Taconic High Frequency PCB Buitl on TLX-8 62mil
1.575mm with OSP for Directional Couplers
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
TLX offers reliability in a wide range of RF
applications. This material is versatile due to its 2.45 - 2.65 DK range and
available thicknesses and copper cladding. It is suitable for low layer count
microwave designs.
TLX is a workhorse in the RF microwave
substrate world where the fiberglass offers mechanical reinforcement wherever a
substrate experiences severe environments such as: resistance to creep for PCBs
bolted to a housing that encounter high levels of vibration during space
launch, high temperature exposure in engine modules, radiation resistance in
space, antenna for warships that undergo extreme environments at sea and a
substrate for altimeters that see a wide range of temperatures during flight.
There're TLX-0 (dk2.45), TLX-9 (dk2.50), TLX-8
(dk2.55), TLX-7 (dk2.60) and TLX-6 (dk2.65) in the TLX family. Dielectric
thickness of TLX-0 ranges from 0.127mm to 6.35mm (5mil-250mil), TLX-9 ranges
from 0.05mm to 6.35mm (2mil - 250mil), TLX-8 ranges from 0.064mm to 6.35mm
(2.5mil to 250mil), TLX-7 ranges from 0.089mm to 6.35mm (3.5mil - 250mil),
TLX-6 ranges from 0.089mm to 6.35mm (3.5mil to 250mil).
Benefits:
Excellent mechanical & thermal properties
Low & stable DK
Dimensionally stable
Low moisture absorption
UL 94 V-O rating
Tightly controlled DK
Low DF
For low layer count microwave designs
Applications:
Antennas
Couplers, Splitters, Combiners,
Amplifiers, Mixers, Filters
Passive components
PCB Specifications:
|
PCB SIZE
|
99 x 88mm=1PCS
|
|
BOARD TYPE
|
Double
sided PCB
|
|
Number
of Layers
|
2 layers
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
NO
|
|
LAYER STACKUP
|
copper
------- 35um(1 oz)+plate TOP layer
|
|
TLX-8 1.575mm
|
|
copper ------- 35um(1oz) + plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
15
mil / 10 mil
|
|
Minimum
/ Maximum Holes:
|
0.5mm/2.0mm
|
|
Number
of Different Holes:
|
N/A
|
|
Number
of Drill Holes:
|
N/A
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
0
|
|
Impedance
Control:
|
no
|
|
Number
of Gold finger:
|
0
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
TLX-8
1.575mm
|
|
Final
foil external:
|
1
oz
|
|
Final
foil internal:
|
N/A
|
|
Final
height of PCB:
|
1.6
mm ±10%
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
OSP
|
|
Solder
Mask Apply To:
|
N/A
|
|
Solder
Mask Color:
|
N/A
|
|
Solder
Mask Type:
|
N/A
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
N/A
|
|
Colour
of Component Legend
|
N/A
|
|
Manufacturer
Name or Logo:
|
N/A
|
|
VIA
|
N/A
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
|
|
Board
plating:
|
0.0029"
|
|
Drill
tolerance:
|
0.002"
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Data Sheet of TLX-8:
|
TLX-8
TYPICAL VALUES
|
|
Property
|
Test Method
|
Unit
|
Value
|
Unit
|
Value
|
|
DK @10 GHz
|
IPC-650 2.5.5.3
|
|
2.55
|
|
2.55
|
|
Df @1.9 GHz
|
IPC-650 2.5.5.5.1
|
|
0.0012
|
|
0.0012
|
|
Df @10 GHz
|
IPC-650 2.5.5.5.1
|
|
0.0017
|
|
0.0017
|
|
Dielectric
Breakdown
|
IPC-650 2.5.6
|
kV
|
>45
|
kV
|
>45
|
|
Moisture
Absorption
|
IPC-650 2.6.2.1
|
%
|
0.02
|
%
|
0.02
|
|
Flexural
Strength(MD)
|
ASTM D 709
|
psi
|
28,900
|
N/mm2
|
|
|
Flexural
Strength(CD)
|
ASTM D 709
|
psi
|
20,600
|
N/mm2
|
|
|
Tensile
Strength(MD)
|
ASTM D 902
|
psi
|
35,600
|
N/mm2
|
|
|
Tensile
Strength(CD)
|
ASTM D 902
|
psi
|
27,500
|
N/mm2
|
|
|
Elongation at
Break(MD)
|
ASTM D 902
|
%
|
3.94
|
%
|
3.94
|
|
Elongation at
Break(CD)
|
ASTM D 902
|
%
|
3.92
|
%
|
3.92
|
|
Young's
Modulus(MD)
|
ASTM D 902
|
kpsi
|
980
|
N/mm2
|
|
|
Young's
Modulus(CD)
|
ASTM D 902
|
kpsi
|
1,200
|
N/mm2
|
|
|
Young's
Modulus(MD)
|
ASTM D 3039
|
kpsi
|
1,630
|
N/mm2
|
|
|
Poisson's
Ratio
|
ASTM D 3039
|
|
0.135
|
N/mm
|
|
|
Peel
Stength(1 oz.ed)
|
IPC-650 2.4.8
Sec.5.2.2(Thermal Stress.)
