
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
TLX is PTFE based fiberglass laminate, it is ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices and RF components.
Item NO.:
BIC-030-v56.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaColor:
GreenShipping Port:
ShenzhenLead Time:
7-10 days
Taconic High Frequency PCB Buitl on TLX-8 62mil 1.575mm with OSP for Directional Couplers
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
TLX offers reliability in a wide range of RF applications. This material is versatile due to its 2.45 - 2.65 DK range and available thicknesses and copper cladding. It is suitable for low layer count microwave designs.
TLX is a workhorse in the RF microwave substrate world where the fiberglass offers mechanical reinforcement wherever a substrate experiences severe environments such as: resistance to creep for PCBs bolted to a housing that encounter high levels of vibration during space launch, high temperature exposure in engine modules, radiation resistance in space, antenna for warships that undergo extreme environments at sea and a substrate for altimeters that see a wide range of temperatures during flight.
There're TLX-0 (dk2.45), TLX-9 (dk2.50), TLX-8 (dk2.55), TLX-7 (dk2.60) and TLX-6 (dk2.65) in the TLX family. Dielectric thickness of TLX-0 ranges from 0.127mm to 6.35mm (5mil-250mil), TLX-9 ranges from 0.05mm to 6.35mm (2mil - 250mil), TLX-8 ranges from 0.064mm to 6.35mm (2.5mil to 250mil), TLX-7 ranges from 0.089mm to 6.35mm (3.5mil - 250mil), TLX-6 ranges from 0.089mm to 6.35mm (3.5mil to 250mil).
Benefits:
Excellent mechanical & thermal properties
Low & stable DK
Dimensionally stable
Low moisture absorption
UL 94 V-O rating
Tightly controlled DK
Low DF
For low layer count microwave designs
Applications:
Antennas
Couplers, Splitters, Combiners,
Amplifiers, Mixers, Filters
Passive components
PCB Specifications:
PCB SIZE | 99 x 88mm=1PCS |
BOARD TYPE | Double sided PCB |
Number of Layers | 2 layers |
Surface Mount Components | YES |
Through Hole Components | NO |
LAYER STACKUP | copper ------- 35um(1 oz)+plate TOP layer |
TLX-8 1.575mm | |
copper ------- 35um(1oz) + plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 15 mil / 10 mil |
Minimum / Maximum Holes: | 0.5mm/2.0mm |
Number of Different Holes: | N/A |
Number of Drill Holes: | N/A |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control: | no |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | TLX-8 1.575mm |
Final foil external: | 1 oz |
Final foil internal: | N/A |
Final height of PCB: | 1.6 mm ±10% |
PLATING AND COATING | |
Surface Finish | OSP |
Solder Mask Apply To: | N/A |
Solder Mask Color: | N/A |
Solder Mask Type: | N/A |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | N/A |
Colour of Component Legend | N/A |
Manufacturer Name or Logo: | N/A |
VIA | N/A |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" |
Board plating: | 0.0029" |
Drill tolerance: | 0.002" |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Data Sheet of TLX-8:
TLX-8 TYPICAL VALUES | |||||
Property | Test Method | Unit | Value | Unit | Value |
DK @10 GHz | IPC-650 2.5.5.3 | 2.55 | 2.55 | ||
Df @1.9 GHz | IPC-650 2.5.5.5.1 | 0.0012 | 0.0012 | ||
Df @10 GHz | IPC-650 2.5.5.5.1 | 0.0017 | 0.0017 | ||
Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
Flexural Strength(MD) | ASTM D 709 | psi | 28,900 | N/mm2 | |
Flexural Strength(CD) | ASTM D 709 | psi | 20,600 | N/mm2 | |
Tensile Strength(MD) | ASTM D 902 | psi | 35,600 | N/mm2 | |
Tensile Strength(CD) | ASTM D 902 | psi | 27,500 | N/mm2 | |
Elongation at Break(MD) | ASTM D 902 | % | 3.94 | % | 3.94 |
Elongation at Break(CD) | ASTM D 902 | % | 3.92 | % | 3.92 |
Young's Modulus(MD) | ASTM D 902 | kpsi | 980 | N/mm2 | |
Young's Modulus(CD) | ASTM D 902 | kpsi | 1,200 | N/mm2 | |
Young's Modulus(MD) | ASTM D 3039 | kpsi | 1,630 | N/mm2 | |
Poisson's Ratio | ASTM D 3039 | 0.135 | N/mm | ||
Peel Stength(1 oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 15 | N/mm | |
Peel Stength(1 oz.RTF) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 17 | N/mm | |
Peel Stength(½ oz.ed) | IPC-650 2.4.8.3(Elevated Temp.) | Ibs./linear inch | 14 | N/mm | |
Peel Stength(½ oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 11 | N/mm | |
Peel Stength(1 oz.rolled) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 13 | N/mm | 2.1 |
Thermal Conductivity | ASTM F433/ASTM 1530-06 | W/M*K | 0.19 | W/M*K | 0.19 |
Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(After Bake.) | mils/in. | 0.06 | mm/M | |
Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.4(After Bake.) | mils/in. | 0.08 | mm/M | |
Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.09 | mm/M | |
Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.1 | mm/M | |
Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm | 6.605 x 108 | Mohm | 6.605 x 108 |
Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm | 3.550 x 106 | Mohm | 3.550 x 106 |
Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm/cm | 1.110 x 1010 | Mohm/cm | 1.110 x 1010 |
Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm/cm | 1.046 x 1010 | Mohm/cm | 1.046 x 1010 |
CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 21 | ppm/℃ | 21 |
CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 23 | ppm/℃ | 23 |
CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 215 | ppm/℃ | 215 |
Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.25 | g/cm3 | 2.25 |
Td(2% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 535 | ℃ | |
Td(5% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 553 | ℃ | |
Flammability Rating | UL-94 | V-0 | V-0 |
MANUFACTURING PROCESS:
BICHENG PCB EQUIPMENT:
BICHENG PCB CERTIFICATION:
Previous:
RF-60A 25mil (0.635mm) Taconic High Frequency PCB With Immersion Ni/AuNext:
Taconic High Frequency PCB Built on TLX-9 62mil 1.575mm With Immersion SilverIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
RO3206 50mil Rogers laminate High Frequency PCB with Immersion Gold
AD255C 60mil Rogers Material High Frequency PCB with immersion gold
RO3010 60mil Rogers 3010 Substrate High Frequency PCB with Immersion Silver
Kappa 438 PCB 60mil Rogers Material High Frequency Board Immersion Gold
RO4730G3 PCB 60mil Rogers Substrate Antenna Grade High Frequency Circuit Board
© Copyright: 2023 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported