F4BM220 PCB 2-layer F4B DK2.2 0.5mm Thick Immersion Gold Wangling Bare Copper Board

F4BM220 PCB 2-layer F4B DK2.20.5mm Thick Immersion Gold Wangling Bare Copper Board

Introducing the F4BM220 2-Layer Immersion Gold PCB—engineered to deliver exceptional reliability and signal integrity for high-frequency, mission-critical applications. Built with Wangling’s advanced F4BM220 laminate, this double-sided F4B PCB combines precision manufacturing, premium materials, and optimized design to meet the rigorous demands of RF, microwave, and aerospace systems. Below is a comprehensive overview of its technical specifications, structural advantages, and application capabilities, tailored for engineers and buyers seeking a top-tier, globally available solution.

PCB Construction Details

A complete breakdown of the F4B DK2.2 PCB’s manufacturing and performance-critical construction parameters is provided in the table below:

PCB Stackup

The 2-layer rigid design features a streamlined stackup optimized for minimal signal loss and structural stability, detailed as follows:

PCB Statistics

Key design statistics reflecting the PCB’s efficiency in component integration and signal routing are summarized below:

Core Material: F4BM220 Advantage

At the heart of this PCB is Wangling F4BM220 laminate—scientifically formulated by pressing fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. This advanced material outperforms F4B220 withlower dielectric loss PCB, higher insulation resistance, and superior stability, serving as a direct replacement for premium foreign equivalents.

Unlike F4BME220 (paired with reverse-treated foil for PIM-sensitive applications), F4BM220 uses ED copper foil, making it ideal for scenarios without PIM requirements while maintaining precise dielectric constant control through optimized PTFE-to-fiberglass ratios. This balance ensures low loss alongside enhanced dimensional stability, reduced thermal expansion, and minimized temperature drift.

Key Performance Features

F4BM220 PTFE High Frequency PCB ‘s technical attributes define its excellence:

• Dielectric constant (Dk) of 2.2±0.04 at 10GHz for consistent signal propagation
• Ultra-low dissipation factor of 0.001 at 10GHz, minimizing signal attenuation
• Superior thermal stability: CTE of 25 ppm/°C (x-axis), 34 ppm/°C (y-axis), 240 ppm/°C (z-axis) across -55°C to 288°C
• Thermal coefficient of Dk at -142 ppm/°C (-55°C to 150°C) for reliable performance under temperature fluctuations
• Moisture absorption≤0.08% and UL-94 V0 flammability rating for harsh environment resilience

Typical Applications

This F4B High Frequency PCB is purpose-built for critical systems including:

• Microwave, RF, and radar systems
• Phase shifters and power dividers/couplers/combiners
• Feed networks and phased array antennas
• Satellite communications and base station antennas

Manufactured to IPC-Class-2 quality standards, the PCB supports Gerber RS-274-X artwork and is available for worldwide delivery. Its immersion gold finish ensures excellent solderability and corrosion resistance, while the absence of solder mask/silkscreen optimizes high-frequency performance. With 100% electrical testing and tight dimensional tolerances, it delivers consistent, reliable operation for the most demanding applications.

Whether you’re designing satellite communication systems or radar technology, this F4BM220 PTFE F4B PCB

combines material innovation and precision engineering to elevate your product’s performance. For custom modifications, volume pricing, or technical support, feel free to reach out—we’re ready to tailor solutions to your specific requirements.