|
Ibs./linear inch
|
15
|
N/mm
|
|
|
Peel
Stength(1 oz.RTF)
|
IPC-650 2.4.8
Sec.5.2.2(Thermal Stress.)
|
Ibs./linear inch
|
17
|
N/mm
|
|
|
Peel
Stength(½ oz.ed)
|
IPC-650
2.4.8.3(Elevated Temp.)
|
Ibs./linear inch
|
14
|
N/mm
|
|
|
Peel
Stength(½ oz.ed)
|
IPC-650 2.4.8
Sec.5.2.2(Thermal Stress.)
|
Ibs./linear inch
|
11
|
N/mm
|
|
|
Peel
Stength(1 oz.rolled)
|
IPC-650 2.4.8
Sec.5.2.2(Thermal Stress.)
|
Ibs./linear inch
|
13
|
N/mm
|
2.1
|
|
Thermal
Conductivity
|
ASTM F433/ASTM
1530-06
|
W/M*K
|
0.19
|
W/M*K
|
0.19
|
|
Dimensional
Stability(MD)
|
IPC-650 2.4.39
Sec.5.5(After Bake.)
|
mils/in.
|
0.06
|
mm/M
|
|
|
Dimensional
Stability(CD)
|
IPC-650 2.4.39
Sec.5.4(After Bake.)
|
mils/in.
|
0.08
|
mm/M
|
|
|
Dimensional
Stability(MD)
|
IPC-650 2.4.39
Sec.5.5(Thermal Stress.)
|
mils/in.
|
0.09
|
mm/M
|
|
|
Dimensional
Stability(CD)
|
IPC-650 2.4.39
Sec.5.5(Thermal Stress.)
|
mils/in.
|
0.1
|
mm/M
|
|
|
Surface
Resistivity
|
IPC-650 2.5.17.1
Sec.5.2.1(Elevated Temp.)
|
Mohm
|
6.605 x 108
|
Mohm
|
6.605 x 108
|
|
Surface
Resistivity
|
IPC-650 2.5.17.1
Sec.5.2.1(Humidity Cond.)
|
Mohm
|
3.550 x 106
|
Mohm
|
3.550 x 106
|
|
Volume
Resistivity
|
IPC-650 2.5.17.1
Sec.5.2.1(Elevated Temp.)
|
Mohm/cm
|
1.110 x 1010
|
Mohm/cm
|
1.110 x 1010
|
|
Volume
Resistivity
|
IPC-650 2.5.17.1
Sec.5.2.1(Humidity Cond.)
|
Mohm/cm
|
1.046 x 1010
|
Mohm/cm
|
1.046 x 1010
|
|
CTE(X
axis)(25-260℃)
|
IPC-650 2.4.41/ASTM D
3386
|
ppm/℃
|
21
|
ppm/℃
|
21
|
|
CTE(Y
axis)(25-260℃)
|
IPC-650 2.4.41/ASTM D
3386
|
ppm/℃
|
23
|
ppm/℃
|
23
|
|
CTE(Z
axis)(25-260℃)
|
IPC-650 2.4.41/ASTM D
3386
|
ppm/℃
|
215
|
ppm/℃
|
215
|
|
Density(Specific
Gravity)
|
ASTM D 792
|
g/cm3
|
2.25
|
g/cm3
|
2.25
|
|
Td(2% Weight Loss)
|
IPC-650 2.4.24.6(TGA)
|
℃
|
535
|
℃
|
|
|
Td(5% Weight Loss)
|
IPC-650 2.4.24.6(TGA)
|
℃
|
553
|
℃
|
|
|
Flammability
Rating
|
UL-94
|
|
V-0
|
|
V-0
|
MANUFACTURING PROCESS:
BICHENG PCB EQUIPMENT:
BICHENG PCB CERTIFICATION:
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
