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Home Newly Shipped RF PCB 4-layer Hybrid PCB 0.508mm RO4350B+ TG170 FR4 0.98mm ENIG Mixed Dielectric Board

4-layer Hybrid PCB 0.508mm RO4350B+ TG170 FR4 0.98mm ENIG Mixed Dielectric Board

This 4 Layer Hybrid PCB represents a smart, engineered choice for advanced electronic systems.

  • Item NO.:

    BIC-449-v534.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


4-layer Hybrid PCB 0.508mm RO4350B+ TG170FR4 0.98mm ENIG Mixed Dielectric Board

 

Designed for demanding high-frequency and precision electronic systems, our 4-Layer Hybrid PCB integrates Rogers RO4350B’s exceptional RF performance with TG170 FR-4’s cost-effectiveness, delivering a balanced solution for critical applications. With a finished thickness of 0.98mm, ENIG surface finish, and strict adherence to IPC-Class-2 standards, this Mixed Dielectric Board combines reliability, manufacturability, and electrical excellence—ideal for scenarios requiring stable signal transmission and thermal resilience.

 

PCB Construction Details

Below is a comprehensive breakdown of the mixed FR-4 +Rogers PCB’s construction parameters, reflecting rigorous manufacturing controls and adherence to industry standards:

 

Parameter

Specification

Base Material

RO4350B + TG170 FR-4

Layer Count

4-layer rigid PCB

Board Dimensions

80.22mm x 90mm (1PCS), ±0.15mm tolerance

Minimum Trace/Space

4/6 mils

Minimum Hole Size

0.3mm

Blind/Buried Vias

None

Finished Board Thickness

0.98mm

Finished Cu Weight

Inner layer: 0.5oz (0.7 mils); Outer layers: 1oz

Via Plating Thickness

20 μm

Surface Finish

Immersion Gold (ENIG)

Top Silkscreen

White

Bottom Silkscreen

White

Top Solder Mask

Green

Bottom Solder Mask

Green

Quality Control

100% Electrical test prior to shipment

 

 

PCB Stackup

The carefully designed stackup balances electrical performance and mechanical strength, ensuring efficient signal propagation and thermal management:

 

Layer

Material/Component

Thickness

Copper Layer 1 (Outer)

Copper

35 μm (1oz)

Core Layer

Rogers RO4350B

0.508mm (20mil)

Copper Layer 2 (Inner)

Copper

18 μm (0.5oz)

Prepreg Layer

FR-4 Prepreg

0.2mm

Copper Layer 3 (Inner)

Copper

18 μm (0.5oz)

Core Layer

TG170 FR-4

0.102mm (4mil)

Copper Layer 4 (Outer)

Copper

35 μm (1oz)

 

 

PCB Statistics

Key layout metrics highlight the hybrid circuit board PCB’s optimized component integration and connectivity:

 

Category

Value

Total Components

26

Total Pads

59

Thru Hole Pads

37

Top SMT Pads

22

Bottom SMT Pads

0

Vias

125

Nets

10

 

 

Why Rogers RO4350B?

RO4350B PCB is a proprietary woven glass-reinforced hydrocarbon/ceramic laminate. Its primary advantage lies in offering electrical performance nearing that of costly PTFE-based materials while maintaining the familiar, reliable processing techniques of standard FR-4. This eliminates the need for special via treatments or handling procedures, drastically simplifying fabrication and reducing cost.


4-layer Hybrid PCB 0.508mm RO4350B+FR4

 

Key material properties that benefit your design include:

 

1) Stable Electrical Performance: Tightly controlled Dk of 3.48±0.05 and a very low loss tangent (Df) of 0.0037 at 10 GHz ensure predictable, high-performance signal propagation.

 

2) Exceptional Thermal & Dimensional Stability: A high Tg >280°C and a CTE closely matched to copper result in outstanding dimensional stability during thermal cycles. This is crucial for reliable plated through-holes (PTH) and the integrity of multi-layer constructions, especially in applications involving thermal shock.

 

3) Proven Reliability: Features like low water absorption (0.06%) and a UL 94 V-0 flammability rating contribute to long-term reliability in harsh environments.

 

Full Product Specifications & Benefits:


  • Artwork Format: Gerber RS-274-X
  • Quality Standard: IPC-A-600 Class 2
  • Availability: Worldwide support and shipping.


 

Key Benefits:

 

1) Optimized Cost-Performance Ratio: The hybrid design delivers RF performance where needed without the expense of a full Rogers board.

 

2) FR-4 Compatibility: Processes using standard epoxy/glass PCB methods, ensuring wider fabricator availability and faster turnaround.

 

3) Superior Reliability: Excellent PTH reliability and dimensional stability under thermal stress.

 

4) Design Flexibility: Ideal for complex multi-layer board (MLB) constructions requiring mixed dielectrics.

 

Typical Applications:

This Hybrid PCB Board is ideally suited for:

 

Cellular Base Station Antennas and Power Amplifiers

Automotive Radar Systems (e.g., ADAS) and Sensors

RF Identification (RFID) Tags and Readers

Low-Noise Block Downconverters (LNB) for Satellite Communication

High-Frequency Test Equipment and Prototyping

 

In summary, this 4 Layer RO3350B Hybrid PCB represents a smart, engineered choice for advanced electronic systems. It provides the radio frequency prowess required for cutting-edge applications through its strategic use ofRogers4350B, while its robust FR-4 foundation ensures manufacturability, mechanical strength, and cost control. We are confident it offers the perfect foundation for your next high-performance product.

 






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