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TLX is PTFE based fiberglass laminate, it is ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices and RF components.
Item NO.:
BIC-030-v56.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaColor:
GreenShipping Port:
ShenzhenLead Time:
7-10 days
Taconic High Frequency PCB Buitl on TLX-8 62mil 1.575mm with OSP for Directional Couplers
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
TLX offers reliability in a wide range of RF applications. This material is versatile due to its 2.45 - 2.65 DK range and available thicknesses and copper cladding. It is suitable for low layer count microwave designs.
TLX is a workhorse in the RF microwave substrate world where the fiberglass offers mechanical reinforcement wherever a substrate experiences severe environments such as: resistance to creep for PCBs bolted to a housing that encounter high levels of vibration during space launch, high temperature exposure in engine modules, radiation resistance in space, antenna for warships that undergo extreme environments at sea and a substrate for altimeters that see a wide range of temperatures during flight.
There're TLX-0 (dk2.45), TLX-9 (dk2.50), TLX-8 (dk2.55), TLX-7 (dk2.60) and TLX-6 (dk2.65) in the TLX family. Dielectric thickness of TLX-0 ranges from 0.127mm to 6.35mm (5mil-250mil), TLX-9 ranges from 0.05mm to 6.35mm (2mil - 250mil), TLX-8 ranges from 0.064mm to 6.35mm (2.5mil to 250mil), TLX-7 ranges from 0.089mm to 6.35mm (3.5mil - 250mil), TLX-6 ranges from 0.089mm to 6.35mm (3.5mil to 250mil).
Benefits:
Excellent mechanical & thermal properties
Low & stable DK
Dimensionally stable
Low moisture absorption
UL 94 V-O rating
Tightly controlled DK
Low DF
For low layer count microwave designs
Applications:
Antennas
Couplers, Splitters, Combiners,
Amplifiers, Mixers, Filters
Passive components
PCB Specifications:
PCB SIZE | 99 x 88mm=1PCS |
BOARD TYPE | Double sided PCB |
Number of Layers | 2 layers |
Surface Mount Components | YES |
Through Hole Components | NO |
LAYER STACKUP | copper ------- 35um(1 oz)+plate TOP layer |
TLX-8 1.575mm | |
copper ------- 35um(1oz) + plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 15 mil / 10 mil |
Minimum / Maximum Holes: | 0.5mm/2.0mm |
Number of Different Holes: | N/A |
Number of Drill Holes: | N/A |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control: | no |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | TLX-8 1.575mm |
Final foil external: | 1 oz |
Final foil internal: | N/A |
Final height of PCB: | 1.6 mm ±10% |
PLATING AND COATING | |
Surface Finish | OSP |
Solder Mask Apply To: | N/A |
Solder Mask Color: | N/A |
Solder Mask Type: | N/A |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | N/A |
Colour of Component Legend | N/A |
Manufacturer Name or Logo: | N/A |
VIA | N/A |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" |
Board plating: | 0.0029" |
Drill tolerance: | 0.002" |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Data Sheet of TLX-8:
TLX-8 TYPICAL VALUES | |||||
Property | Test Method | Unit | Value | Unit | Value |
DK @10 GHz | IPC-650 2.5.5.3 | 2.55 | 2.55 | ||
Df @1.9 GHz | IPC-650 2.5.5.5.1 | 0.0012 | 0.0012 | ||
Df @10 GHz | IPC-650 2.5.5.5.1 | 0.0017 | 0.0017 | ||
Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
Flexural Strength(MD) | ASTM D 709 | psi | 28,900 | N/mm2 | |
Flexural Strength(CD) | ASTM D 709 | psi | 20,600 | N/mm2 | |
Tensile Strength(MD) | ASTM D 902 | psi | 35,600 | N/mm2 | |
Tensile Strength(CD) | ASTM D 902 | psi | 27,500 | N/mm2 | |
Elongation at Break(MD) | ASTM D 902 | % | 3.94 | % | 3.94 |
Elongation at Break(CD) | ASTM D 902 | % | 3.92 | % | 3.92 |
Young's Modulus(MD) | ASTM D 902 | kpsi | 980 | N/mm2 | |
Young's Modulus(CD) | ASTM D 902 | kpsi | 1,200 | N/mm2 | |
Young's Modulus(MD) | ASTM D 3039 | kpsi | 1,630 | N/mm2 | |
Poisson's Ratio | ASTM D 3039 | 0.135 | N/mm | ||
Peel Stength(1 oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 15 | N/mm | |
Peel Stength(1 oz.RTF) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 17 | N/mm | |
Peel Stength(½ oz.ed) | IPC-650 2.4.8.3(Elevated Temp.) | Ibs./linear inch | 14 | N/mm | |
Peel Stength(½ oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 11 | N/mm | |
Peel Stength(1 oz.rolled) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 13 | N/mm | 2.1 |
Thermal Conductivity | ASTM F433/ASTM 1530-06 | W/M*K | 0.19 | W/M*K | 0.19 |
Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(After Bake.) | mils/in. | 0.06 | mm/M | |
Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.4(After Bake.) | mils/in. | 0.08 | mm/M | |
Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.09 | mm/M | |
Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.1 | mm/M | |
Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm | 6.605 x 108 | Mohm | 6.605 x 108 |
Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm | 3.550 x 106 | Mohm | 3.550 x 106 |
Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm/cm | 1.110 x 1010 | Mohm/cm | 1.110 x 1010 |
Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm/cm | 1.046 x 1010 | Mohm/cm | 1.046 x 1010 |
CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 21 | ppm/℃ | 21 |
CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 23 | ppm/℃ | 23 |
CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 215 | ppm/℃ | 215 |
Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.25 | g/cm3 | 2.25 |
Td(2% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 535 | ℃ | |
Td(5% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 553 | ℃ | |
Flammability Rating | UL-94 | V-0 | V-0 |
MANUFACTURING PROCESS:
BICHENG PCB EQUIPMENT:
BICHENG PCB CERTIFICATION:
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