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Home Taconic PCB Board Taconic High Frequency PCB Buitl on TLX-8 62mil 1.575mm with OSP

Taconic High Frequency PCB Buitl on TLX-8 62mil 1.575mm with OSP

TLX is PTFE based fiberglass laminate, it is ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices and RF components.



  • Item NO.:

    BIC-030-v56.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Color:

    Green
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Taconic High Frequency PCB Buitl on TLX-8 62mil 1.575mm with OSP for Directional Couplers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


TLX offers reliability in a wide range of RF applications. This material is versatile due to its 2.45 - 2.65 DK range and available thicknesses and copper cladding. It is suitable for low layer count microwave designs.


TLX is a workhorse in the RF microwave substrate world where the fiberglass offers mechanical reinforcement wherever a substrate experiences severe environments such as: resistance to creep for PCBs bolted to a housing that encounter high levels of vibration during space launch, high temperature exposure in engine modules, radiation resistance in space, antenna for warships that undergo extreme environments at sea and a substrate for altimeters that see a wide range of temperatures during flight.

 

TLX-8 PCB


There're TLX-0 (dk2.45), TLX-9 (dk2.50), TLX-8 (dk2.55), TLX-7 (dk2.60) and TLX-6 (dk2.65) in the TLX family. Dielectric thickness of TLX-0 ranges from 0.127mm to 6.35mm (5mil-250mil), TLX-9 ranges from 0.05mm to 6.35mm (2mil - 250mil), TLX-8 ranges from 0.064mm to 6.35mm (2.5mil to 250mil), TLX-7 ranges from 0.089mm to 6.35mm (3.5mil - 250mil), TLX-6 ranges from 0.089mm to 6.35mm (3.5mil to 250mil).


TLX-8 RF PCB


Benefits:


Excellent mechanical & thermal properties

Low & stable DK

Dimensionally stable

Low moisture absorption

UL 94 V-O rating

Tightly controlled DK

Low DF

For low layer count microwave designs


Applications:


Antennas

Couplers, Splitters, Combiners,

Amplifiers, Mixers, Filters

Passive components


PCB Specifications:


PCB SIZE 99 x 88mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(1 oz)+plate TOP layer
TLX-8 1.575mm
copper ------- 35um(1oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space: 15 mil / 10 mil
Minimum / Maximum Holes: 0.5mm/2.0mm
Number of Different Holes: N/A
Number of Drill Holes: N/A
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy:  TLX-8 1.575mm
Final foil external:  1 oz
Final foil internal:  N/A
Final height of PCB:  1.6 mm ±10%
PLATING AND COATING
Surface Finish OSP
Solder Mask Apply To:  N/A
Solder Mask Color:  N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA N/A
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


Data Sheet of TLX-8:


TLX-8 TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK @10 GHz IPC-650 2.5.5.3 2.55 2.55
Df @1.9 GHz IPC-650 2.5.5.5.1 0.0012 0.0012
Df @10 GHz IPC-650 2.5.5.5.1 0.0017 0.0017
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Flexural Strength(MD) ASTM D 709 psi 28,900 N/mm2
Flexural Strength(CD) ASTM D 709 psi 20,600 N/mm2
Tensile Strength(MD) ASTM D 902 psi 35,600 N/mm2
Tensile Strength(CD) ASTM D 902 psi 27,500 N/mm2
Elongation at Break(MD) ASTM D 902 % 3.94 % 3.94
Elongation at Break(CD) ASTM D 902 % 3.92 % 3.92
Young's Modulus(MD) ASTM D 902 kpsi 980 N/mm2
Young's Modulus(CD) ASTM D 902 kpsi 1,200 N/mm2
Young's Modulus(MD) ASTM D 3039 kpsi 1,630 N/mm2
Poisson's Ratio ASTM D 3039 0.135 N/mm
Peel Stength(1 oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 15 N/mm
Peel Stength(1 oz.RTF) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 17 N/mm
Peel Stength(½ oz.ed) IPC-650 2.4.8.3(Elevated Temp.) Ibs./linear inch 14 N/mm
Peel Stength(½ oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 11 N/mm
Peel Stength(1 oz.rolled) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 13 N/mm 2.1
Thermal Conductivity ASTM F433/ASTM 1530-06 W/M*K 0.19 W/M*K 0.19
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(After Bake.) mils/in. 0.06 mm/M
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.4(After Bake.) mils/in. 0.08 mm/M
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.09 mm/M
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.1 mm/M
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm 6.605 x 108 Mohm 6.605 x 108
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm 3.550 x 106 Mohm 3.550 x 106
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm/cm 1.110 x 1010 Mohm/cm 1.110 x 1010
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm/cm 1.046 x 1010 Mohm/cm 1.046 x 1010
CTE(X axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 21 ppm/℃ 21
CTE(Y axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 23 ppm/℃ 23
CTE(Z axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 215 ppm/℃ 215
Density(Specific Gravity) ASTM D 792 g/cm3 2.25 g/cm3 2.25
Td(2% Weight Loss) IPC-650 2.4.24.6(TGA) 535
Td(5% Weight Loss) IPC-650 2.4.24.6(TGA) 553
Flammability Rating UL-94 V-0 V-0



MANUFACTURING PROCESS:


PCB MANUFACTURING PROCESS


BICHENG PCB EQUIPMENT:


BICHENG PCB EQUIPMENT


BICHENG PCB CERTIFICATION:


BICHENG PCB CERTIFICATION


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