conditions. Every unit undergoes 100% electrical testing before shipment to ensure compliance with IPC-Class-2 standards and consistent functional performance. This AGC RF-30A PCB combines optimized structural design, precision manufacturing, and industry-leading substrate material to serve high-volume commercial RF systems while maintaining cost-effectiveness and manufacturing scalability.

1. PCB Construction Overview

The following table summarizes the core mechanical, structural, and surface-processing parameters of this 20mil RF-30A PCB, defining its physical form, fabrication limits, and cosmetic specifications.

2. PCB Stackup Structure

This table presents the symmetrical layer stackup, which ensures balanced thermal and mechanical behavior and stable impedance for high-frequency transmission lines.

3. PCB Circuit & Layout Statistics

This table provides key layout and interconnection statistics, supporting assembly planning, impedance control, and manufacturing yield analysis.

Performance Features and Applications

The combination of RF-30A high frequency laminate and ENIG finish yields measurable benefits:

1)Low & Stable Dielectric Constant (Dk): 3.0±0.05 at 10 GHz–minimal phase shift over temperature and frequency.

2)Low Dissipation Factor (Df): 0.003 at 10 GHz–reduces insertion loss and heating in high-power RF chains.

3)Excellent PIM Performance: Measured below -160 dBc (20W per channel, 800/1800 MHz)–critical for multi-carrier communication systems.

4)High Thermal Reliability: T260 >90 min, T288 >30 min–supports lead-free assembly and repeated rework.

5)Low Moisture Absorption: 0.08%–preserves Dk/Df in humid environments (e.g., outdoor base stations).

6)Matched CTE to Copper: X: 9-11 ppm/°C, Y: 11-13 ppm/°C–minimizes copper trace stress during thermal cycling.

Typical applications include:

-5G/6G base stations and antennas

-Radar systems (phased array, automotive)

-Satellite communication equipment

-RF modules and transceivers (PA, LNA)

-Aerospace and defense electronics

-High-frequency test instruments

-Automotive V2X and radar components

Manufacturing readiness: The design complies with IPC-Class-2, allowing for cost-effective production while maintaining reliable field performance. 100% electrical testing guarantees continuity and isolation before shipment.

RF-30A CCL Laminate Knowledge Base

*The following section provides an independent, detailed technical reference for AGC RF-30A the core material used in the above 20mil AGC PCB. It includes key benefits, a comprehensive properties table, thickness/panel options, and design guidelines.*

1. Overview and Benefits

RF-30A is an organic-ceramic laminate from AGC family of high-performanceRF substrates. It combines woven glass reinforcement with a proprietary ceramic-filled resin system–bridging the gap between conventional FR-4 (lossy at RF) and pure PTFE (expensive, difficult to process).RF-30A substrate is optimized for low-cost, high-volume commercial microwave and radio frequency applications.

Key Benefits

• Excellent PIM values in PCBs (< -160 dBc typical)
• Improved PTH reliability (low Z-axis CTE)
• Stable mechanical properties (high rigidity, low warp)
• Stable electrical properties from DC to 10+ GHz
• Low moisture absorption (0.08%)–minimizes phase shift
• Excellent peel strength (≥9 lbs/inch for 1 oz ED copper)
• Outstanding price/performance ratio

2. Detailed Properties Table

*All values are typical based on AGC datasheets (IPC-TM-650 test methods). For critical specifications, please contact AGC directly.*

3. Typical Thicknesses and Panel Sizes

RF-30A PCB material is available in a range of standard thicknesses and sheet sizes. Custom thicknesses in 0.010" (0.25 mm) increments can be quoted.

RF-30A PCB substrate is produced in standard thickness increments of 0.010 inch (0.250 mm), supporting flexible PCB stack-up design.

4. Design and Fabrication Guidance

1)Impedance control: Use Dk = 3.0 at your operating frequency (10 GHz recommended). For microstrip, adjust trace width accordingly.

2)PTH reliability: The low Z-axis CTE (60 ppm/°C) allows standard FR-4 drilling and plating parameters. No special desmear needed.

3)Solder assembly: Compatible with lead-free reflow (peak 260°C). The ENIG finish (if specified) provides excellent solder wetting.

4)PIM-sensitive designs: Use very low profile copper and avoid abrupt impedance changes. Ground vias spacing≤ λ/10 at highest frequency.

5)Storage: Keep in original moisture barrier bag. Shelf life 12 months at <30°C / <60% RH.

5.Material Image Reference (RF-30A CCL)

6. Summary of RF-30A CCL Value

RF-30A represents AGC's advanced material solution for cost-sensitive, high-volume RF applications that do not compromise on electrical performance. By integrating ceramic fillers for stable dielectric behavior and low loss with woven glass for mechanical strength, it achieves an exceptional price/performance ratio. Its stable PIM, low moisture absorption, controlled CTE, and compatibility with standard PCB manufacturing processes make it the material of choice for modern RF, microwave, and high-frequency designs that demand reliability, consistency, and scalability.