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This 4 Layer Hybrid PCB represents a smart, engineered choice for advanced electronic systems.
Item NO.:
BIC-449-v534.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
4-layer Hybrid PCB 0.508mm RO4350B+ TG170FR4 0.98mm ENIG Mixed Dielectric Board
Designed for demanding high-frequency and precision electronic systems, our 4-Layer Hybrid PCB integrates Rogers RO4350B’s exceptional RF performance with TG170 FR-4’s cost-effectiveness, delivering a balanced solution for critical applications. With a finished thickness of 0.98mm, ENIG surface finish, and strict adherence to IPC-Class-2 standards, this Mixed Dielectric Board combines reliability, manufacturability, and electrical excellence—ideal for scenarios requiring stable signal transmission and thermal resilience.
PCB Construction Details
Below is a comprehensive breakdown of the mixed FR-4 +Rogers PCB’s construction parameters, reflecting rigorous manufacturing controls and adherence to industry standards:
|
Parameter |
Specification |
|
Base Material |
RO4350B + TG170 FR-4 |
|
Layer Count |
4-layer rigid PCB |
|
Board Dimensions |
80.22mm x 90mm (1PCS), ±0.15mm tolerance |
|
Minimum Trace/Space |
4/6 mils |
|
Minimum Hole Size |
0.3mm |
|
Blind/Buried Vias |
None |
|
Finished Board Thickness |
0.98mm |
|
Finished Cu Weight |
Inner layer: 0.5oz (0.7 mils); Outer layers: 1oz |
|
Via Plating Thickness |
20 μm |
|
Surface Finish |
Immersion Gold (ENIG) |
|
Top Silkscreen |
White |
|
Bottom Silkscreen |
White |
|
Top Solder Mask |
Green |
|
Bottom Solder Mask |
Green |
|
Quality Control |
100% Electrical test prior to shipment |
PCB Stackup
The carefully designed stackup balances electrical performance and mechanical strength, ensuring efficient signal propagation and thermal management:
|
Layer |
Material/Component |
Thickness |
|
Copper Layer 1 (Outer) |
Copper |
35 μm (1oz) |
|
Core Layer |
Rogers RO4350B |
0.508mm (20mil) |
|
Copper Layer 2 (Inner) |
Copper |
18 μm (0.5oz) |
|
Prepreg Layer |
FR-4 Prepreg |
0.2mm |
|
Copper Layer 3 (Inner) |
Copper |
18 μm (0.5oz) |
|
Core Layer |
TG170 FR-4 |
0.102mm (4mil) |
|
Copper Layer 4 (Outer) |
Copper |
35 μm (1oz) |
PCB Statistics
Key layout metrics highlight the hybrid circuit board PCB’s optimized component integration and connectivity:
|
Category |
Value |
|
Total Components |
26 |
|
Total Pads |
59 |
|
Thru Hole Pads |
37 |
|
Top SMT Pads |
22 |
|
Bottom SMT Pads |
0 |
|
Vias |
125 |
|
Nets |
10 |
Why Rogers RO4350B?
RO4350B PCB is a proprietary woven glass-reinforced hydrocarbon/ceramic laminate. Its primary advantage lies in offering electrical performance nearing that of costly PTFE-based materials while maintaining the familiar, reliable processing techniques of standard FR-4. This eliminates the need for special via treatments or handling procedures, drastically simplifying fabrication and reducing cost.
Key material properties that benefit your design include:
1) Stable Electrical Performance: Tightly controlled Dk of 3.48±0.05 and a very low loss tangent (Df) of 0.0037 at 10 GHz ensure predictable, high-performance signal propagation.
2) Exceptional Thermal & Dimensional Stability: A high Tg >280°C and a CTE closely matched to copper result in outstanding dimensional stability during thermal cycles. This is crucial for reliable plated through-holes (PTH) and the integrity of multi-layer constructions, especially in applications involving thermal shock.
3) Proven Reliability: Features like low water absorption (0.06%) and a UL 94 V-0 flammability rating contribute to long-term reliability in harsh environments.
Full Product Specifications & Benefits:
Key Benefits:
1) Optimized Cost-Performance Ratio: The hybrid design delivers RF performance where needed without the expense of a full Rogers board.
2) FR-4 Compatibility: Processes using standard epoxy/glass PCB methods, ensuring wider fabricator availability and faster turnaround.
3) Superior Reliability: Excellent PTH reliability and dimensional stability under thermal stress.
4) Design Flexibility: Ideal for complex multi-layer board (MLB) constructions requiring mixed dielectrics.
Typical Applications:
This Hybrid PCB Board is ideally suited for:
Cellular Base Station Antennas and Power Amplifiers
Automotive Radar Systems (e.g., ADAS) and Sensors
RF Identification (RFID) Tags and Readers
Low-Noise Block Downconverters (LNB) for Satellite Communication
High-Frequency Test Equipment and Prototyping
In summary, this 4 Layer RO3350B Hybrid PCB represents a smart, engineered choice for advanced electronic systems. It provides the radio frequency prowess required for cutting-edge applications through its strategic use ofRogers4350B, while its robust FR-4 foundation ensures manufacturability, mechanical strength, and cost control. We are confident it offers the perfect foundation for your next high-performance product.
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RO4350B PCB 2-Layer 60mil 1.524mm Rogers 4350B Immersion Silver Blue Solder MaskNext:
F4BM220 PCB 2-layer F4B DK2.2 0.5mm Thick Immersion Gold Wangling Bare Copper BoardIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
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